BR0204352A - Processo para produzir um dispositivo micromecânico em multicamadas e dispositivo produzido pelo mesmo - Google Patents

Processo para produzir um dispositivo micromecânico em multicamadas e dispositivo produzido pelo mesmo

Info

Publication number
BR0204352A
BR0204352A BR0204352-1A BR0204352A BR0204352A BR 0204352 A BR0204352 A BR 0204352A BR 0204352 A BR0204352 A BR 0204352A BR 0204352 A BR0204352 A BR 0204352A
Authority
BR
Brazil
Prior art keywords
producing
cavity
produced
multilayer
sealing
Prior art date
Application number
BR0204352-1A
Other languages
English (en)
Inventor
Hoheil Habibi
Nils Kedenstierna
Original Assignee
Sensonor Asa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensonor Asa filed Critical Sensonor Asa
Publication of BR0204352A publication Critical patent/BR0204352A/pt

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/031—Anodic bondings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Laminated Bodies (AREA)

Abstract

"PROCESSO PARA PRODUZIR UM DISPOSITIVO MICROMECâNICO EM MULTICAMADAS E DISPOSITIVO PRODUZIDO PELO MESMO". Um processo para produzir um dispositivo micromecânico em multicamadas. O dispositivo compreende uma cavidade interna contendo um componente micro-mecânico no seu interior. o processo compreende as etapas de formar o componente micro-mecânico de uma camada de um primeiro material, proporcionar uma camada de vedação sobre pelo menos uma superfície do primeiro material para definir a cavidade, proporcionar um material seq³estrante no interior da cavidade, selar o primeiro material às camadas de vedação por ligação anódica, fornecer um gás inerte à cavidade para regular a pressão no interior da cavidade. Um correspondente dispositivo produzido pelo processo é também apresentado.
BR0204352-1A 2001-11-07 2002-10-23 Processo para produzir um dispositivo micromecânico em multicamadas e dispositivo produzido pelo mesmo BR0204352A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01309422A EP1310380A1 (en) 2001-11-07 2001-11-07 A micro-mechanical device and method for producing the same

Publications (1)

Publication Number Publication Date
BR0204352A true BR0204352A (pt) 2003-09-16

Family

ID=8182435

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0204352-1A BR0204352A (pt) 2001-11-07 2002-10-23 Processo para produzir um dispositivo micromecânico em multicamadas e dispositivo produzido pelo mesmo

Country Status (6)

Country Link
US (1) US20030085438A1 (pt)
EP (1) EP1310380A1 (pt)
JP (1) JP2003211399A (pt)
KR (1) KR20030038353A (pt)
CN (1) CN1417105A (pt)
BR (1) BR0204352A (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW533188B (en) 2001-07-20 2003-05-21 Getters Spa Support for microelectronic, microoptoelectronic or micromechanical devices
TW583049B (en) * 2001-07-20 2004-04-11 Getters Spa Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
KR100474455B1 (ko) * 2002-11-08 2005-03-11 삼성전자주식회사 기판단위 ｍｅｍｓ 진공실장방법 및 장치
EP1533270A1 (fr) 2003-11-21 2005-05-25 Asulab S.A. Procédé de contrôle de l'herméticité d'une cavité close d'un composant micrométrique, et composant micrométrique pour sa mise en oeuvre
US7042076B2 (en) * 2004-03-09 2006-05-09 Northrop Grumman Corporation Vacuum sealed microdevice packaging with getters
US7045885B1 (en) 2004-12-09 2006-05-16 Hewlett-Packard Development Company, L.P. Placement of absorbing material in a semiconductor device
IL165948A0 (en) * 2004-12-23 2006-01-15 Rafael Armament Dev Authority Chip packaging
EP1798196B1 (en) * 2005-12-15 2017-08-09 Infineon Technologies AG Multi-layer device with reduced UV radiations during encapsulation
US8748206B2 (en) 2010-11-23 2014-06-10 Honeywell International Inc. Systems and methods for a four-layer chip-scale MEMS device
US9171964B2 (en) 2010-11-23 2015-10-27 Honeywell International Inc. Systems and methods for a three-layer chip-scale MEMS device
CN102556944B (zh) * 2010-12-31 2014-11-05 中芯国际集成电路制造(上海)有限公司 Mems装置的制作方法
CN103502139B (zh) * 2011-04-20 2016-04-27 卡文迪什动力有限公司 气态化学品向形成于中间介质层中的腔体内的注入以用于之后的热扩散释放
US20130049143A1 (en) * 2011-08-26 2013-02-28 Qualcomm Mems Technologies, Inc. Release activated thin film getter
US9557238B2 (en) * 2014-07-25 2017-01-31 Ams International Ag Pressure sensor with geter embedded in membrane
CN112808344B (zh) * 2021-03-03 2025-06-13 中国科学院理化技术研究所 一种真空低温装置的平衡调节结构和调节方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69409257T2 (de) * 1993-12-13 1998-09-10 Honeywell, Inc., Minneapolis, Minn. Integrierte silizium-vakuum-mikropackung für infrarot-geräte
US5610438A (en) * 1995-03-08 1997-03-11 Texas Instruments Incorporated Micro-mechanical device with non-evaporable getter
US5837935A (en) * 1996-02-26 1998-11-17 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
US5701008A (en) * 1996-11-29 1997-12-23 He Holdings, Inc. Integrated infrared microlens and gas molecule getter grating in a vacuum package
US6499354B1 (en) * 1998-05-04 2002-12-31 Integrated Sensing Systems (Issys), Inc. Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices

Also Published As

Publication number Publication date
KR20030038353A (ko) 2003-05-16
EP1310380A1 (en) 2003-05-14
US20030085438A1 (en) 2003-05-08
CN1417105A (zh) 2003-05-14
JP2003211399A (ja) 2003-07-29

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]