BE845108A - Produit stratifie a placage metallique et son procede de fabrication - Google Patents

Produit stratifie a placage metallique et son procede de fabrication

Info

Publication number
BE845108A
BE845108A BE169741A BE169741A BE845108A BE 845108 A BE845108 A BE 845108A BE 169741 A BE169741 A BE 169741A BE 169741 A BE169741 A BE 169741A BE 845108 A BE845108 A BE 845108A
Authority
BE
Belgium
Prior art keywords
metal
manufacturing process
laminate product
plated laminate
plated
Prior art date
Application number
BE169741A
Other languages
English (en)
Inventor
R G Sarazin
A D Wilks
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE845108A publication Critical patent/BE845108A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
    • B44C1/10—Applying flat materials, e.g. leaflets, pieces of fabrics
    • B44C1/14—Metallic leaves or foils, e.g. gold leaf
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0344—Electroless sublayer, e.g. Ni, Co, Cd or Ag; Transferred electroless sublayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
BE169741A 1974-02-08 1976-08-12 Produit stratifie a placage metallique et son procede de fabrication BE845108A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/440,915 US3984598A (en) 1974-02-08 1974-02-08 Metal-clad laminates

Publications (1)

Publication Number Publication Date
BE845108A true BE845108A (fr) 1976-12-01

Family

ID=23750713

Family Applications (1)

Application Number Title Priority Date Filing Date
BE169741A BE845108A (fr) 1974-02-08 1976-08-12 Produit stratifie a placage metallique et son procede de fabrication

Country Status (2)

