BE866001A - Plaquette a circuit imprime comportant au moins deux couches de cablage - Google Patents

Plaquette a circuit imprime comportant au moins deux couches de cablage

Info

Publication number: BE866001A
Authority: BE; Belgium
Prior art keywords: wiring; layers; circuit board; printed circuit; printed
Prior art date: 1977-04-14

Application number

BE186806A

Other languages

English (en)

Original Assignee

Siemens Ag

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1977-04-14

Filing date

1978-04-14

Publication date

1978-07-31

1978-04-14 Application filed by Siemens Ag filed Critical Siemens Ag

1978-07-31 Publication of BE866001A publication Critical patent/BE866001A/fr

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/033—Punching metal foil, e.g. solder foil
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Combinations Of Printed Boards (AREA)

BE186806A 1977-04-14 1978-04-14 Plaquette a circuit imprime comportant au moins deux couches de cablage BE866001A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE19772716545 DE2716545A1 (de)	1977-04-14	1977-04-14	Gedruckte schaltungsplatte mit mindestens zwei verdrahtungslagen

Publications (1)

Publication Number	Publication Date
BE866001A true BE866001A (fr)	1978-07-31

Family

ID=6006294

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BE186806A BE866001A (fr)	1977-04-14	1978-04-14	Plaquette a circuit imprime comportant au moins deux couches de cablage

Country Status (9)

Country	Link
JP (1)	JPS53128765A (fr)
BE (1)	BE866001A (fr)
CH (1)	CH628195A5 (fr)
DE (1)	DE2716545A1 (fr)
FR (1)	FR2387568A1 (fr)
GB (1)	GB1577713A (fr)
IT (1)	IT1096057B (fr)
NL (1)	NL7803993A (fr)
SE (1)	SE7804192L (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS5797970U (fr) *	1980-12-08	1982-06-16
EP0062084A1 (fr) *	1981-04-06	1982-10-13	Herbert Irwin Schachter	Circuit à plusieurs couches et méthode pour fabriquer ce circuit
JPS60137092A (ja) *	1983-12-19	1985-07-20	株式会社東芝	回路基板の製造方法
JPS60140897A (ja) *	1983-12-28	1985-07-25	日本電気株式会社	樹脂絶縁多層基板
US4915983A (en) *	1985-06-10	1990-04-10	The Foxboro Company	Multilayer circuit board fabrication process
DE3688255T2 (de) *	1986-12-17	1993-07-22	Foxboro Co	Verfahren zur herstellung von mehrschichtleiterplatten.
AT398876B (de) *	1991-10-31	1995-02-27	Philips Nv	Zwei- oder mehrlagige leiterplatte
DE4135839A1 (de) *	1991-10-31	1993-05-06	Huels Troisdorf Ag, 5210 Troisdorf, De	Verfahren zur herstellung einer mehrlagigen gedruckten schaltung sowie mehrlagige gedruckte schaltung
AT398877B (de) *	1991-10-31	1995-02-27	Philips Nv	Zwei- oder mehrlagige leiterplatte, verfahren zum herstellen einer solchen leiterplatte und laminat für die herstellung einer solchen leiterplatte nach einem solchen verfahren
EP0744884A3 (fr) *	1995-05-23	1997-09-24	Hitachi Chemical Co Ltd	Procédé de fabrication d'un panneau à circuit imprimé multicouche

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3528173A (en) *	1966-08-15	1970-09-15	Andrew S Gall	Making circuit boards

1977
- 1977-04-14 DE DE19772716545 patent/DE2716545A1/de not_active Ceased
1978
- 1978-02-28 CH CH213678A patent/CH628195A5/de not_active IP Right Cessation
- 1978-04-04 FR FR7809924A patent/FR2387568A1/fr active Granted
- 1978-04-10 IT IT22145/78A patent/IT1096057B/it active
- 1978-04-13 SE SE7804192A patent/SE7804192L/xx unknown
- 1978-04-13 JP JP4375778A patent/JPS53128765A/ja active Pending
- 1978-04-13 GB GB14471/78A patent/GB1577713A/en not_active Expired
- 1978-04-14 BE BE186806A patent/BE866001A/fr unknown
- 1978-04-14 NL NL7803993A patent/NL7803993A/xx not_active Application Discontinuation

Also Published As

Publication number	Publication date
FR2387568A1 (fr)	1978-11-10
IT7822145A0 (it)	1978-04-10
CH628195A5 (en)	1982-02-15
SE7804192L (sv)	1978-10-15
NL7803993A (nl)	1978-10-17
JPS53128765A (en)	1978-11-10
DE2716545A1 (de)	1978-10-19
GB1577713A (en)	1980-10-29
IT1096057B (it)	1985-08-17
FR2387568B1 (fr)	1982-06-04

Publication	Publication Date	Title
JPS5439873A (en)	1979-03-27	Incombustible ypet flexible printed wiring board
GB2006534B (en)	1982-03-10	Multi-layer flexible printed circuit board assembly
BE866001A (fr)	1978-07-31	Plaquette a circuit imprime comportant au moins deux couches de cablage
IT1107298B (it)	1985-11-25	Circuito stampato multistrato
GB2000912B (en)	1982-01-06	Mounting of a switch element on a board
JPS5378050A (en)	1978-07-11	Multilayer resistance circuit board
GB2030006B (en)	1982-06-23	Printed circuit board with increased arc track resistance
JPS53132772A (en)	1978-11-18	Multilayer printed circuit board
JPS53141468A (en)	1978-12-09	Multilayer printed board
JPS53117741A (en)	1978-10-14	Multilayer circuit board
JPS538771A (en)	1978-01-26	Multilayer printed board
JPS5392465A (en)	1978-08-14	Electronic circuit element board
JPS5443568A (en)	1979-04-06	Multilayer printed board
JPS5436576A (en)	1979-03-17	Laminated board for printed wiring circuit with resistance body
JPS5365974A (en)	1978-06-12	Circuit device having printed wiring board provided with parts
JPS53122765A (en)	1978-10-26	Multilayer printed circuit board
JPS5415170A (en)	1979-02-03	Wiring board structure
JPS53123872A (en)	1978-10-28	Multilayer circuit board connecting structure
JPS51150066A (en)	1976-12-23	Multilayered printed wiring board
JPS5312082A (en)	1978-02-03	Multilayer printed board
JPS5321772A (en)	1978-02-28	Multilayer printed board
JPS5480563A (en)	1979-06-27	Flexible circuit board with resistance
JPS52125778A (en)	1977-10-21	Printed wiring circuit board
SU669499A1 (ru)	1979-06-25	Монтажна печатна плата
JPS52100169A (en)	1977-08-22	Multilayer printed circuit board