BE831681R - Procede de fabrication de structures en relief - Google Patents

Procede de fabrication de structures en relief

Info

Publication number
BE831681R
BE831681R BE158565A BE158565A BE831681R BE 831681 R BE831681 R BE 831681R BE 158565 A BE158565 A BE 158565A BE 158565 A BE158565 A BE 158565A BE 831681 R BE831681 R BE 831681R
Authority
BE
Belgium
Prior art keywords
relief structures
manufacturing relief
manufacturing
structures
relief
Prior art date
Application number
BE158565A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of BE831681R publication Critical patent/BE831681R/fr

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
BE158565A 1974-08-02 1975-07-24 Procede de fabrication de structures en relief BE831681R (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19742437348 DE2437348B2 (de) 1974-08-02 1974-08-02 Verfahren zur herstellung von reliefstrukturen

Publications (1)

Publication Number Publication Date
BE831681R true BE831681R (fr) 1975-11-17

Family

ID=5922319

Family Applications (1)

Application Number Title Priority Date Filing Date
BE158565A BE831681R (fr) 1974-08-02 1975-07-24 Procede de fabrication de structures en relief

Country Status (9)

Country Link
US (1) US4040831A (fr)
JP (1) JPS5541422B2 (fr)
AT (1) AT359288B (fr)
BE (1) BE831681R (fr)
DE (1) DE2437348B2 (fr)
FR (1) FR2280925A2 (fr)
GB (1) GB1512973A (fr)
IT (1) IT1049569B (fr)
NL (1) NL180144C (fr)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5952822B2 (ja) * 1978-04-14 1984-12-21 東レ株式会社 耐熱性感光材料
WO1980000706A1 (fr) * 1978-09-29 1980-04-17 Hitachi Ltd Composition polymere sensible a la lumiere
DE2919841A1 (de) * 1979-05-16 1980-11-20 Siemens Ag Verfahren zur phototechnischen herstellung von reliefstrukturen
DE2933828A1 (de) * 1979-08-21 1981-03-12 Siemens AG, 1000 Berlin und 8000 München Polyoxazol-vorstufen sowie deren herstellung.
US4329419A (en) * 1980-09-03 1982-05-11 E. I. Du Pont De Nemours And Company Polymeric heat resistant photopolymerizable composition for semiconductors and capacitors
US4369247A (en) * 1980-09-03 1983-01-18 E. I. Du Pont De Nemours And Company Process of producing relief structures using polyamide ester resins
US4414312A (en) * 1980-09-03 1983-11-08 E. I. Du Pont De Nemours & Co. Photopolymerizable polyamide ester resin compositions containing an oxygen scavenger
US4410612A (en) * 1980-09-03 1983-10-18 E. I. Du Pont De Nemours And Company Electrical device formed from polymeric heat resistant photopolymerizable composition
JPS58223149A (ja) * 1982-06-22 1983-12-24 Toray Ind Inc 感光性ポリイミド用現像液
US4579809A (en) * 1982-10-22 1986-04-01 Ciba-Geigy Corporation Positive image formation
US4548891A (en) * 1983-02-11 1985-10-22 Ciba Geigy Corporation Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators
EP0119719B1 (fr) * 1983-03-03 1987-05-06 Toray Industries, Inc. Composition de polymère sensible au rayonnement
DE3411660A1 (de) * 1984-03-29 1985-10-03 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von polyimid- und polyisoindolochinazolindion-vorstufen
DE3513779A1 (de) * 1985-04-17 1986-10-23 Merck Patent Gmbh, 6100 Darmstadt Stabilisierte loesungen strahlungsvernetzbarer polymervorstufen hochwaermebestaendiger polymere
US4741988A (en) * 1985-05-08 1988-05-03 U.S. Philips Corp. Patterned polyimide film, a photosensitive polyamide acid derivative and an electrophoretic image-display cell
EP0291779B1 (fr) * 1987-05-18 1994-07-27 Siemens Aktiengesellschaft Réserves positives résistantes à la chaleur et procédé de fabrication de structures formant réserve résistantes à la chaleur
DE3717933A1 (de) * 1987-05-27 1988-12-08 Hoechst Ag Photopolymerisierbares gemisch, dieses enthaltendes aufzeichnungsmaterial und verfahren zur herstellung von hochwaermebestaendigen reliefstrukturen
US5270431A (en) * 1987-07-23 1993-12-14 Basf Aktiengesellschaft Preparation of oligomeric or polymeric radiation-reactive intermediates for solvent-structured layers
DE3808927A1 (de) * 1988-03-17 1989-10-05 Ciba Geigy Ag Negativ-fotoresists von polyimid-typ mit 1,2-disulfonen
DE3837612A1 (de) * 1988-11-05 1990-05-23 Ciba Geigy Ag Positiv-fotoresists von polyimid-typ
US5006488A (en) * 1989-10-06 1991-04-09 International Business Machines Corporation High temperature lift-off process
DE4217688A1 (de) * 1992-05-29 1993-12-02 Basf Lacke & Farben Durch Einwirkung von Strahlung vernetzendes Gemisch und dessen Verwendung zur Herstellung hochtemperaturbeständiger Reliefstrukturen
DE4218718A1 (de) * 1992-06-06 1993-12-09 Basf Lacke & Farben Verfahren zur Herstellung strukturierter Schichten wärmebeständiger Polykondensate
US5756260A (en) * 1993-02-16 1998-05-26 Sumitomo Bakelite Company Limited Photosensitive polyimide resin composition containing a stabilizer and method for formation of relief pattern using same
KR100384746B1 (ko) * 1994-09-13 2003-08-25 제온 코포레이션 감광성 폴리이미드 수지 조성물
JP3170174B2 (ja) 1995-04-18 2001-05-28 日本ゼオン株式会社 ポリイミド系樹脂組成物
US5886136A (en) * 1995-09-12 1999-03-23 Nippon Zeon Co., Ltd. Pattern forming process
US5648451A (en) * 1995-10-10 1997-07-15 Sumitomo Bakelite Company Limited Process for producing photosensitive resin
US5856065A (en) * 1996-03-27 1999-01-05 Olin Microelectronic Chemicals, Inc. Negative working photoresist composition based on polyimide primers
WO1999013381A1 (fr) * 1997-09-11 1999-03-18 Arch Specialty Chemicals, Inc. Compositions de photoresists agissant negativement a base de precurseurs de polyimide
US6160081A (en) * 1997-10-31 2000-12-12 Nippon Zeon Co., Ltd. Photosensitive polyimide resin composition
JP4529252B2 (ja) 1999-09-28 2010-08-25 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パターンの製造法及び電子部品
US6511789B2 (en) 2000-06-26 2003-01-28 Arch Specialty Chemicals, Inc. Photosensitive polyimide precursor compositions
US6582879B2 (en) 2001-03-27 2003-06-24 Korea Research Institute Of Chemical Technology Reactive photo acid-generating agent and heat-resistant photoresist composition with polyamide precursor
KR100589067B1 (ko) * 2001-10-30 2006-06-14 가부시키가이샤 가네카 감광성 수지 조성물, 이것을 이용한 감광성 필름 및 적층체
JP4317870B2 (ja) * 2003-03-11 2009-08-19 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規な感光性樹脂組成物
WO2007034604A1 (fr) * 2005-09-22 2007-03-29 Hitachi Chemical Dupont Microsystems Ltd. Composition de résine photosensible négative, procédé de formation de motifs et composants électroniques
EP1995635A4 (fr) * 2006-03-16 2011-03-30 Asahi Glass Co Ltd Composition de résine aromatique fluorée photosensible de type négatif
WO2007148384A1 (fr) * 2006-06-20 2007-12-27 Hitachi Chemical Dupont Microsystems Ltd. Composition de résine photosensible négative, procédé de formation d'un motif imprimé et élément électronique
US8298747B2 (en) * 2007-03-12 2012-10-30 Hitachi Chemical Dupont Microsystems, Ltd. Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
KR101275474B1 (ko) * 2007-10-29 2013-06-14 히다치 가세이듀퐁 마이쿠로시스데무즈 가부시키가이샤 포지티브형 감광성 수지 조성물, 패턴의 제조방법 및 전자부품
WO2013015125A1 (fr) 2011-07-26 2013-01-31 Jnc株式会社 Encre pour jet d'encre photodurcissable et carte de circuits imprimés électronique
SG10201709161SA (en) 2013-05-17 2017-12-28 Fujifilm Electronic Mat Usa Inc Novel polymer and thermosetting composition containing same
KR102456361B1 (ko) 2017-09-11 2022-10-19 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 유전체 필름 형성 조성물
JP6926939B2 (ja) * 2017-10-23 2021-08-25 東京エレクトロン株式会社 半導体装置の製造方法
KR20220079595A (ko) 2019-10-04 2022-06-13 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 평탄화 방법 및 조성물
EP4294855A1 (fr) 2021-02-16 2023-12-27 Solvay Specialty Polymers Italy S.p.A. Polyimides ayant une faible perte diélectrique
KR20230145070A (ko) 2021-02-16 2023-10-17 솔베이 스페셜티 폴리머스 이태리 에스.피.에이. 낮은 유전 손실을 갖는 폴리이미드

