BR0316657A - Composições de resina fotossensìvel compreendendo um corante isento de halogênio - Google Patents

Composições de resina fotossensìvel compreendendo um corante isento de halogênio

Info

Publication number
BR0316657A
BR0316657A BR0316657-0A BR0316657A BR0316657A BR 0316657 A BR0316657 A BR 0316657A BR 0316657 A BR0316657 A BR 0316657A BR 0316657 A BR0316657 A BR 0316657A
Authority
BR
Brazil
Prior art keywords
component
alkyl
photosensitive resin
phenyl
resin compositions
Prior art date
Application number
BR0316657-0A
Other languages
English (en)
Inventor
Hidetaka Oka
Jean-Marie Adam
Original Assignee
Ciba Sc Holding Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ciba Sc Holding Ag filed Critical Ciba Sc Holding Ag
Publication of BR0316657A publication Critical patent/BR0316657A/pt

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

"COMPOSIçõES DE RESINA FOTOSSENSìVEL COMPREENDENDO UM CORANTE ISENTO DE HALOGêNIO". A presente invenção refere-se a uma composição de resina fotossensível compreendendo a) como um componente (A) um corante verde de fórmula em que os anéis A, B, C e D são substituídos por hidróxi ou pela porção onde R~ 1~, é hidrogênio ou C~ 1~-C~ 4~alquila, R~ 2~ é hidrogênio ou C~ 1~-C~ 4~alquila, n é 0, 1, 2 ou 3 e o anel E é não-substituído ou substituído por C~ 1~-C~ 6~alquila, C~ 1~-C~ 6~alcóxi, hidróxi, NHCOR~ 3~, NHSO~ 2~R~ 4~ ou SO~ 2~NHR~ 5~, onde R~ 3~ é C~ 1~-C~ 4~alquila ou fenila, R~ 4~ é C~ 1~-C~ 4~alquila ou fenila e R~ 5~ é C~ 1~-C~ 4~alquila ou fenila, b) como um componente (B), um oligómero ou polímero solúvel em álcali (reativo ou não-reativo), c) como um componente (C), um monómero polimerizável, d) como um componente (D), um fotoiniciador, e) como um componente (E), um composto epóxi, e também, se desejado, f) como um componente (F), aditivos adicionais, utilizado como máscara de solda, resistente a ataque químico ou resistente à galvanização, na fabricação de placas de circuitos impressos.
BR0316657-0A 2002-11-28 2003-11-19 Composições de resina fotossensìvel compreendendo um corante isento de halogênio BR0316657A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP02406035 2002-11-28
PCT/EP2003/050849 WO2004049070A2 (en) 2002-11-28 2003-11-19 Photosensitive resin composition comprising a halogen-free colorant

Publications (1)

Publication Number Publication Date
BR0316657A true BR0316657A (pt) 2005-10-18

Family

ID=32338233

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0316657-0A BR0316657A (pt) 2002-11-28 2003-11-19 Composições de resina fotossensìvel compreendendo um corante isento de halogênio

Country Status (13)

Country Link
US (1) US8034531B2 (pt)
EP (1) EP1565789B1 (pt)
JP (1) JP4390707B2 (pt)
KR (1) KR101081756B1 (pt)
CN (1) CN100549825C (pt)
AT (1) ATE453877T1 (pt)
AU (1) AU2003298293A1 (pt)
BR (1) BR0316657A (pt)
CA (1) CA2507471A1 (pt)
DE (1) DE60330802D1 (pt)
MX (1) MXPA05005682A (pt)
TW (1) TW200421022A (pt)
WO (1) WO2004049070A2 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103885290B (zh) 2005-10-25 2017-11-03 日立化成株式会社 感光性树脂组合物、使用其的感光性元件、抗蚀剂图案的形成方法及印刷电路板的制造方法
US7713342B2 (en) * 2006-12-19 2010-05-11 Xerox Corporation Phase change inks
JP5291893B2 (ja) * 2007-05-08 2013-09-18 太陽ホールディングス株式会社 光硬化性樹脂組成物およびその硬化物
JP2013539072A (ja) * 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
JP5809182B2 (ja) * 2013-03-26 2015-11-10 株式会社タムラ製作所 感光性樹脂組成物
CN108003172A (zh) * 2017-12-12 2018-05-08 深圳市华星光电技术有限公司 一种绿色光阻材料及其制备方法和应用

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US4039585A (en) * 1975-09-08 1977-08-02 Uop Inc. Hydroformylation process
JPS61243869A (ja) * 1985-04-19 1986-10-30 Taiyo Ink Seizo Kk レジストインキ組成物
US4789620A (en) * 1986-03-03 1988-12-06 Mitsubishi Rayon Co. Ltd. Liquid photosensitive resin composition containing carboxylated epoxy acrylates or methacrylates
US5578419A (en) 1991-12-12 1996-11-26 Mitsui Toatsu Chemicals, Incorporated Dyes for color filters, and photosensitive resist resin composition containing the same
EP0633296B1 (en) * 1993-07-09 1999-10-13 Mitsui Chemicals, Inc. Novel dyestuffs and their use
US5691101A (en) * 1994-03-15 1997-11-25 Kabushiki Kaisha Toshiba Photosensitive composition
DE59507879D1 (de) 1994-09-23 2000-04-06 Ciba Sc Holding Ag Verfahren zur Herstellung von bromierten, Alkoxy-substituierten Metall-Phthalocyaninen
US5810934A (en) * 1995-06-07 1998-09-22 Advanced Silicon Materials, Inc. Silicon deposition reactor apparatus
EP0763580B1 (en) * 1995-09-11 2003-08-13 Toyo Ink Manufacturing Co., Ltd. Aqueous type pigment dispersing agent, composition containing the same and aqueous pigment dispersion
JP3653855B2 (ja) 1996-04-15 2005-06-02 三菱化学株式会社 フタロシアニン化合物及びそれを用いた光学記録媒体
EP0929609B1 (en) * 1996-10-03 2002-06-19 Ciba SC Holding AG Substituted phthalocyanines and their use
JP3286905B2 (ja) 1997-08-04 2002-05-27 株式会社リコー フタロシアニン化合物
JP4523679B2 (ja) 1998-06-22 2010-08-11 太陽インキ製造株式会社 ハロゲンフリーの着色顔料を用いたプリント配線板用緑色レジストインキ組成物
WO2000017275A1 (de) * 1998-09-21 2000-03-30 Ciba Specialty Chemicals Holding Inc. Substituierte phthalocyanine
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Also Published As

Publication number Publication date
JP2006508381A (ja) 2006-03-09
EP1565789B1 (en) 2009-12-30
EP1565789A2 (en) 2005-08-24
AU2003298293A1 (en) 2004-06-18
KR101081756B1 (ko) 2011-11-10
WO2004049070A2 (en) 2004-06-10
ATE453877T1 (de) 2010-01-15
CN1717627A (zh) 2006-01-04
CN100549825C (zh) 2009-10-14
US8034531B2 (en) 2011-10-11
CA2507471A1 (en) 2004-06-10
DE60330802D1 (de) 2010-02-11
US20050282923A1 (en) 2005-12-22
KR20050084033A (ko) 2005-08-26
WO2004049070A3 (en) 2004-07-22
TW200421022A (en) 2004-10-16
JP4390707B2 (ja) 2009-12-24
MXPA05005682A (es) 2005-07-26

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]