Country Link
US (1) US3984598A (fr)
BE (1) BE845108A (fr)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4053370A (en) * 1975-09-18 1977-10-11 Koito Manufacturing Company Limited Process for the fabrication of printed circuits
US4050976A (en) * 1976-01-27 1977-09-27 Bofors America, Inc. Strain gage application
US4093350A (en) * 1976-05-19 1978-06-06 Xerox Corporation System for centrifugally casting a thin film plastic in a replica process for providing multi-faceted polygonal scanners
US4113576A (en) * 1976-06-17 1978-09-12 Hutkin Irving J Method of making a thin-copper foil-carrier composite
US4167240A (en) * 1977-06-27 1979-09-11 Western Electric Company, Inc. Method of treating an electroplating solution comprising ions of gold and cyanide prior to electroplating and thermocompression bonding
US4825025A (en) * 1979-03-16 1989-04-25 James River Corporation Food receptacle for microwave cooking
US4641005A (en) * 1979-03-16 1987-02-03 James River Corporation Food receptacle for microwave cooking
US4407685A (en) * 1979-07-23 1983-10-04 Ford Aerospace & Communication Corporation Metallized film transfer process
NL8000967A (nl) * 1980-02-15 1981-09-16 Leer Koninklijke Emballage Met metaal beklede samengestelde structuur alsmede werkwijze ter vervaardiging ervan.
EP0038878A1 (fr) * 1980-04-28 1981-11-04 Koninklijke Emballage Industrie Van Leer B.V. Procédé de métallisation par transfert
EP0045052B1 (fr) * 1980-07-25 1986-02-26 Nissan Motor Co., Ltd. Rotor de distributeur d'allumage à suppression d'interférence à radiofréquence
US4357395A (en) * 1980-08-22 1982-11-02 General Electric Company Transfer lamination of vapor deposited foils, method and product
US4383003A (en) * 1980-09-22 1983-05-10 General Electric Company Transfer lamination of copper thin sheets and films, method and product
US4455181A (en) * 1980-09-22 1984-06-19 General Electric Company Method of transfer lamination of copper thin sheets and films
DE3036260A1 (de) * 1980-09-26 1982-04-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Verfahren zur herstellung von elektrischen kontakten an einer silizium-solarzelle
US4431710A (en) * 1981-01-22 1984-02-14 General Electric Company Laminate product of ultra thin copper film on a flexible aluminum carrier
US4499145A (en) * 1982-04-19 1985-02-12 Sumitomo Bakelite Company Limited Metal-clad laminate and process for producing the same
US4499152A (en) * 1982-08-09 1985-02-12 General Electric Company Metal-clad laminate construction
US4427716A (en) 1983-01-21 1984-01-24 General Electric Company Method for predetermining peel strength at copper/aluminum interface
US4507349A (en) * 1983-05-16 1985-03-26 Howard A. Fromson Security medium and secure articles and methods of making same
DE3322382A1 (de) * 1983-06-22 1985-01-10 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co, 8740 Bad Neustadt Verfahren zur herstellung von gedruckten schaltungen
US4452664A (en) * 1983-08-01 1984-06-05 General Electric Company Method for predetermining peel strength at copper/aluminum interface
GB2148182B (en) * 1983-11-03 1987-02-11 Gen Electric Metal-clad laminate construction
US5049434A (en) * 1984-04-30 1991-09-17 National Starch And Chemical Investment Holding Corporation Pre-patterned device substrate device-attach adhesive transfer system
DE3515629A1 (de) * 1985-05-02 1986-11-06 Held, Kurt, 7218 Trossingen Verfahren und vorrichtung zur herstellung kupferkaschierter laminate
US4869767A (en) * 1985-05-03 1989-09-26 Hallmark Cards, Incorporated Process for placing single or multiple patterned layers of conductive material on a substrate
US4882000A (en) * 1985-05-23 1989-11-21 O. Key Printed Wiring Co., Ltc. Method of manufacturing printed circuit boards
DE3608010A1 (de) * 1986-03-11 1987-09-17 Philips Patentverwaltung Verfahren zum herstellen einer elektrisch leitenden klebverbindung
US4902546A (en) * 1986-04-16 1990-02-20 Dennison Manufacturing Company Transfer metallization laminate
US5037691A (en) * 1986-09-15 1991-08-06 Compositech, Ltd. Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
US4943334A (en) * 1986-09-15 1990-07-24 Compositech Ltd. Method for making reinforced plastic laminates for use in the production of circuit boards
JPS63103075A (ja) * 1986-10-14 1988-05-07 エドワ−ド　アドラ− マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品
FR2623023B1 (fr) * 1987-11-10 1990-02-02 Alcatel Thomson Faisceaux Procede de report de motifs en cuivre sur un support parabolique en materiau composite
CA1292934C (fr) * 1988-05-20 1991-12-10 Donald G. Beckett Materiau de rechauffement et cuisson aux micro-ondes
US4897151A (en) * 1988-07-27 1990-01-30 General Dynamics Corp., Pomona Division Method for fabricating a dichroic parabolic lens reflector
AU4905890A (en) * 1989-02-02 1990-08-09 Alcan International Limited Process for coating a packaging film with a transparent barrier coating
US5064583A (en) * 1989-08-01 1991-11-12 Zycon Corporation Method for applying mold release coating to separator plates for molding printed circuit boards
US5073456A (en) * 1989-12-05 1991-12-17 E. I. Du Pont De Nemours And Company Multilayer printed circuit board formation
US5017271A (en) * 1990-08-24 1991-05-21 Gould Inc. Method for printed circuit board pattern making using selectively etchable metal layers
US5861076A (en) * 1991-07-19 1999-01-19 Park Electrochemical Corporation Method for making multi-layer circuit boards
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
JP2721632B2 (ja) * 1992-02-25 1998-03-04 松下電工株式会社 回路板の銅回路の処理方法
US5584956A (en) * 1992-12-09 1996-12-17 University Of Iowa Research Foundation Method for producing conductive or insulating feedthroughs in a substrate
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
US5427841A (en) * 1993-03-09 1995-06-27 U.S. Philips Corporation Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure
JP2762386B2 (ja) * 1993-03-19 1998-06-04 三井金属鉱業株式会社 銅張り積層板およびプリント配線板
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
TW389780B (en) * 1995-09-13 2000-05-11 Hitachi Chemical Co Ltd Prepreg for printed circuit board
US6117300A (en) * 1996-05-01 2000-09-12 Honeywell International Inc. Method for forming conductive traces and printed circuits made thereby
AU3735797A (en) * 1996-06-26 1998-01-14 Park Electrochemical Corporation A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates
JP3697829B2 (ja) * 1997-04-09 2005-09-21 ブラザー工業株式会社 インクジェットヘッドの製造方法
US6596391B2 (en) * 1997-05-14 2003-07-22 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
US6702916B2 (en) * 1997-05-14 2004-03-09 Honeywell International Inc. Very ultra thin conductor layers for printed wiring boards
US6319620B1 (en) * 1998-01-19 2001-11-20 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6270889B1 (en) 1998-01-19 2001-08-07 Mitsui Mining & Smelting Co., Ltd. Making and using an ultra-thin copper foil
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
JP3612594B2 (ja) * 1998-05-29 2005-01-19 三井金属鉱業株式会社 樹脂付複合箔およびその製造方法並びに該複合箔を用いた多層銅張り積層板および多層プリント配線板の製造方法
EP0996318B1 (fr) * 1998-10-19 2006-04-19 Mitsui Mining & Smelting Co., Ltd. Nouvelle feuille composite, procédé de sa production et laminé revêtu de cuivre
SG101924A1 (en) * 1998-10-19 2004-02-27 Mitsui Mining & Smelting Co Composite material used in making printed wiring boards
US6372364B1 (en) 1999-08-18 2002-04-16 Microcoating Technologies, Inc. Nanostructure coatings
US6447929B1 (en) 2000-08-29 2002-09-10 Gould Electronics Inc. Thin copper on usable carrier and method of forming same
US6696141B2 (en) * 2001-02-20 2004-02-24 Richard A. Lolley Through-wall copper flashings
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
US6770976B2 (en) 2002-02-13 2004-08-03 Nikko Materials Usa, Inc. Process for manufacturing copper foil on a metal carrier substrate
US20050112344A1 (en) * 2003-08-20 2005-05-26 Redfern Sean M. Apparatus and method for use in printed circuit board drilling applications
EP2191701B1 (fr) 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Feuille d'entrée, son procédé de fabrication et procédés de perçage de trous dans des cartes à circuit imprimé
JP5358740B1 (ja) * 2012-10-26 2013-12-04 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、プリント回路板、及び、プリント配線板の製造方法
US9630385B2 (en) 2012-11-08 2017-04-25 Toray Plastics (America), Inc. Releasable polyester metal transfer film
US10099462B2 (en) * 2013-06-28 2018-10-16 Toray Plastics (America), Inc. Releasable polyester high gloss metal transfer film
CN104249463A (zh) * 2013-06-26 2014-12-31 康准电子科技（昆山）有限公司 模内装饰成型方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2666008A (en) * 1950-08-03 1954-01-12 Stromberg Carlson Co Methods and apparatus for making conductive patterns of predetermined configuration
US2874085A (en) * 1953-10-27 1959-02-17 Northern Engraving & Mfg Co Method of making printed circuits
GB872929A (en) * 1957-07-25 1961-07-12 Union Carbide Corp Amino alkyl silicon compounds as bonding agents for polymeric coatings to metals
US3220897A (en) * 1961-02-13 1965-11-30 Esther S Conley Conducting element and method
US3235395A (en) * 1962-03-27 1966-02-15 Walter G Scharf Transfers for metallic coatings
US3324014A (en) * 1962-12-03 1967-06-06 United Carr Inc Method for making flush metallic patterns
US3340121A (en) * 1963-12-20 1967-09-05 Carl F Lawrenz Method of applying decorative coatings to metal parts
US3393117A (en) * 1964-02-13 1968-07-16 Cincinnati Milling Machine Co Copper-clad glass reinforced thermoset resin panel
US3434889A (en) * 1965-12-27 1969-03-25 Budd Co Copper foil surface treatment
US3532587A (en) * 1966-08-04 1970-10-06 Esso Research & Chem Co Press plate
US3506507A (en) * 1967-11-22 1970-04-14 Northern Engraving Co Method of making a metal foil pattern by etching
US3644166A (en) * 1968-03-28 1972-02-22 Westinghouse Electric Corp Oxide-free multilayer copper clad laminate
JPS4839832B1 (fr) * 1970-08-10 1973-11-27
FR2135471B1 (fr) * 1971-05-04 1973-05-11 Cellophane Sa

