BE781898A - Support de transistor - Google Patents

Support de transistor

Info

Publication number
BE781898A
BE781898A BE781898A BE781898A BE781898A BE 781898 A BE781898 A BE 781898A BE 781898 A BE781898 A BE 781898A BE 781898 A BE781898 A BE 781898A BE 781898 A BE781898 A BE 781898A
Authority
BE
Belgium
Prior art keywords
transistor support
transistor
support
Prior art date
Application number
BE781898A
Other languages
English (en)
Inventor
R M Manning
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Inc filed Critical Amp Inc
Publication of BE781898A publication Critical patent/BE781898A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
BE781898A 1971-04-12 1972-04-10 Support de transistor BE781898A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13306571A 1971-04-12 1971-04-12

Publications (1)

Publication Number Publication Date
BE781898A true BE781898A (fr) 1972-10-10

Family

ID=22456847

Family Applications (1)

Application Number Title Priority Date Filing Date
BE781898A BE781898A (fr) 1971-04-12 1972-04-10 Support de transistor

Country Status (10)

Country Link
US (1) US3735017A (fr)
BE (1) BE781898A (fr)
CA (1) CA943268A (fr)
DE (1) DE2215417A1 (fr)
ES (1) ES401656A1 (fr)
FR (1) FR2132846B1 (fr)
GB (1) GB1337692A (fr)
IT (1) IT950743B (fr)
NL (1) NL7204755A (fr)
SE (1) SE368478B (fr)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3882807A (en) * 1974-04-08 1975-05-13 Texas Instruments Inc Method of separating dual inline packages from a strip
DE2444892C3 (de) * 1974-09-19 1982-03-18 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von streifenförmigen Anschlußelementen
DE2511209C3 (de) * 1975-03-14 1980-10-02 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum Kontaktieren der Elektroden von scheibenförmigen Halbleiterkörpern und Metallstreifen zur Durchführung des Verfahrens
DE2714145C2 (de) * 1976-03-31 1985-01-10 Mitsubishi Denki K.K., Tokio/Tokyo Gestanzte Metallträgerplatte für die Herstellung von kunststoffummantelten Halbleiterbauelementen
US4158745A (en) * 1977-10-27 1979-06-19 Amp Incorporated Lead frame having integral terminal tabs
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
US4214120A (en) * 1978-10-27 1980-07-22 Western Electric Company, Inc. Electronic device package having solder leads and methods of assembling the package
US4439918A (en) * 1979-03-12 1984-04-03 Western Electric Co., Inc. Methods of packaging an electronic device
US4346396A (en) * 1979-03-12 1982-08-24 Western Electric Co., Inc. Electronic device assembly and methods of making same
US4252864A (en) * 1979-11-05 1981-02-24 Amp Incorporated Lead frame having integral terminal tabs
US4323293A (en) * 1980-06-30 1982-04-06 Bourns, Inc. Terminal lead with labyrinthine clip
US4446375A (en) * 1981-10-14 1984-05-01 General Electric Company Optocoupler having folded lead frame construction
DE3148382A1 (de) * 1981-12-07 1983-06-09 Black & Decker, Inc., 19711 Newark, Del. Elektrogeraet, insbesondere elektrowerkzeug, mit steckbaren bauteilen
US4567545A (en) * 1983-05-18 1986-01-28 Mettler Rollin W Jun Integrated circuit module and method of making same
EP0400177A1 (fr) * 1989-05-31 1990-12-05 Siemens Aktiengesellschaft La liaison d'un composant semi-conducteur avec un support métallique
EP1487761B1 (fr) * 2002-03-26 2013-12-04 Koch Agronomic Services, LLC Méthode pour la production de particules de polymère d'urée-formaldéhyde comme engrais azoté à libération contrôlée
US7622796B2 (en) * 2005-09-13 2009-11-24 Alpha And Omega Semiconductor Limited Semiconductor package having a bridged plate interconnection
US20070057368A1 (en) * 2005-09-13 2007-03-15 Yueh-Se Ho Semiconductor package having plate interconnections
US7683464B2 (en) * 2005-09-13 2010-03-23 Alpha And Omega Semiconductor Incorporated Semiconductor package having dimpled plate interconnections
US8680658B2 (en) * 2008-05-30 2014-03-25 Alpha And Omega Semiconductor Incorporated Conductive clip for semiconductor device package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2476429A (en) * 1946-08-30 1949-07-19 Aircraft Marine Prod Inc Connector for electrical conductors
US3569797A (en) * 1969-03-12 1971-03-09 Bendix Corp Semiconductor device with preassembled mounting
US3597666A (en) * 1969-11-26 1971-08-03 Fairchild Camera Instr Co Lead frame design
US3628483A (en) * 1970-03-20 1971-12-21 Amp Inc Method of making power frame for integrated circuit

Also Published As

Publication number Publication date
DE2215417A1 (de) 1972-10-26
CA943268A (en) 1974-03-05
SE368478B (fr) 1974-07-01
ES401656A1 (es) 1975-11-01
FR2132846A1 (fr) 1972-11-24
NL7204755A (fr) 1972-10-16
US3735017A (en) 1973-05-22
GB1337692A (en) 1973-11-21
IT950743B (it) 1973-06-20
FR2132846B1 (fr) 1977-12-23

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