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475176A (en) * 1966-09-06 1969-10-28 Eastman Kodak Co Azide sensitized photosensitive prepolymer compositions
US3650746A (en) * 1969-06-16 1972-03-21 Grace W R & Co Dual image formation on separate supports of photocurable composition
US3858510A (en) * 1971-03-11 1975-01-07 Asahi Chemical Ind Relief structures prepared from photosensitive compositions
US3801638A (en) * 1971-03-12 1974-04-02 Gaf Corp Triacrylyldiethylenetriamine,method of producing the same,and photopolymerization process and system utilizing the same
BE793732A (fr) * 1972-01-10 1973-05-02 Grace W R & Co Composition contenant un polyene et un polythiol
NL177718C (nl) * 1973-02-22 1985-11-01 Siemens Ag Werkwijze ter vervaardiging van reliefstructuren uit warmte-bestendige polymeren.
US3847767A (en) * 1973-03-13 1974-11-12 Grace W R & Co Method of producing a screen printable photocurable solder resist

Also Published As

Publication number Publication date
FR2280925A2 (fr) 1976-02-27
NL7509204A (nl) 1976-02-04
DE2437348A1 (de) 1976-02-19
NL180144C (nl) 1987-01-02
FR2280925B2 (fr) 1983-03-11
ATA450775A (de) 1980-03-15
JPS5541422B2 (fr) 1980-10-24
GB1512973A (en) 1978-06-01
US4040831A (en) 1977-08-09
DE2437348B2 (de) 1976-10-07
NL180144B (nl) 1986-08-01
JPS5140922A (fr) 1976-04-06
AT359288B (de) 1980-10-27
IT1049569B (it) 1981-02-10

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Legal Events

Date Code Title Description
RE20 Patent expired

Owner name: SIEMENS A.G.

Effective date: 19940221