BR0014718A - Aparelho de confinamento de emi - Google Patents
Aparelho de confinamento de emiInfo
- Publication number
- BR0014718A BR0014718A BR0014718-4A BR0014718A BR0014718A BR 0014718 A BR0014718 A BR 0014718A BR 0014718 A BR0014718 A BR 0014718A BR 0014718 A BR0014718 A BR 0014718A
- Authority
- BR
- Brazil
- Prior art keywords
- shield
- walls
- housing
- emi
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/3833—Hand-held transceivers
- H04B1/3838—Arrangements for reducing RF exposure to the user, e.g. by changing the shape of the transceiver while in use
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24521—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness with component conforming to contour of nonplanar surface
- Y10T428/24545—Containing metal or metal compound
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
"APARELHO DE CONFINAMENTO DE EMI". Sistema de montagem de blindagem de EMI e RFI (24) inclui uma blindagem de EMI compartimentada (21) construída de uma termofórma metalizada a vácuo (22) tendo paredes ocas verticais separando e circundando os compartimentos (13). A blindagem (21) se adapta à parte interna de um alojamento (20) para o equipamento eletrónico (30), com as paredes verticais (29) sobrepondo-se os sulcos formados no interior do alojamento (20). Uma gaxeta compressível (25) é colocada entre os sulcos do alojamento e as extensões internas das paredes ocas (31) da blindagem (21). Os lados livres das paredes (29) da blindagem (21) podem ser confinados contra os traços de aterramento (46) numa placa de circuito impresso (32) na qual a blindagem (21) e o alojamento (20) estão colocados. A gaxeta (25) estimula as bordas livres metalizadas das paredes (29) da blindagem (21) contra os traços de aterramento (46) da placa de circuito impresso para proporcionar condutividade elétrica entre a placa de circuito impresso e a blindagem (21). Pequenas ondulações (60), abas (52) ou perfurações protuberantes podem ser formadas nos lados livres das paredes (29) para assegurar contato condutor com o traço de aterramento (46).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15843599P | 1999-10-12 | 1999-10-12 | |
| PCT/US2000/027610 WO2001028305A1 (en) | 1999-10-12 | 2000-10-06 | Emi containment apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR0014718A true BR0014718A (pt) | 2003-07-15 |
Family
ID=22568108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR0014718-4A BR0014718A (pt) | 1999-10-12 | 2000-10-06 | Aparelho de confinamento de emi |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6624432B1 (pt) |
| EP (1) | EP1230830A4 (pt) |
| CN (1) | CN1409942A (pt) |
| AU (1) | AU1074101A (pt) |
| BR (1) | BR0014718A (pt) |
| WO (1) | WO2001028305A1 (pt) |
Families Citing this family (103)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6483719B1 (en) * | 2000-03-21 | 2002-11-19 | Spraylat Corporation | Conforming shielded form for electronic component assemblies |
| US6643918B2 (en) * | 2000-04-17 | 2003-11-11 | Shielding For Electronics, Inc. | Methods for shielding of cables and connectors |
| NL1016549C2 (nl) * | 2000-10-06 | 2002-04-10 | Stork Screens Bv | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
| GB2372899B (en) * | 2001-03-01 | 2004-06-16 | Matsushita Comm Ind Uk Ltd | Portable communications terminal incorporating a radio signal attenuation device |
| ATE338381T1 (de) * | 2001-03-22 | 2006-09-15 | Florian Meinhard Koenig | Drahtloses telefon mit emv-abschirmung |
