BR112019016830A2 - objeto impresso 3d com dispositivo de detecção embutido - Google Patents

objeto impresso 3d com dispositivo de detecção embutido Download PDF

Info

Publication number
BR112019016830A2
BR112019016830A2 BR112019016830A BR112019016830A BR112019016830A2 BR 112019016830 A2 BR112019016830 A2 BR 112019016830A2 BR 112019016830 A BR112019016830 A BR 112019016830A BR 112019016830 A BR112019016830 A BR 112019016830A BR 112019016830 A2 BR112019016830 A2 BR 112019016830A2
Authority
BR
Brazil
Prior art keywords
detection device
printed object
built
electrically conductive
conductive channel
Prior art date
Application number
BR112019016830A
Other languages
English (en)
Other versions
BR112019016830B1 (pt
Inventor
J Dispoto Gary
Zhao Lihua
Huang Wei
Original Assignee
Hewlett Packard Development Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co filed Critical Hewlett Packard Development Co
Publication of BR112019016830A2 publication Critical patent/BR112019016830A2/pt
Publication of BR112019016830B1 publication Critical patent/BR112019016830B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
    • B29C70/882—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced partly or totally electrically conductive, e.g. for EMI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/041—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/045—Circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
    • G01N27/20—Investigating the presence of flaws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0007—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Powder Metallurgy (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

de acordo com um exemplo, um objeto impresso tridimensional (3d) pode incluir um corpo formado de um material não condutivo eletricamente. além disso, um canal condutivo eletricamente, um dispositivo de detecção e um emissor de sinal podem ser embutidos dentro do corpo. o dispositivo de detecção pode ficar em comunicação elétrica com o canal condutivo eletricamente de tal maneira que o dispositivo de detecção é afetado por uma interrupção em uma corrente aplicada ao canal condutivo eletricamente. além disso, o emissor de sinal pode emitir um sinal sem fio em resposta ao dispositivo de detecção ser afetado por uma interrupção na corrente aplicada.
BR112019016830-3A 2017-02-14 2017-02-14 Objeto impresso 3d com dispositivo de detecção embutido BR112019016830B1 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2017/017825 WO2018151706A1 (en) 2017-02-14 2017-02-14 3d printed object with embedded sensing device

Publications (2)

Publication Number Publication Date
BR112019016830A2 true BR112019016830A2 (pt) 2020-04-07
BR112019016830B1 BR112019016830B1 (pt) 2022-06-07

Family

ID=63169807

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112019016830-3A BR112019016830B1 (pt) 2017-02-14 2017-02-14 Objeto impresso 3d com dispositivo de detecção embutido

Country Status (7)

Country Link
US (1) US10967559B2 (pt)
EP (1) EP3538347B1 (pt)
JP (1) JP6790294B2 (pt)
KR (1) KR102230528B1 (pt)
CN (1) CN110300652B (pt)
BR (1) BR112019016830B1 (pt)
WO (1) WO2018151706A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12138860B2 (en) 2019-04-29 2024-11-12 Hewlett-Packard Development Company, L.P. Three-dimensional printing conductive elements
WO2021154601A1 (en) * 2020-01-28 2021-08-05 Rn Technologies, Llc Additive manufacturing of devices from assemblies of discretized component voxel elements
US20240096454A1 (en) * 2022-09-16 2024-03-21 Lawrence Livermore National Security, Llc High Throughput Materials Screening
US12474238B2 (en) * 2022-09-16 2025-11-18 Lawrence Livermore National Security, Llc High throughput materials screening

