BE801910A - Boitier pour plaquette a circuits integres - Google Patents

Boitier pour plaquette a circuits integres

Info

Publication number
BE801910A
BE801910A BE133114A BE133114A BE801910A BE 801910 A BE801910 A BE 801910A BE 133114 A BE133114 A BE 133114A BE 133114 A BE133114 A BE 133114A BE 801910 A BE801910 A BE 801910A
Authority
BE
Belgium
Prior art keywords
box
integrated circuit
circuit boards
boards
integrated
Prior art date
Application number
BE133114A
Other languages
English (en)
Inventor
R J Beall
J J Zasio
Original Assignee
Amdahl Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amdahl Corp filed Critical Amdahl Corp
Publication of BE801910A publication Critical patent/BE801910A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07355—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H10W72/3524—Eutectic alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/926—Multiple bond pads having different sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base
BE133114A 1972-07-10 1973-07-04 Boitier pour plaquette a circuits integres BE801910A (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US27044872A 1972-07-10 1972-07-10
US348239A US3872583A (en) 1972-07-10 1973-04-05 LSI chip package and method

Publications (1)

Publication Number Publication Date
BE801910A true BE801910A (fr) 1973-11-05

Family

ID=26954305

Family Applications (1)

Application Number Title Priority Date Filing Date
BE133114A BE801910A (fr) 1972-07-10 1973-07-04 Boitier pour plaquette a circuits integres

Country Status (9)

Country Link
US (1) US3872583A (fr)
AU (1) AU468119B2 (fr)
BE (1) BE801910A (fr)
CA (1) CA1001324A (fr)
CH (2) CH590558A5 (fr)
DE (1) DE2334427A1 (fr)
FR (1) FR2192376B1 (fr)
GB (2) GB1443364A (fr)
NL (1) NL7309189A (fr)

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* Cited by examiner, † Cited by third party
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GB1514595A (en) * 1975-03-03 1978-06-14 Hughes Aircraft Co Package for hermetically sealing electronic circuits
JPS5210678A (en) * 1975-07-15 1977-01-27 Kyocera Corp Ic package
JPS5756527Y2 (fr) * 1977-02-25 1982-12-04
EP0001890B1 (fr) * 1977-10-12 1981-07-22 The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and Perfectionnements aux boîtiers pour circuits intégrés à micro-ondes
DE2857170A1 (de) * 1977-11-18 1980-12-04 Fujitsu Ltd Semiconductor device
US4285002A (en) * 1978-01-19 1981-08-18 International Computers Limited Integrated circuit package
US4246697A (en) * 1978-04-06 1981-01-27 Motorola, Inc. Method of manufacturing RF power semiconductor package
JPS5612760A (en) * 1979-07-10 1981-02-07 Nec Corp Multi chip lsi package
JPS5615059U (fr) * 1979-07-11 1981-02-09
DE3030763A1 (de) * 1979-08-17 1981-03-26 Amdahl Corp., Sunnyvale, Calif. Packung fuer eine integrierte schaltung in plaettchenform
US4338621A (en) * 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
FR2476960A1 (fr) * 1980-02-26 1981-08-28 Thomson Csf Procede d'encapsulation hermetique de composants electroniques a tres haute frequence, comportant la pose de traversees metalliques, dispositif realise par un tel procede
EP0054069A1 (fr) * 1980-06-19 1982-06-23 Digital Equipment Corporation Conditionnement de circuit integre a dissipateur thermique
US4387388A (en) * 1980-07-14 1983-06-07 Ncr Corporation Package and connector receptacle
US4331831A (en) * 1980-11-28 1982-05-25 Bell Telephone Laboratories, Incorporated Package for semiconductor integrated circuits
AU87287S (en) 1982-01-14 1983-07-01 Fujitsu Ltd Integrated circuit
US4410927A (en) * 1982-01-21 1983-10-18 Olin Corporation Casing for an electrical component having improved strength and heat transfer characteristics
US4866571A (en) * 1982-06-21 1989-09-12 Olin Corporation Semiconductor package
US5014159A (en) * 1982-04-19 1991-05-07 Olin Corporation Semiconductor package
JPS58186951A (ja) * 1982-04-24 1983-11-01 Toshiba Corp 電子部品のパッケ−ジング方法
DE3382726D1 (de) * 1982-06-30 1994-01-27 Fujitsu Ltd Integrierte Halbleiterschaltungsanordnung.
US4608592A (en) * 1982-07-09 1986-08-26 Nec Corporation Semiconductor device provided with a package for a semiconductor element having a plurality of electrodes to be applied with substantially same voltage
JPS5987893A (ja) * 1982-11-12 1984-05-21 株式会社日立製作所 配線基板とその製造方法およびそれを用いた半導体装置
US4513355A (en) * 1983-06-15 1985-04-23 Motorola, Inc. Metallization and bonding means and method for VLSI packages
US4631572A (en) * 1983-09-27 1986-12-23 Trw Inc. Multiple path signal distribution to large scale integration chips
US4598308A (en) * 1984-04-02 1986-07-01 Burroughs Corporation Easily repairable, low cost, high speed electromechanical assembly of integrated circuit die
US4716124A (en) * 1984-06-04 1987-12-29 General Electric Company Tape automated manufacture of power semiconductor devices
US4680075A (en) * 1986-01-21 1987-07-14 Unisys Corporation Thermoplastic plug method of fabricating an integrated circuit package having bonding pads in a stepped cavity
US4730232A (en) * 1986-06-25 1988-03-08 Westinghouse Electric Corp. High density microelectronic packaging module for high speed chips
US4758927A (en) * 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
US5008734A (en) * 1989-12-20 1991-04-16 National Semiconductor Corporation Stadium-stepped package for an integrated circuit with air dielectric
US5371321A (en) * 1992-07-22 1994-12-06 Vlsi Technology, Inc. Package structure and method for reducing bond wire inductance
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
US5325268A (en) * 1993-01-28 1994-06-28 National Semiconductor Corporation Interconnector for a multi-chip module or package
US5465008A (en) * 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
US5736783A (en) * 1993-10-08 1998-04-07 Stratedge Corporation. High frequency microelectronics package
US6172412B1 (en) * 1993-10-08 2001-01-09 Stratedge Corporation High frequency microelectronics package
US5753972A (en) * 1993-10-08 1998-05-19 Stratedge Corporation Microelectronics package
US5508888A (en) * 1994-05-09 1996-04-16 At&T Global Information Solutions Company Electronic component lead protector
US5808875A (en) * 1996-03-29 1998-09-15 Intel Corporation Integrated circuit solder-rack interconnect module
US6301122B1 (en) 1996-06-13 2001-10-09 Matsushita Electric Industrial Co., Ltd. Radio frequency module with thermally and electrically coupled metal film on insulating substrate
CN114407513B (zh) * 2022-01-06 2023-08-01 Tcl华星光电技术有限公司 印刷网及其制备方法