| WO2002093996A1 (en) * | 2001-05-10 | 2002-11-21 | Parker Hannifin Corporation | Manufacture of electronics enclosure having a metallized shielding layer |
| TW563014B (en) * | 2001-07-25 | 2003-11-21 | High Tech Comp Corp | Personal digital assistant with electrostatic discharge protection function |
| US6826828B1 (en) * | 2001-08-22 | 2004-12-07 | Taiwan Semiconductor Manufacturing Company | Electrostatic discharge-free container comprising a cavity surrounded by surfaces of PMMA-poly covered metal-PMMA |
| JP4601879B2 (ja) * | 2001-09-14 | 2010-12-22 | パナソニック株式会社 | 携帯電子機器及びbgaパッケージ保護装置 |
| DE10147751C1 (de) * | 2001-09-27 | 2002-09-26 | Siemens Ag | Verfahren zur Herstellung einer Schirmung |
| JP2004056565A (ja) * | 2002-07-22 | 2004-02-19 | Tdk Corp | カード型無線通信装置 |
| WO2004027340A2 (en) * | 2002-09-17 | 2004-04-01 | Wavezero, Inc. | Equipment and methods for producing continuous metallized thermoformable emi shielding material |
| US7580395B2 (en) * | 2002-11-29 | 2009-08-25 | Intermec Ip Corp. | Information gathering apparatus and method having multiple wireless communication options |
| JP4090928B2 (ja) * | 2003-03-31 | 2008-05-28 | 信越ポリマー株式会社 | シールドボックス |
| CN100454533C (zh) | 2003-04-15 | 2009-01-21 | 波零公司 | 用于电子元件封装的emi屏蔽 |
| EP1501202B1 (en) * | 2003-07-23 | 2012-03-28 | LG Electronics, Inc. | Internal antenna and mobile terminal having the internal antenna |
| KR100652620B1 (ko) * | 2003-07-30 | 2006-12-06 | 엘지전자 주식회사 | 내장형 안테나가 구비된 휴대용 단말기 |
| KR100671739B1 (ko) * | 2003-10-31 | 2007-01-22 | 장상호 | 증착지그를 이용한 휴대폰 외장케이스의 이엠아이층진공증착방법 및 지그 |
| US20080112151A1 (en) | 2004-03-04 | 2008-05-15 | Skyworks Solutions, Inc. | Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components |
| US8399972B2 (en) | 2004-03-04 | 2013-03-19 | Skyworks Solutions, Inc. | Overmolded semiconductor package with a wirebond cage for EMI shielding |
| US7198987B1 (en) * | 2004-03-04 | 2007-04-03 | Skyworks Solutions, Inc. | Overmolded semiconductor package with an integrated EMI and RFI shield |
| TWI245533B (en) * | 2004-03-12 | 2005-12-11 | Asustek Comp Inc | Portable electronic apparatus |
| US20050236171A1 (en) * | 2004-04-23 | 2005-10-27 | Garcia Jorge L | Shield frame for a radio frequency shielding assembly |
| KR100607002B1 (ko) * | 2004-11-09 | 2006-08-02 | 하재기 | 개별 탈부착이 가능한 다수개의 코아를 형성한 지그를갖는 전자파 차단용 도료의 선택적 도포를 위한 장치. |
| JP2006147917A (ja) * | 2004-11-22 | 2006-06-08 | Nec Access Technica Ltd | 無線端末のシールド構造および無線端末 |
| US20060151207A1 (en) * | 2004-12-02 | 2006-07-13 | Brian Redman | RF shielding structure |
| US7362585B2 (en) * | 2005-02-11 | 2008-04-22 | Research In Motion Limited | Frame for a device mounted above a printed circuit board in an electronic device |
| FR2891372A1 (fr) * | 2005-09-23 | 2007-03-30 | St Microelectronics Sa | Barillet de lentille focale variable |
| KR100722096B1 (ko) * | 2005-11-23 | 2007-05-25 | 삼성에스디아이 주식회사 | 휴대용 표시장치 |
| CN1972587B (zh) * | 2005-11-25 | 2011-11-16 | 深圳富泰宏精密工业有限公司 | 电子装置的屏蔽构件及壳体组件 |
| US7262369B1 (en) | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
| US7355857B2 (en) * | 2006-02-07 | 2008-04-08 | Methode Electronics, Inc. | Heat sink gasket |
| US7463496B2 (en) * | 2006-03-09 | 2008-12-09 | Laird Technologies, Inc. | Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith |
| US7317618B2 (en) * | 2006-03-09 | 2008-01-08 | Laird Technologies, Inc. | Combined board level shielding and thermal management |