Also Published As

Publication number Publication date
US3984598A (en) 1976-10-05

Similar Documents

Publication Publication Date Title
BE837201A (fr) Procede de production de polyol
FR2282382A1 (fr) Emballage et son procede de fabrication
FR2290491A1 (fr) Predetachant de blanchissage et procede de production
BE857176Q (fr) Circuit d'irrigation et son procede de production
FR2330538A1 (fr) Stratifie decoratif et son procede de fabrication
FR2279574A1 (fr) Pneumatique a carcasse radiale et son procede de fabrication
LU80357A1 (fr) Produit panifie et son procede de fabrication
BE836878A (fr) Catheter et son procede de fabrication
BE779652A (fr) Produit de confiserie et son procede de fabrication
FR2285243A1 (fr) Structure de matiere plastique et son procede de production
BE830956R (fr) Articles de rembourrage perfectionnes et leur procede de fabrication
GB1405536A (en) Chlorothiazoles and a process for their production
FR2279341A1 (fr) Produit alimentaire proteique et procede de fabrication
FR2290304A1 (fr) Stratifie decoratif et son procede de realisation
BE831914A (fr) Procede de fabrication de cetones
FR2277805A1 (fr) Procede de production de polyols
BE836396A (fr) Materiau a structure cellulaire et son procede de fabrication
BE852548A (fr) Produit a poils fabrique par moulage et son procede de fabrication
FR2287110A2 (fr) Element supraconducteur et son procede de production
BE844497A (fr) Produit de revetement de sol et son procede de fabrication
FR2287461A1 (fr) Procede de fabrication de polyetherpolyols
BE824736A (fr) Procede de production de rutile synthetique
BE822716A (fr) Ecrou a autoblocage et son procede de production
BE824681A (fr) Procede de fabrication de 7-amino-cephemes
BE835413A (fr) Procede de fabrication de nitronaphtalenes