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US3484534A (en) * 1966-07-29 1969-12-16 Texas Instruments Inc Multilead package for a multilead electrical device
JPS5026292Y1 (fr) * 1968-01-29 1975-08-06
US3549784A (en) * 1968-02-01 1970-12-22 American Lava Corp Ceramic-metallic composite substrate
DE1764263A1 (de) * 1968-05-06 1971-06-16 Siemens Ag Gut waermeableitendes Flachgehaeuse fuer Halbleitersysteme
US3608197A (en) * 1968-07-17 1971-09-28 David Lloyd Mcivor Carpet knife and guide
CH526203A (it) * 1968-11-06 1972-07-31 Olivetti & Co Spa Procedimento di montaggio di uno o più circuiti elettronici integrati in un contenitore
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices
JPS4810904B1 (fr) * 1969-03-12 1973-04-09
US3566959A (en) * 1969-07-17 1971-03-02 Controlled Power Corp Heat sink
DE1949731A1 (de) * 1969-10-02 1971-04-15 Bbc Brown Boveri & Cie Halbleiterelement mit kombinierten Loet-Druckkontakten
US3665592A (en) * 1970-03-18 1972-05-30 Vernitron Corp Ceramic package for an integrated circuit
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US3683241A (en) * 1971-03-08 1972-08-08 Communications Transistor Corp Radio frequency transistor package
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GB1327352A (en) * 1971-10-02 1973-08-22 Kyoto Ceramic Semiconductor device

Also Published As

Publication number Publication date
GB1443364A (en) 1976-07-21
AU468119B2 (en) 1976-01-08
DE2334427A1 (de) 1974-01-31
FR2192376A1 (fr) 1974-02-08
GB1443362A (en) 1976-07-21
CH590558A5 (fr) 1977-08-15
US3872583A (en) 1975-03-25
AU5794773A (en) 1975-01-16
CH588770A5 (fr) 1977-06-15
FR2192376B1 (fr) 1977-10-14
CA1001324A (en) 1976-12-07
NL7309189A (fr) 1974-01-14

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: AMDAHL CORPORATION

Effective date: 19860731