BR8107128A - Modulo de circuito integrado reparavel - Google Patents

Modulo de circuito integrado reparavel

Info

Publication number
BR8107128A
BR8107128A BR8107128A BR8107128A BR8107128A BR 8107128 A BR8107128 A BR 8107128A BR 8107128 A BR8107128 A BR 8107128A BR 8107128 A BR8107128 A BR 8107128A BR 8107128 A BR8107128 A BR 8107128A
Authority
BR
Brazil
Prior art keywords
integrated circuit
circuit module
repaired integrated
repaired
module
Prior art date
Application number
BR8107128A
Other languages
English (en)
Inventor
Daniel Marshall Andrews
Carl Edward Hoge
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of BR8107128A publication Critical patent/BR8107128A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07339—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by cooling, e.g. thermoplastics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
BR8107128A 1980-11-03 1981-11-03 Modulo de circuito integrado reparavel BR8107128A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20334080A 1980-11-03 1980-11-03

Publications (1)

Publication Number Publication Date
BR8107128A true BR8107128A (pt) 1982-07-20

Family

ID=22753575

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8107128A BR8107128A (pt) 1980-11-03 1981-11-03 Modulo de circuito integrado reparavel

Country Status (3)

Country Link
EP (1) EP0051165A1 (pt)
JP (1) JPS57104234A (pt)
BR (1) BR8107128A (pt)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4624724A (en) * 1985-01-17 1986-11-25 General Electric Company Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base
CN87107692A (zh) * 1986-11-13 1988-05-25 Mt化学公司 半导体器件的制造方法
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
CA1290676C (en) * 1987-03-30 1991-10-15 William Frank Graham Method for bonding integrated circuit chips
EP0384704A3 (en) * 1989-02-21 1991-05-08 General Electric Company Die attach material and die attach process
US5225023A (en) * 1989-02-21 1993-07-06 General Electric Company High density interconnect thermoplastic die attach material and solvent die attach processing
US5032896A (en) * 1989-08-31 1991-07-16 Hughes Aircraft Company 3-D integrated circuit assembly employing discrete chips
US5372883A (en) * 1990-03-20 1994-12-13 Staystik, Inc. Die attach adhesive film, application method and devices incorporating the same
JP2927982B2 (ja) * 1991-03-18 1999-07-28 ジャパンゴアテックス株式会社 半導体装置
DE4225154A1 (de) * 1992-07-30 1994-02-03 Meyerhoff Dieter Chip-Modul
JP2707189B2 (ja) * 1992-08-26 1998-01-28 株式会社日立製作所 電子部品の基板からの取外し方法及び装置
KR0129119B1 (ko) * 1992-11-27 1998-04-07 모리시다 요이찌 반도체칩의 제거방법 및 제거장치
US5268048A (en) * 1992-12-10 1993-12-07 Hewlett-Packard Company Reworkable die attachment
DE4413529C2 (de) * 1994-04-15 1996-07-25 Tele Filter Tft Gmbh Verfahren zur Herstellung elektronischer Oberflächenwellenbauelemente sowie ein nach dem Verfahren hergestelltes elektronisches Bauelement
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
US6960636B2 (en) 1994-09-02 2005-11-01 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US6852814B2 (en) 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
DE19609806A1 (de) * 1996-03-13 1997-09-18 Diehl Gmbh & Co Multichip-Modul und Verfahren zum Lösen von Dies aus der Substrat-Montageebene
DE19638668A1 (de) * 1996-09-20 1998-04-02 Siemens Components A T Verfahren zum Ablösen von mittels Lead-On-Chip-Montage an einem Leadframe befestigten Chips
US6111323A (en) * 1997-12-30 2000-08-29 International Business Machines Corporation Reworkable thermoplastic encapsulant
US5998876A (en) * 1997-12-30 1999-12-07 International Business Machines Corporation Reworkable thermoplastic hyper-branched encapsulant
US6063828A (en) * 1998-07-02 2000-05-16 National Starch And Chemical Investment Holding Corporation Underfill encapsulant compositions for use in electronic devices
US6281314B1 (en) 1998-07-02 2001-08-28 National Starch And Chemical Investment Holding Corporation Compositions for use in the fabrication of circuit components and printed wire boards
SG105450A1 (en) 1998-07-02 2004-08-27 Nat Starch Chem Invest Allylated amide compounds and die attach adhesives prepared therefrom
US6057381A (en) 1998-07-02 2000-05-02 National Starch And Chemical Investment Holding Corporation Method of making an electronic component using reworkable underfill encapsulants
US6316566B1 (en) 1998-07-02 2001-11-13 National Starch And Chemical Investment Holding Corporation Package encapsulant compositions for use in electronic devices
US6350840B1 (en) 1998-07-02 2002-02-26 National Starch And Chemical Investment Holding Corporation Underfill encapsulants prepared from allylated amide compounds
FR2791471B1 (fr) * 1999-03-22 2002-01-25 Gemplus Card Int Procede de fabrication de puces de circuits integres
DE10051938A1 (de) * 2000-10-19 2002-02-28 Infineon Technologies Ag Anordnung mit einem Substrat und einem Träger
DE10213879C1 (de) * 2002-03-27 2003-07-10 Infineon Technologies Ag Elektronisches Bauteil
DE10250541B9 (de) * 2002-10-29 2004-09-16 Infineon Technologies Ag Elektronisches Bauteil mit Unterfüllstoffen aus Thermoplasten und Verfahren zu dessen Herstellung

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3805123A (en) * 1972-12-12 1974-04-16 Itt Arrangement for adhesively joining heat-dissipating circuit components to heat sinks and method of making them
US4012832A (en) * 1976-03-12 1977-03-22 Sperry Rand Corporation Method for non-destructive removal of semiconductor devices
US4184133A (en) * 1977-11-28 1980-01-15 Rockwell International Corporation Assembly of microwave integrated circuits having a structurally continuous ground plane

Also Published As

Publication number Publication date
EP0051165A1 (en) 1982-05-12
JPS57104234A (en) 1982-06-29

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