| US7399931B2 (en) * | 2006-03-09 | 2008-07-15 | Laird Technologies, Inc. | Gaskets for protecting fingerprint readers from electrostatic discharge surges |
| US7623360B2 (en) * | 2006-03-09 | 2009-11-24 | Laird Technologies, Inc. | EMI shielding and thermal management assemblies including frames and covers with multi-position latching |
| TWI277386B (en) * | 2006-03-31 | 2007-03-21 | Asustek Comp Inc | Electromagnetic shielding device |
| CN101083897B (zh) * | 2006-05-29 | 2011-02-23 | 华硕电脑股份有限公司 | 电磁屏蔽装置及其制作方法 |
| US7288727B1 (en) * | 2006-05-31 | 2007-10-30 | Motorola, Inc. | Shield frame for a radio frequency shielding assembly |
| US7508684B2 (en) | 2006-08-18 | 2009-03-24 | Research In Motion Limited | Handheld electronic device including multi-compartment shielding container and associated methods |
| DE602006009803D1 (de) * | 2006-08-18 | 2009-11-26 | Research In Motion Ltd | Tragbares elektronisches Gerät beinhaltend elektromagnetische Abschirmung mit mehreren Kammern und dazugehörige Verfahren |
| US20080174960A1 (en) * | 2007-01-22 | 2008-07-24 | Themis Computer | Clamshell enclosure for electronic circuit assemblies |
| EP2019424B1 (de) * | 2007-07-26 | 2016-11-23 | SEMIKRON Elektronik GmbH & Co. KG | Leistungshalbleitermodul mit Dichteinrichtung zum Substratträger und Herstellungsverfahren hierzu |
| US7527506B2 (en) * | 2007-08-31 | 2009-05-05 | Laird Technologies, Inc. | EMI shielding/electrical grounding members |
| US8313684B1 (en) * | 2007-12-14 | 2012-11-20 | Flextronics | Method of and device for thermoforming of antennas |
| US7889515B2 (en) * | 2008-02-15 | 2011-02-15 | Laird Technologies, Inc. | EMI shielding assemblies and related methods of retaining components thereof together |
| US20090266601A1 (en) * | 2008-04-24 | 2009-10-29 | Yu-Jen Cheng | Protective cover for prevention of electromagnetism interference |
| US20090265931A1 (en) * | 2008-04-28 | 2009-10-29 | Yu-Jen Cheng | Method for manufacturing protective cover for prevention of electromagnetism interference |
| US8169786B2 (en) * | 2008-05-16 | 2012-05-01 | Psion Teklogix Inc. | Ruggedized housing and components for a handled device |
| US20090290319A1 (en) * | 2008-05-20 | 2009-11-26 | Apple Inc. | Electromagnetic shielding in small-form-factor device |
| US7625223B1 (en) | 2008-10-01 | 2009-12-01 | Tyco Electronics Corporation | Connector system with floating heat sink |
| KR20100046594A (ko) * | 2008-10-27 | 2010-05-07 | 엘지전자 주식회사 | 휴대 단말기 |
| US8164526B1 (en) | 2008-11-03 | 2012-04-24 | Flextronics Ap, Llc | Single wire internal antenna with integral contact force spring |
| US20100240421A1 (en) * | 2009-03-17 | 2010-09-23 | Michael Sekora | Cellular phone cover/case that blocks radiation from reaching the user through the implementation of faraday cage and/or conductive material properties |
| JP2010251375A (ja) * | 2009-04-10 | 2010-11-04 | Toshiba Corp | 電子回路 |
| US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| US7965514B2 (en) | 2009-06-05 | 2011-06-21 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
| JP2011054640A (ja) * | 2009-08-31 | 2011-03-17 | Funai Electric Co Ltd | シールドパッケージ基板 |
| NO20093177A1 (no) * | 2009-10-20 | 2011-04-26 | Walter Kraus | 3-kammer-avskjermingssystem med intern optisk signaloverforing for tradlose telefoner |
| JP5593714B2 (ja) * | 2010-01-29 | 2014-09-24 | 富士通株式会社 | 電子素子のシールド構造及びこれを備えた電子装置 |