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06130039A (ja) * 1992-10-14 1994-05-13 Honda Motor Co Ltd 繊維強化プラスチック部材の欠陥検出方法
JPH06160356A (ja) * 1992-11-26 1994-06-07 Honda Motor Co Ltd 繊維強化プラスチック部材の欠陥検出方法
CA2638024A1 (en) 2006-01-26 2007-08-02 National Research Council Of Canada Surface-mounted crack detection
JP2009006538A (ja) * 2007-06-27 2009-01-15 Seiko Epson Corp 三次元造形装置、および三次元造形方法
US7621193B2 (en) 2007-11-16 2009-11-24 The Boeing Company Fracture detecting structural health sensor
WO2010065503A2 (en) 2008-12-01 2010-06-10 University Of Massachusetts Lowell Conductive formulations for use in electrical, electronic and rf applications
WO2012048237A2 (en) * 2010-10-08 2012-04-12 Checkit Technologies, Llc Structural integrity system and methods
US8665479B2 (en) * 2012-02-21 2014-03-04 Microsoft Corporation Three-dimensional printing
US20140120196A1 (en) * 2012-10-29 2014-05-01 Makerbot Industries, Llc Quick-release extruder
GB201223303D0 (en) * 2012-12-21 2013-02-06 Hexcel Composites Sarl Method of producing a shaped component
CN105408095A (zh) * 2013-06-24 2016-03-16 哈佛学院院长等 打印的三维(3d)功能部件及其制造方法
US20150201500A1 (en) * 2014-01-12 2015-07-16 Zohar SHINAR System, device, and method of three-dimensional printing
EP3094967A4 (en) * 2014-01-17 2017-01-25 United Technologies Corporation An additive manufacturing system with ultrasonic inspection and method of operation
WO2015112641A1 (en) 2014-01-21 2015-07-30 Quest Integrated, Inc, Fuse-like sensor, detection and measurement systems
JP6347543B2 (ja) 2014-06-30 2018-06-27 株式会社日立国際電気 クリーニング方法、半導体装置の製造方法、基板処理装置およびプログラム
JP5715289B1 (ja) * 2014-09-09 2015-05-07 丸井 智敬 ３ｄプリンタで作製された三次元造形物による電気機器。
WO2016094827A1 (en) * 2014-12-12 2016-06-16 Velo3D, Inc. Feedback control systems for three-dimensional printing
US20160349215A1 (en) * 2014-12-23 2016-12-01 Edison Welding Institute, Inc. Non-destructive evaluation of additive manufacturing components using an eddy current array system and method
US9887356B2 (en) * 2015-01-23 2018-02-06 The Trustees Of Princeton University 3D printed active electronic materials and devices
WO2016146374A1 (en) * 2015-03-17 2016-09-22 Philips Lighting Holding B.V. Making 3d printed shapes with interconnects and embedded components.
JP2017535725A (ja) 2015-04-07 2017-11-30 ニュー ハンプシャー ボール ベアリング インコーポレイテッド 摩耗センサを有する軸受
CN105751519B (zh) * 2016-05-17 2017-12-08 航天海鹰光电科技发展（天津）有限公司 3d打印机的安全控制系统及控制方法
CN109311221B (zh) * 2016-07-21 2022-08-05 惠普发展公司，有限责任合伙企业 具有导电通道的以增材方式形成的3d物体
WO2018022034A1 (en) * 2016-07-27 2018-02-01 Hewlett-Packard Development Company, L.P. Forming three-dimensional (3d) electronic parts
CN106313573A (zh) 2016-08-31 2017-01-11 青岛理工大学 一种嵌入式电子产品3d打印方法

Also Published As

Publication number Publication date
US10967559B2 (en) 2021-04-06
WO2018151706A1 (en) 2018-08-23
KR20190100411A (ko) 2019-08-28
EP3538347A4 (en) 2020-06-24
EP3538347B1 (en) 2022-03-30
JP6790294B2 (ja) 2020-11-25
CN110300652B (zh) 2022-05-17
JP2020506098A (ja) 2020-02-27
CN110300652A (zh) 2019-10-01
EP3538347A1 (en) 2019-09-18
BR112019016830B1 (pt) 2022-06-07
US20190351607A1 (en) 2019-11-21
KR102230528B1 (ko) 2021-03-22

Similar Documents

Publication Publication Date Title
BR112019016830A2 (pt) objeto impresso 3d com dispositivo de detecção embutido
BR112015032543A2 (pt) Parte funcional tridimensional (3d) impressa, método de impressão de uma parte funcional tridimensional (3d) e impressora 3d
MX2023013994A (es) Deteccion de calada y circuitos de alimentacion para dispositivos vaporizadores.
GB2539154A (en) Grounding for electrical connectors
MX385142B (es) Dispositivo electrónico con antena de armazón metálico.
CL2017002143A1 (es) Señalización de control que soporta programación multi-prioridad
MY182125A (en) Ion generation device and electrical device
MX2013012554A (es) Contacto conductivo modular para bloques de construccion.
MX2016015060A (es) Subaislador.
AU2017245894A1 (en) Improvements relating to textiles incorporating electronic devices
WO2017160468A8 (en) Systems and methods for electromagnetic interference shielding
TW201613501A (en) Welded shoe assembly
MX383287B (es) Montaje de conector de placa de circuito impreso que tiene protector de contacto con miembros de fijacion integrales.
BR112015031143A2 (pt) aparelho elétrico e método para injeção de sinal
BR112015020608A2 (pt) conjunto do conector de desconexão rápida
MX2015015477A (es) Dispositivo manual adecuado para una pantalla capacitiva.
MX2014008595A (es) Material dielectrico flexible para interruptor de alto voltaje.
BR112017005556A2 (pt) vidraça de aquecimento e de blindagem eletromagnética
BR112015023536A2 (pt) dispositivo compacto de geração de raios x
MY174108A (en) Lightning protection for vehicles
MX2017006059A (es) Conjunto de cables y metodo para la fabricacion de conjuntos de cables.
EP3544788A4 (en) INCREASED ELECTRICAL CONDUCTIVITY AT SELECTED LOCATIONS OF A 3D OBJECT
MX348371B (es) Mecanismos de contacto para montajes de receptáculo eléctrico.
MX2018014350A (es) Capsula de inhibidor de oxido.
TWD164746S (zh) 電連接器

Legal Events

Date Code Title Description
B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 14/02/2017, OBSERVADAS AS CONDICOES LEGAIS

B25A Requested transfer of rights approved

Owner name: PERIDOT PRINT LLC (US)