BR0013432A - Processo e dispositivo para isolamento de componentes eletrotécnicos - Google Patents
Processo e dispositivo para isolamento de componentes eletrotécnicosInfo
- Publication number
- BR0013432A BR0013432A BR0013432-5A BR0013432A BR0013432A BR 0013432 A BR0013432 A BR 0013432A BR 0013432 A BR0013432 A BR 0013432A BR 0013432 A BR0013432 A BR 0013432A
- Authority
- BR
- Brazil
- Prior art keywords
- infrared
- quenching
- isolation
- components
- radiation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/28—Treatment by wave energy or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0209—Multistage baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
- B05D3/0263—After-treatment with IR heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K15/00—Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
- H02K15/12—Impregnating, moulding insulation, heating or drying of windings, stators, rotors or machines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Insulating Of Coils (AREA)
- Paints Or Removers (AREA)
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Inorganic Insulating Materials (AREA)
- Thermistors And Varistors (AREA)
- Processes Specially Adapted For Manufacturing Cables (AREA)
- Insulators (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Insulating Bodies (AREA)
Abstract
"PROCESSO E DISPOSITIVO PARA ISOLAMENTO DE COMPONENTES ELETROTéCNICOS". O processo para a têmpera de massas de isolamento elétrico é caracterizado pelo emprego e/ou co-emprego de radiação próxima ao infravermelho ( NIR ) de um comprimento de onda de 500 nm a 1400 nm. Radiação próxima ao infravermelho possibilita também, com agentes de impregnação termicamente temperáveis, uma têmpera muito rápida da superfície dos componentes com boa têmpera mesmo de camadas mais espessas na profundidade dessas camadas. Ademais, é possível uma têmpera combinada por exemplo com luz próxima a infravermelho e a UV.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19939760A DE19939760A1 (de) | 1999-08-21 | 1999-08-21 | Verfahren und Vorrichtung zur Isolierung elektrotechnischer Bauteile |
| PCT/EP2000/007380 WO2001015179A1 (de) | 1999-08-21 | 2000-07-31 | Verfahren und vorrichtung zur isolierung elektrotechnischer bauteile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0013432A true BR0013432A (pt) | 2002-06-11 |
Family
ID=7919200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0013432-5A BR0013432A (pt) | 1999-08-21 | 2000-07-31 | Processo e dispositivo para isolamento de componentes eletrotécnicos |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US7045174B1 (pt) |
| EP (1) | EP1206780B1 (pt) |
| JP (1) | JP2003507905A (pt) |
| KR (1) | KR100627200B1 (pt) |
| AT (1) | ATE358322T1 (pt) |
| AU (1) | AU6989200A (pt) |
| BR (1) | BR0013432A (pt) |
| CZ (1) | CZ2002636A3 (pt) |
| DE (2) | DE19939760A1 (pt) |
| ES (1) | ES2284522T3 (pt) |
| HK (1) | HK1046583A1 (pt) |
| MX (1) | MXPA02001829A (pt) |
| TW (1) | TW499789B (pt) |
| WO (1) | WO2001015179A1 (pt) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10009822C1 (de) * | 2000-03-01 | 2001-12-06 | Basf Coatings Ag | Verfahren zur Herstellung von Beschichtungen, Klebschichten oder Dichtungen für grundierte oder ungrundierte Substrate und Substrate |