| KR101760746B1 (ko) * | 2010-12-10 | 2017-08-04 | 엘지전자 주식회사 | 이동 단말기 |
| KR101873407B1 (ko) * | 2011-07-13 | 2018-07-02 | 엘지전자 주식회사 | 이동 단말기 |
| US9018904B2 (en) | 2011-08-12 | 2015-04-28 | GM Global Technology Operations LLC | Wireless battery charging apparatus mounted in a vehicle designed to reduce electromagnetic interference |
| US9096177B2 (en) | 2011-08-12 | 2015-08-04 | GM Global Technology Operations LLC | Apparatus for securing a rechargeable electronic device with respect to a surface of a wireless battery charging apparatus of a vehicle |
| US8270929B1 (en) | 2011-09-09 | 2012-09-18 | Contech RF Devices, LLC | RF shielding for mobile devices |
| US8879266B2 (en) * | 2012-05-24 | 2014-11-04 | Apple Inc. | Thin multi-layered structures providing rigidity and conductivity |
| US9578769B2 (en) | 2012-05-29 | 2017-02-21 | Apple Inc. | Components of an electronic device and methods for their assembly |
| US9413861B2 (en) * | 2012-10-05 | 2016-08-09 | Nokia Technologies Oy | Metallization and anodization of plastic and conductive parts of the body of an apparatus |
| EP2743786B1 (fr) * | 2012-12-17 | 2018-10-31 | The Swatch Group Research and Development Ltd. | Dispositif électronique portable et procédé de fabrication d'un tel dispositif |
| US8921709B2 (en) | 2013-03-15 | 2014-12-30 | Continental Accessory Corp. | RF shielding for mobile devices |
| US9313934B2 (en) | 2013-03-15 | 2016-04-12 | Autoliv Asp, Inc. | Dispensible electrical gasket, electronic module having dispensible electrical gasket, and method of fabricating same |
| US9332680B2 (en) | 2013-03-15 | 2016-05-03 | Autoliv Asp, Inc. | Electrical gasket and electronic module having electrical gasket |
| KR20140126507A (ko) * | 2013-04-23 | 2014-10-31 | 삼성전자주식회사 | 전자 기기의 차폐 장치 |
| JP6309619B2 (ja) * | 2013-10-01 | 2018-04-11 | オートリブ エー・エス・ピー・インク | コンパクトシールド車載用レーダモジュールおよび方法 |
| US9060417B2 (en) | 2013-10-03 | 2015-06-16 | International Business Machines Corporation | Device for attenuating propagation of electromagnetic emissions from an enclosure |
| EP2905888A1 (de) * | 2014-02-05 | 2015-08-12 | Grundfos Holding A/S | Stromrichter |
| CN105283054B (zh) * | 2014-06-10 | 2019-05-31 | 中兴通讯股份有限公司 | 射频屏蔽装置和移动终端 |
| EP3163995B1 (en) * | 2014-08-01 | 2019-01-02 | Huawei Technologies Co. Ltd. | Electromagnetic shielding material and method for packaging optical module |
| US10509187B2 (en) * | 2014-09-23 | 2019-12-17 | Ppc Broadband, Inc. | Universal multi-purpose compartmentalized telecommunications box |
| US9603276B2 (en) * | 2014-12-26 | 2017-03-21 | Intel Corporation | Electronic assembly that includes a plurality of electronic packages |
| CN104582366B (zh) * | 2014-12-31 | 2018-01-23 | 广东欧珀移动通信有限公司 | 终端壳体及其应用的终端,及终端壳体制作方法 |
| RU2701165C2 (ru) * | 2015-06-04 | 2019-09-25 | Хуавэй Текнолоджиз Ко., Лтд. | Мобильный терминал и теплоотводящая и экранирующая конструкция |
| US9788413B2 (en) * | 2015-11-09 | 2017-10-10 | Motorola Solutions, Inc. | Electromagnetic interference shielding assembly and method of providing electromagnetic interference shielding |
| US9936618B2 (en) * | 2015-12-11 | 2018-04-03 | Laird Technologies, Inc. | Board level shields including foil and/or film covers |
| US10069202B1 (en) | 2016-03-23 | 2018-09-04 | Flextronics Ap, Llc | Wide band patch antenna |
| CN105704273B (zh) * | 2016-03-31 | 2019-05-21 | 努比亚技术有限公司 | 一种屏蔽框及终端 |
| JP6780422B2 (ja) * | 2016-09-30 | 2020-11-04 | オムロン株式会社 | 電子機器 |
