BE903242A - Procede d'encapsulage d'elements semi-conducteurs montes sur un ruban porteur - Google Patents
Procede d'encapsulage d'elements semi-conducteurs montes sur un ruban porteurInfo
- Publication number
- BE903242A BE903242A BE0/215586A BE215586A BE903242A BE 903242 A BE903242 A BE 903242A BE 0/215586 A BE0/215586 A BE 0/215586A BE 215586 A BE215586 A BE 215586A BE 903242 A BE903242 A BE 903242A
- Authority
- BE
- Belgium
- Prior art keywords
- layer
- carrier tape
- semiconductor elements
- elements mounted
- cup
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Une pellicule (8) revetue d'une couche de ciment recoit la forme d'une cupule du coté intérieur de laquelle se trouve la couche de ciment. Le fond de la cupule est couvert d'une couche de moulage, par exemple de polymère, et on place la cupule dans le trou d'un ruban porteur, avec ses bords s'étendant au-dessus des bords du trou, et on met l'élément semi-conducteur en contact avec la couche de moulage. On couvre l'autre face de l'élément d'une couche protectrice s'étendant au-delà des bords de l'élément (1) et venant en contact avec la couche de moulage avant le traitement thermique final.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FI843631A FI76220C (fi) | 1984-09-17 | 1984-09-17 | Foerfarande foer inkapsling av pao ett baerarband anordnade halvledarkomponenter. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE903242A true BE903242A (fr) | 1986-01-16 |
Family
ID=8519611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE0/215586A BE903242A (fr) | 1984-09-17 | 1985-09-16 | Procede d'encapsulage d'elements semi-conducteurs montes sur un ruban porteur |
Country Status (8)
| Country | Link |
|---|---|
| BE (1) | BE903242A (fr) |
| CA (1) | CA1232372A (fr) |
| CH (1) | CH669477A5 (fr) |
| DE (1) | DE3533159A1 (fr) |
| FI (1) | FI76220C (fr) |
| FR (1) | FR2570544B1 (fr) |
| GB (1) | GB2164794B (fr) |
| SE (1) | SE8504295L (fr) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
| GB2202372B (en) * | 1984-07-05 | 1991-02-13 | Nat Semiconductor Corp | Pre-testable semiconductor die package and fabrication method |
| FR2598258B1 (fr) * | 1986-04-30 | 1988-10-07 | Aix Les Bains Composants | Procede d'encapsulation de circuits integres. |
| DE3623419A1 (de) * | 1986-07-11 | 1988-01-21 | Junghans Uhren Gmbh | Verfahren zum bestuecken eines leiterbahnen-netzwerkes fuer den schaltungstraeger eines elektromechanischen uhrwerks und teilbestuecktes leiterbahnen-netzwerk eines uhrwerks-schaltungstraegers |
| JPH02155256A (ja) * | 1988-12-08 | 1990-06-14 | Mitsubishi Electric Corp | 半導体装置 |
| JP2751450B2 (ja) * | 1989-08-28 | 1998-05-18 | セイコーエプソン株式会社 | テープキャリアの実装構造及びその実装方法 |
| US5156983A (en) * | 1989-10-26 | 1992-10-20 | Digtial Equipment Corporation | Method of manufacturing tape automated bonding semiconductor package |
| IT1243817B (it) * | 1990-10-09 | 1994-06-28 | Sgs Thomson Microelectronics | Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato |
| KR930010072B1 (ko) * | 1990-10-13 | 1993-10-14 | 금성일렉트론 주식회사 | Ccd패키지 및 그 제조방법 |
| JP2531382B2 (ja) * | 1994-05-26 | 1996-09-04 | 日本電気株式会社 | ボ―ルグリッドアレイ半導体装置およびその製造方法 |
