BE902496A - IMPROVEMENTS TO WELDING APPARATUS AND METHODS, ESPECIALLY FOR PRINTED CIRCUITS. - Google Patents

IMPROVEMENTS TO WELDING APPARATUS AND METHODS, ESPECIALLY FOR PRINTED CIRCUITS.

Info

Publication number
BE902496A
BE902496A BE0/215068A BE215068A BE902496A BE 902496 A BE902496 A BE 902496A BE 0/215068 A BE0/215068 A BE 0/215068A BE 215068 A BE215068 A BE 215068A BE 902496 A BE902496 A BE 902496A
Authority
BE
Belgium
Prior art keywords
chamber
methods
product
welding apparatus
printed circuits
Prior art date
Application number
BE0/215068A
Other languages
French (fr)
Inventor
D J Spigarelli
D J Peck
J L Finney
Original Assignee
Htc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Htc Corp filed Critical Htc Corp
Publication of BE902496A publication Critical patent/BE902496A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

Cet appareil comprend une enceinte (10) délimitant une chambre pour phase vapeur, des moyens (12,14) permettant de fournir une vapeur inerte saturée dans cette chambre, à une température permettant de chauffer un produit (27) avant l'application de soudure, et des moyens (22) permettant de transporter ce produit jusque dans ladite chambre et hors de celle-ci. L'appareil est caractérisé en ce qu'il comprend en outre une source de soudure (30), au moins une buse de soudage (24, 26) qui est reliée à cette source (30), et disposée à l'intérieur de ladite chambre et sert à diriger un jet de soudure (32,34) qui est disposée dans ladite chambre et sert à diriger sur le produit un jet du liquide de la phase vapeur.This device comprises an enclosure (10) delimiting a chamber for the vapor phase, means (12, 14) making it possible to supply an inert saturated vapor in this chamber, at a temperature making it possible to heat a product (27) before the application of solder , and means (22) for transporting this product into and out of said chamber. The apparatus is characterized in that it further comprises a welding source (30), at least one welding nozzle (24, 26) which is connected to this source (30), and disposed inside said chamber and serves to direct a jet of solder (32, 34) which is arranged in said chamber and serves to direct a jet of the vapor phase liquid onto the product.

BE0/215068A 1984-05-25 1985-05-24 IMPROVEMENTS TO WELDING APPARATUS AND METHODS, ESPECIALLY FOR PRINTED CIRCUITS. BE902496A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US61427284A 1984-05-25 1984-05-25

Publications (1)

Publication Number Publication Date
BE902496A true BE902496A (en) 1985-09-16

Family

ID=24460541

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/215068A BE902496A (en) 1984-05-25 1985-05-24 IMPROVEMENTS TO WELDING APPARATUS AND METHODS, ESPECIALLY FOR PRINTED CIRCUITS.

Country Status (8)

Country Link
JP (1) JPS60257971A (en)
KR (1) KR850008604A (en)
BE (1) BE902496A (en)
CA (1) CA1241237A (en)
DE (1) DE3518405A1 (en)
FR (1) FR2564764B1 (en)
GB (1) GB2159084B (en)
SG (1) SG83390G (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4664308A (en) * 1985-10-30 1987-05-12 Hollis Automation, Inc. Mass soldering system providing an oscillating air blast
DE3840098C1 (en) * 1988-11-28 1989-12-21 Helmut Walter 8900 Augsburg De Leicht
DE4103098C1 (en) * 1991-02-01 1992-06-25 Helmut Walter 8901 Koenigsbrunn De Leicht
GB9109899D0 (en) * 1991-05-08 1991-07-03 Lymn Peter P A Solder leveller
DE4342633A1 (en) * 1993-12-14 1995-06-22 Helmut Walter Leicht Device for removing unwanted solder from the item to be soldered in a soldering system
DE19525116A1 (en) * 1995-06-30 1997-01-09 Siemens Ag Removal device for circuit board surface-mounted components - provides heating of circuit board for softening solder connections with component removed by pressurised air stream
DE102006044045A1 (en) * 2006-09-20 2008-03-27 Linde Ag Soldering process and apparatus for vapor phase soldering
KR101414421B1 (en) * 2013-02-18 2014-07-04 송진헌 Apparatus and method for surface treatment of printed circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3724418A (en) * 1971-08-20 1973-04-03 Lain J Mc Solder coating apparatus
US4389797A (en) * 1981-06-23 1983-06-28 The Htc Corporation Continuous vapor processing system

Also Published As

Publication number Publication date
KR850008604A (en) 1985-12-18
FR2564764A1 (en) 1985-11-29
DE3518405A1 (en) 1985-11-28
JPS60257971A (en) 1985-12-19
CA1241237A (en) 1988-08-30
GB2159084B (en) 1987-11-04
GB8512983D0 (en) 1985-06-26
GB2159084A (en) 1985-11-27
SG83390G (en) 1990-11-23
FR2564764B1 (en) 1991-02-22

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: EMHART INC.

Effective date: 19940531