| US7096566B2 (en) | 2001-01-09 | 2006-08-29 | Black & Decker Inc. | Method for making an encapsulated coil structure |
| BR0116740A (pt) | 2001-01-09 | 2003-12-23 | Black & Decker Inc | Motor elétrico tendo induzido revestido com um plástico termicamente condutivo |
| US6946758B2 (en) | 2001-01-09 | 2005-09-20 | Black & Decker Inc. | Dynamoelectric machine having encapsulated coil structure with one or more of phase change additives, insert molded features and insulated pinion |
| US7814641B2 (en) | 2001-01-09 | 2010-10-19 | Black & Decker Inc. | Method of forming a power tool |
| US6432490B1 (en) * | 2001-02-12 | 2002-08-13 | E. I. Du Pont De Nemours And Company | Process for coating substrates |
| DE10163797A1 (de) * | 2001-12-22 | 2003-06-05 | Dupont Performance Coatings | Verfahren zur Beschichtung von metallischen Leitern |
| DE20216113U1 (de) * | 2002-10-18 | 2004-03-18 | Baumüller Nürnberg GmbH | Tauchlack-beschichteter Kühl-Gehäusemantel für eine elektrische Maschine |
| DE102004033260A1 (de) * | 2004-07-09 | 2006-01-19 | Daimlerchrysler Ag | Verfahren und Vorrichtung zum Aushärten von strahlungsinduziert härtbaren Lacken |
| US20160086694A1 (en) * | 2014-09-24 | 2016-03-24 | Ronald C. PARSONS & Denise M. PARSONS, Trustees under the Ronald C. PARSONS & Denise M. PARSONS | Dielectric coating |
| US20160086698A1 (en) * | 2014-09-24 | 2016-03-24 | Ronald C. Parsons and Denise M. Parsons, trustees under the Ronald C. Parsons and Denise M. Parsons | Dielectric coating |
| CN109332115A (zh) * | 2018-08-02 | 2019-02-15 | 无锡金科涂装有限公司 | 一种压铸铝合金的表面浸渗方法 |
| CN112670072B (zh) * | 2020-12-23 | 2022-11-29 | 德阳帛汉电子有限公司 | 一种双列直插封装工艺 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5055569A (pt) * | 1973-09-17 | 1975-05-15 | ||
| SE415006B (sv) * | 1978-03-07 | 1980-09-01 | Asea Ab | Sett att anbringaen isolering av tverbunden polymer pa en kabelledare |
| JPS55120121A (en) * | 1979-03-10 | 1980-09-16 | Toshiba Corp | Manufacture of resin-molded coil |
| IN155961B (pt) * | 1981-05-15 | 1985-04-06 | Westinghouse Electric Corp | |
| NZ200399A (en) * | 1981-05-15 | 1985-12-13 | Westinghouse Electric Corp | Forming paperless electric coils:winding conductor on gelled insulation coating |
| JP3222950B2 (ja) * | 1992-10-26 | 2001-10-29 | 旭化成株式会社 | 強固なはんだ付け可能な導電性ペースト |
| US5685754A (en) * | 1994-06-30 | 1997-11-11 | Kimberly-Clark Corporation | Method of generating a reactive species and polymer coating applications therefor |
| US5705232A (en) * | 1994-09-20 | 1998-01-06 | Texas Instruments Incorporated | In-situ coat, bake and cure of dielectric material processing system for semiconductor manufacturing |
| JPH09180920A (ja) * | 1995-12-25 | 1997-07-11 | Daidoo Denshi:Kk | 希土類ボンド磁石およびその製造方法ならびに希土類ボンド磁石の熱処理装置 |
| DE19648134A1 (de) * | 1996-11-21 | 1998-05-28 | Beck & Co Ag Dr | Verfahren zur Tränkung von Bauteilen |
| DE19648133A1 (de) * | 1996-11-21 | 1998-05-28 | Beck & Co Ag Dr | Verfahren zur Tränkung von Bauteilen |
| JPH10182767A (ja) * | 1996-12-26 | 1998-07-07 | Showa Highpolymer Co Ltd | フィラメントワインディング成形方法 |