| AT402617B (de) * | 1995-07-11 | 1997-07-25 | Datacon Schweitzer & Zeindl Gm | Anlage zum automatisierten, hermetischen anlage zum automatisierten, hermetischen verschliessen von gehäusen verschliessen von gehäusen |
| DE19650318C2 (de) * | 1996-09-23 | 1999-05-06 | Tech Gmbh Antriebstechnik Und | Gehäuse aus Metallblech für eine Schaltung der Leistungselektronik |
| DE10117797C2 (de) * | 2001-04-10 | 2003-04-17 | Bosch Gmbh Robert | Montagevorrichtung und Verfahren zum Aufbau eines elektronischen Bauteils |
| US6692610B2 (en) * | 2001-07-26 | 2004-02-17 | Osram Opto Semiconductors Gmbh | Oled packaging |
| DE10151657C1 (de) * | 2001-08-02 | 2003-02-06 | Fraunhofer Ges Forschung | Verfahren zur Montage eines Chips auf einem Substrat |
| TW582078B (en) * | 2002-11-29 | 2004-04-01 | Chipmos Technologies Bermuda | Packaging process for improving effective die-bonding area |
| FR2919756B1 (fr) * | 2007-07-31 | 2009-11-20 | Tacchini Ets | Procede de protection d'un composant electronique. |
| DE102013016697B4 (de) | 2013-08-19 | 2023-12-21 | Oechsler Aktiengesellschaft | Oberflächenmontiertes Bauelement und Verwendung davon |
| CN113602557B (zh) * | 2021-08-04 | 2022-09-09 | 深圳市辉悦科技有限公司 | 具有定位二次修正功能的芯片编带机 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3979659A (en) * | 1975-01-30 | 1976-09-07 | Texas Instruments Incorporated | Automotive alternator rectifier bridges |
| US4300153A (en) * | 1977-09-22 | 1981-11-10 | Sharp Kabushiki Kaisha | Flat shaped semiconductor encapsulation |
| US4330790A (en) * | 1980-03-24 | 1982-05-18 | National Semiconductor Corporation | Tape operated semiconductor device packaging |
| FR2520541A1 (fr) * | 1982-01-22 | 1983-07-29 | Flonic Sa | Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede |
| FI72409C (fi) * | 1984-03-09 | 1987-05-11 | Lohja Ab Oy | Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter. |
-
1984
- 1984-09-17 FI FI843631A patent/FI76220C/fi not_active IP Right Cessation
-
1985
- 1985-09-06 GB GB08522166A patent/GB2164794B/en not_active Expired
- 1985-09-16 FR FR858513669A patent/FR2570544B1/fr not_active Expired - Fee Related
- 1985-09-16 CH CH4004/85A patent/CH669477A5/de not_active IP Right Cessation
- 1985-09-16 BE BE0/215586A patent/BE903242A/fr not_active IP Right Cessation
- 1985-09-16 SE SE8504295A patent/SE8504295L/xx not_active Application Discontinuation
- 1985-09-17 DE DE19853533159 patent/DE3533159A1/de not_active Withdrawn
- 1985-09-17 CA CA000490925A patent/CA1232372A/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| SE8504295D0 (sv) | 1985-09-16 |
| CA1232372A (fr) | 1988-02-02 |
| SE8504295L (sv) | 1986-03-18 |
| GB2164794A (en) | 1986-03-26 |
| FI76220B (fi) | 1988-05-31 |
| FI843631A0 (fi) | 1984-09-17 |
| FR2570544B1 (fr) | 1990-01-05 |
| GB8522166D0 (en) | 1985-10-09 |
| FR2570544A1 (fr) | 1986-03-21 |
| FI76220C (fi) | 1988-09-09 |
| CH669477A5 (fr) | 1989-03-15 |
| DE3533159A1 (de) | 1986-03-27 |
| GB2164794B (en) | 1988-03-23 |
| FI843631L (fi) | 1986-03-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RE | Patent lapsed |
Owner name: LOHJA OY A.B. Effective date: 19920930 |