| FR3062530B1 (fr) * | 2017-02-02 | 2020-11-13 | Valeo Vision | Dispositif de pilotage de l'alimentation electrique pour une source lumineuse a semi-conducteur |
| JP6691495B2 (ja) | 2017-03-06 | 2020-04-28 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
| US10219381B2 (en) | 2017-03-22 | 2019-02-26 | Carling Technologies, Inc. | Circuit board mounted switch with electro static discharge shield |
| DE102017211869A1 (de) * | 2017-07-11 | 2019-01-17 | Röchling Automotive SE & Co. KG | Mehrteiliges elektromagnetisch abgeschirmtes Gehäuse mit zwischen Gehäusebauteilen angeordneter Dichtung, insbesondere elektrisch nicht-leitfähiger Dichtung |
| TW202019270A (zh) * | 2018-11-14 | 2020-05-16 | 和碩聯合科技股份有限公司 | 電子裝置及其電磁屏蔽組件 |
| TWI700976B (zh) * | 2019-05-17 | 2020-08-01 | 和碩聯合科技股份有限公司 | 電子裝置及其殼體結構 |
| CN114122748A (zh) * | 2020-08-31 | 2022-03-01 | 华为技术有限公司 | 一种电子设备 |
| US20240188262A1 (en) * | 2021-04-26 | 2024-06-06 | Honeywell International Inc. | Building controller with lateral side shielding |
| CN114258257A (zh) * | 2021-12-16 | 2022-03-29 | 纵目科技(上海)股份有限公司 | 电子控制单元及其应用的提高电磁兼容性的方法 |
| US12101111B2 (en) | 2021-12-28 | 2024-09-24 | Ubicquia, Inc. | Small cell access node with water intrusion mitigation |
| US11792964B2 (en) | 2021-12-28 | 2023-10-17 | Ubicquia, Inc. | Electronic apparatus with channeled cooling |
| US12108581B2 (en) * | 2021-12-28 | 2024-10-01 | Ubicquia, Inc. | Multi-chambered shield enclosure for vertically stacked module arrangement and electronic apparatus incorporating same |
| KR20240161144A (ko) | 2022-03-12 | 2024-11-12 | 티그란 하차트리안 | 기능성 rf/emf 차폐 필름 및 장치 |
| CN114867337A (zh) | 2022-06-16 | 2022-08-05 | 中磊电子(苏州)有限公司 | 具有电磁屏蔽功能的网通装置 |
| US12557256B2 (en) * | 2022-12-22 | 2026-02-17 | Qualcomm Incorporated | Structure for electromagnetic interference (EMI) shielding |
| US20250280520A1 (en) * | 2024-02-29 | 2025-09-04 | Harman International Industries, Incorporated | Apparatus for providing an electronic unit with a water seal, emi shield, and emi contacts |
Family Cites Families (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1070792A (en) | 1976-07-26 | 1980-01-29 | Earl A. Cooper | Electrical connector and frequency shielding means therefor and method of making same |
| US4489116A (en) | 1982-12-21 | 1984-12-18 | Flood James R | Skin packaging technique providing paint masking |
| DE3248147A1 (de) | 1982-12-27 | 1984-06-28 | Siemens AG, 1000 Berlin und 8000 München | Metallisierte formteile aus kunststoff fuer technische gehaeuse zur abschirmung gegenueber elektromagnetischen stoerfeldern |
| US4661888A (en) | 1984-07-03 | 1987-04-28 | Hewlett-Packard Company | Removable modular housing for RF circuits |
| US4759466A (en) * | 1986-08-14 | 1988-07-26 | Apple Computer, Inc. | EMI seam for enclosures |
| US4714905A (en) | 1986-10-08 | 1987-12-22 | K & L Microwave | SMC filter and method of manufacture thereof |
| US5047260A (en) | 1987-02-06 | 1991-09-10 | Key-Tech, Inc. | Method for producing a shielded plastic enclosure to house electronic equipment |
| US4959752A (en) * | 1988-10-24 | 1990-09-25 | Digital Equipment Corporation | Electronic module RFI/EMI shielding |
| US5226210A (en) | 1989-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method of forming metal fiber mat/polymer composite |
| US5250342A (en) | 1989-05-24 | 1993-10-05 | United Technologies Corporation | Composite EMI shield having clean, highly conductive surfaces for conductive bonding |
| US4988550A (en) | 1989-07-28 | 1991-01-29 | Chomerics, Inc. | Conductive masking laminate |
| US5107404A (en) | 1989-09-14 | 1992-04-21 | Astec International Ltd. | Circuit board assembly for a cellular telephone system or the like |
| US5034856A (en) | 1989-10-24 | 1991-07-23 | Hewlett-Packard Company | Modular housing assembly for two incompatible circuits |
| US5071519A (en) | 1989-11-03 | 1991-12-10 | Amp Incorporated | Method of plating a flexible dielectric member |
| US5170009A (en) | 1990-03-22 | 1992-12-08 | Canon Kabushiki Kaisha | Electrically conductive covers and electrically conductive covers of electronic equipment |
| US5235492A (en) | 1990-04-24 | 1993-08-10 | Motorola, Inc. | Electromagnetic shielding apparatus for cellular telephones |
| US5191544A (en) | 1990-06-15 | 1993-03-02 | International Business Machines Corp. | Personal computer enclosure with shielding |
| US5270488A (en) | 1990-07-27 | 1993-12-14 | Mitsubishi Denki Kabushiki Kaisha | Shield construction for electrical devices |
| US5180639A (en) | 1990-10-26 | 1993-01-19 | General Electric Company | Method of preparing polymer surfaces for subsequent plating thereon and improved metal-plated plastic articles made therefrom |
| US5206796A (en) | 1991-03-11 | 1993-04-27 | John Fluke Mfg. Co. Inc. | Electronic instrument with emi/esd shielding system |
| US5225629A (en) | 1991-12-13 | 1993-07-06 | Dell Usa L.P. | Snap-in EMI contact associated with a digital computer |
| JP3128672B2 (ja) * | 1992-06-29 | 2001-01-29 | キョーラク株式会社 | プラスチック製ハウジングパネル |
| US5519168A (en) * | 1993-10-12 | 1996-05-21 | Owens; William M. | Electromagnetic interference shielding |
| US5416668A (en) * | 1993-11-09 | 1995-05-16 | At&T Corp. | Shielded member |
| US5519169A (en) * | 1994-03-23 | 1996-05-21 | Dell Usa, L.P. | EMI grounding cap structure for use in mounting a printed circuit board on a plated housing boss |
| US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
| DE4439471A1 (de) | 1994-11-08 | 1996-05-09 | Telefunken Microelectron | Baugruppe |
| EP0727932B1 (en) | 1994-11-28 | 1999-04-07 | Kabushiki Kaisha Toshiba | Electromagnetic shielded casing |
| US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
| CA2151331A1 (en) | 1995-06-08 | 1996-12-09 | Henry W. C. Mok | Emi shield |
| US5550713A (en) | 1995-09-06 | 1996-08-27 | Aironet Wireless Communications, Inc. | Electromagnetic shielding assembly for printed circuit board |
| US5740018A (en) * | 1996-02-29 | 1998-04-14 | The United States Of America As Represented By The Secretary Of The Navy | Environmentally controlled circuit pack and cabinet |
| US5822690A (en) | 1996-04-12 | 1998-10-13 | Motorola, Inc. | Multi-pole switch assembly providing display cover and virtual pivot action |
| US5748455A (en) * | 1996-04-23 | 1998-05-05 | Ericsson, Inc. | Electromagnetic shield for a radiotelephone |
| US5872332A (en) * | 1997-06-27 | 1999-02-16 | Delco Electronics Corp. | Molded housing with EMI shield |
| US6121545A (en) * | 1997-07-11 | 2000-09-19 | Parker-Hannifin Corporation | Low closure force EMI shielding spacer gasket |
| US5867371A (en) * | 1997-09-29 | 1999-02-02 | Ericsson Inc. | Cover member for sealed circuit board assembly |
| US6063999A (en) | 1997-12-19 | 2000-05-16 | Siemens Medical Systems, Inc. | Surface mount spring gasket and EMI enclosure |
| US6275683B1 (en) | 1998-01-12 | 2001-08-14 | Ericsson Inc. | Interchangeable shield for a radio communication device |
| US6121546A (en) | 1998-04-20 | 2000-09-19 | Lucent Technologies Inc. | RF shield |
| US6090728A (en) * | 1998-05-01 | 2000-07-18 | 3M Innovative Properties Company | EMI shielding enclosures |
| US6195267B1 (en) * | 1999-06-23 | 2001-02-27 | Ericsson Inc. | Gel structure for combined EMI shielding and thermal control of microelectronic assemblies |
| US6271465B1 (en) | 1999-08-31 | 2001-08-07 | Nokia Mobile Phones Limited | Low cost conformal EMI/RFI shield |
| US6643918B2 (en) * | 2000-04-17 | 2003-11-11 | Shielding For Electronics, Inc. | Methods for shielding of cables and connectors |
| US20010033478A1 (en) * | 2000-04-21 | 2001-10-25 | Shielding For Electronics, Inc. | EMI and RFI shielding for printed circuit boards |
| US6768654B2 (en) * | 2000-09-18 | 2004-07-27 | Wavezero, Inc. | Multi-layered structures and methods for manufacturing the multi-layered structures |
-
2000
- 2000-10-06 US US09/684,188 patent/US6624432B1/en not_active Expired - Lifetime
- 2000-10-06 EP EP00972020A patent/EP1230830A4/en not_active Withdrawn
- 2000-10-06 CN CN00817047.9A patent/CN1409942A/zh active Pending
- 2000-10-06 WO PCT/US2000/027610 patent/WO2001028305A1/en not_active Ceased
- 2000-10-06 AU AU10741/01A patent/AU1074101A/en not_active Abandoned
- 2000-10-06 BR BR0014718-4A patent/BR0014718A/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN1409942A (zh) | 2003-04-09 |
| AU1074101A (en) | 2001-04-23 |
| EP1230830A4 (en) | 2006-04-26 |
| US6624432B1 (en) | 2003-09-23 |
| EP1230830A1 (en) | 2002-08-14 |
| WO2001028305A1 (en) | 2001-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| BR0014718A (pt) | Aparelho de confinamento de emi | |
| BR9808555A (pt) | Alojamento de blindagem elétrica, processo de sua produção, e, telefone celular. | |
| BR9910073A (pt) | Sistema de interconexção elétrica e elétrica e óptica | |
| BR0309043A (pt) | Blindagem de interferência eletromagnética (emi) de nìvel de placa | |
| BR9713678A (pt) | Módulo de circuito rf | |
| KR860006146A (ko) | 차폐 헤더 및 케이블 조립체 | |
| MY109059A (en) | Shielded electrical connector assemblies | |
| CA2136469A1 (en) | Emi shielding having flexible conductive envelope | |
| AU6355400A (en) | Emi shielding vent panel | |
| BR9915283A (pt) | Montagem de tomada | |
| CA2029443A1 (en) | Gasket and cabinet for providing emi/rfi shielding | |
| MY112276A (en) | Low profile shielded jack | |
| BR0113277A (pt) | Conector de plugue elétrico | |
| JP2000347767A (ja) | コンピュータ・システム・ハウジング | |
| KR910015078A (ko) | 고주파회로용 패키지 | |
| BR8605544A (pt) | Conector blindado para circuitos eletricos | |
| KR890003233A (ko) | 비디오 회로 봉입물 | |
| ES2066467T3 (es) | Elemento de conector de enchufe coaxial para la conexion con una placa de circuitos impresos. | |
| US6116924A (en) | Electromagnetic emissions shielding structure for circuit board connector assembly | |
| SE9702027L (sv) | Skärmningshölje jämte förfaranden för att framställa ett skärmningshölje | |
| KR970068040A (ko) | 기판 장착용 차폐형 전기 커넥터 | |
| KR940004451A (ko) | 접지된 메모리카드 | |
| FI832496A0 (fi) | Box foer radioapparat | |
| DE59700985D1 (de) | Steckverbinder mit abschirmung | |
| JPH02955Y2 (pt) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B25D | Requested change of name of applicant approved | ||
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 6A,7A E 8A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO PUBLICADO NA RPI 1962 DE 12/08/2008. |