| JP3806209B2 (ja) * | 1996-12-26 | 2006-08-09 | 昭和高分子株式会社 | フィラメントワインディング成形方法 |
| JPH10225071A (ja) * | 1997-02-05 | 1998-08-21 | Toshiba Corp | コイルの製造方法 |
| US20010014399A1 (en) | 1997-02-26 | 2001-08-16 | Stanley J. Jasne | Conductive uv-curable epoxy formulations |
| BR9906513A (pt) * | 1998-06-03 | 2001-10-30 | Kimberly Clark Co | Fotoiniciadores novos e aplicações para osmesmos |
| DE19857045C2 (de) * | 1998-12-10 | 2001-02-01 | Industrieservis Ges Fuer Innov | Beschichtung von Gegenständen |
| US6573305B1 (en) * | 1999-09-17 | 2003-06-03 | 3M Innovative Properties Company | Foams made by photopolymerization of emulsions |
| US6274638B1 (en) * | 1999-11-19 | 2001-08-14 | Nippon Shokubai Co., Ltd. | Method for production of porous cross-linked polymer material |
| JP4490554B2 (ja) * | 2000-05-16 | 2010-06-30 | 昭和高分子株式会社 | Frp圧力容器の成形方法 |
| DE10054933A1 (de) * | 2000-11-06 | 2002-05-08 | Bayer Ag | Verfahren zur Beschichtung von Substraten |
| US6852771B2 (en) * | 2001-08-28 | 2005-02-08 | Basf Corporation | Dual radiation/thermal cured coating composition |
| US6844029B2 (en) * | 2001-10-26 | 2005-01-18 | Kansai Paint Co., Ltd. | Photocurable primer composition and coating method by use of the same |
-
1999
- 1999-08-21 DE DE19939760A patent/DE19939760A1/de not_active Ceased
-
2000
- 2000-07-31 JP JP2001519451A patent/JP2003507905A/ja active Pending
- 2000-07-31 KR KR1020027002188A patent/KR100627200B1/ko not_active Expired - Fee Related
- 2000-07-31 US US10/069,061 patent/US7045174B1/en not_active Expired - Fee Related
- 2000-07-31 EP EP00958330A patent/EP1206780B1/de not_active Expired - Lifetime
- 2000-07-31 MX MXPA02001829A patent/MXPA02001829A/es active IP Right Grant
- 2000-07-31 ES ES00958330T patent/ES2284522T3/es not_active Expired - Lifetime
- 2000-07-31 AT AT00958330T patent/ATE358322T1/de active
- 2000-07-31 DE DE50014202T patent/DE50014202D1/de not_active Expired - Lifetime
- 2000-07-31 BR BR0013432-5A patent/BR0013432A/pt not_active Application Discontinuation
- 2000-07-31 HK HK02108049.2A patent/HK1046583A1/zh unknown
- 2000-07-31 AU AU69892/00A patent/AU6989200A/en not_active Abandoned
- 2000-07-31 CZ CZ2002636A patent/CZ2002636A3/cs unknown
- 2000-07-31 WO PCT/EP2000/007380 patent/WO2001015179A1/de not_active Ceased
- 2000-08-08 TW TW089115922A patent/TW499789B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100627200B1 (ko) | 2006-09-22 |
| EP1206780B1 (de) | 2007-03-28 |
| HK1046583A1 (zh) | 2003-01-17 |
| WO2001015179A1 (de) | 2001-03-01 |
| JP2003507905A (ja) | 2003-02-25 |
| DE50014202D1 (de) | 2007-05-10 |
| KR20020029384A (ko) | 2002-04-18 |
| EP1206780A1 (de) | 2002-05-22 |
| TW499789B (en) | 2002-08-21 |
| ATE358322T1 (de) | 2007-04-15 |
| ES2284522T3 (es) | 2007-11-16 |
| CZ2002636A3 (cs) | 2002-07-17 |
| AU6989200A (en) | 2001-03-19 |
| MXPA02001829A (es) | 2004-09-06 |
| US7045174B1 (en) | 2006-05-16 |
| DE19939760A1 (de) | 2001-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FA10 | Dismissal: dismissal - article 33 of industrial property law | ||
| B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |