BR8400007A - AQUEOUS ALKALINE ELECTRICIDE CYANIDE FREE, PROCESS FOR ELECTROSPOSITION OF A REFINED, DUTY AND ADHESIVE GRAIN COPPER COATING ON A CONDUCTIVE SUBSTRATE, AND SUITABLE ANODE FOR USE ON THE COPPER ELECTROSPOSITION ON A CONDUCTING ELECTRIC STORAGE, LEFT - Google Patents

AQUEOUS ALKALINE ELECTRICIDE CYANIDE FREE, PROCESS FOR ELECTROSPOSITION OF A REFINED, DUTY AND ADHESIVE GRAIN COPPER COATING ON A CONDUCTIVE SUBSTRATE, AND SUITABLE ANODE FOR USE ON THE COPPER ELECTROSPOSITION ON A CONDUCTING ELECTRIC STORAGE, LEFT

Info

Publication number
BR8400007A
BR8400007A BR8400007A BR8400007A BR8400007A BR 8400007 A BR8400007 A BR 8400007A BR 8400007 A BR8400007 A BR 8400007A BR 8400007 A BR8400007 A BR 8400007A BR 8400007 A BR8400007 A BR 8400007A
Authority
BR
Brazil
Prior art keywords
electrosposition
copper
electricide
refined
duty
Prior art date
Application number
BR8400007A
Other languages
Portuguese (pt)
Inventor
Lillie C Tomaszewski
Thaddeus W Tomaszewski
Robert A Tremmel
Original Assignee
Omi Int Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/455,353 external-priority patent/US4469569A/en
Priority claimed from US06/551,135 external-priority patent/US4462874A/en
Application filed by Omi Int Corp filed Critical Omi Int Corp
Publication of BR8400007A publication Critical patent/BR8400007A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
BR8400007A 1983-01-03 1984-01-02 AQUEOUS ALKALINE ELECTRICIDE CYANIDE FREE, PROCESS FOR ELECTROSPOSITION OF A REFINED, DUTY AND ADHESIVE GRAIN COPPER COATING ON A CONDUCTIVE SUBSTRATE, AND SUITABLE ANODE FOR USE ON THE COPPER ELECTROSPOSITION ON A CONDUCTING ELECTRIC STORAGE, LEFT BR8400007A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/455,353 US4469569A (en) 1983-01-03 1983-01-03 Cyanide-free copper plating process
US06/551,135 US4462874A (en) 1983-11-16 1983-11-16 Cyanide-free copper plating process

Publications (1)

Publication Number Publication Date
BR8400007A true BR8400007A (en) 1984-07-31

Family

ID=27037829

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8400007A BR8400007A (en) 1983-01-03 1984-01-02 AQUEOUS ALKALINE ELECTRICIDE CYANIDE FREE, PROCESS FOR ELECTROSPOSITION OF A REFINED, DUTY AND ADHESIVE GRAIN COPPER COATING ON A CONDUCTIVE SUBSTRATE, AND SUITABLE ANODE FOR USE ON THE COPPER ELECTROSPOSITION ON A CONDUCTING ELECTRIC STORAGE, LEFT

Country Status (8)

Country Link
AU (1) AU575037B2 (en)
BR (1) BR8400007A (en)
CA (1) CA1225064A (en)
DE (1) DE3347593A1 (en)
ES (2) ES528624A0 (en)
FR (1) FR2538815B1 (en)
GB (2) GB2133040B (en)
MX (1) MX165687B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4933051A (en) * 1989-07-24 1990-06-12 Omi International Corporation Cyanide-free copper plating process
CA2053342A1 (en) * 1990-10-22 1992-04-23 Robert A. Tremmel Nickel electroplating process with reduced nickel ion build up
KR100877923B1 (en) * 2001-06-07 2009-01-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨 Electrolytic Copper Plating
RU2334831C2 (en) * 2006-10-31 2008-09-27 Федеральное государственное унитарное предприятие "Калужский научно-исследовательский институт телемеханических устройств" Electrolyte of copper coating
CN102605401B (en) * 2012-03-23 2015-11-18 如皋市易达电子有限责任公司 The online tin recovery structure of a kind of surface processing trough
DE102013021502A1 (en) 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Electrically conductive fluids based on metal diphosphonate complexes
CN113652720B (en) * 2021-07-15 2023-06-13 江门市瑞期精细化学工程有限公司 Cyanide-free copper plating bottoming method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB539882A (en) * 1939-09-16 1941-09-26 Mond Nickel Co Ltd Improvements relating to apparatus for electroplating
DE1496916B1 (en) * 1964-09-22 1969-10-23 Monsanto Co Cyanide-free, galvanic bath and process for the deposition of galvanic coatings
US3796634A (en) * 1970-03-19 1974-03-12 Us Health Education & Welfare Insolubilized biologically active enzymes
BE791401A (en) * 1971-11-15 1973-05-14 Monsanto Co ELECTROCHEMICAL COMPOSITIONS AND PROCESSES
NL7306732A (en) * 1972-05-17 1973-11-20
US3806429A (en) * 1972-07-03 1974-04-23 Oxy Metal Finishing Corp Electrodeposition of bright nickel-iron deposits,electrolytes therefor and coating an article with a composite nickel-iron,chromium coating
US3833486A (en) * 1973-03-26 1974-09-03 Lea Ronal Inc Cyanide-free electroplating
US3914162A (en) * 1973-06-25 1975-10-21 Monsanto Co Compositions and process for the electrodeposition of metals
US3928147A (en) * 1973-10-09 1975-12-23 Monsanto Co Method for electroplating
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
GB1419613A (en) * 1974-06-13 1975-12-31 Lea Ronal Inc Cyanidefree electroplating baths
US3974044A (en) * 1975-03-31 1976-08-10 Oxy Metal Industries Corporation Bath and method for the electrodeposition of bright nickel-iron deposits
US4179343A (en) * 1979-02-12 1979-12-18 Oxy Metal Industries Corporation Electroplating bath and process for producing bright, high-leveling nickel iron electrodeposits
DE3012168A1 (en) * 1980-03-27 1981-10-01 Schering Ag Berlin Und Bergkamen, 1000 Berlin METHOD FOR GALVANIC DEPOSITION OF COPPER DEPOSITS

Also Published As

Publication number Publication date
GB8529856D0 (en) 1986-01-15
DE3347593C2 (en) 1990-05-31
GB2133040A (en) 1984-07-18
FR2538815B1 (en) 1990-02-02
ES8501454A1 (en) 1984-12-01
AU2305483A (en) 1984-07-05
CA1225064A (en) 1987-08-04
GB2167447B (en) 1987-03-04
ES535227A0 (en) 1985-06-16
GB2167447A (en) 1986-05-29
MX165687B (en) 1992-11-27
DE3347593A1 (en) 1984-07-05
AU575037B2 (en) 1988-07-21
GB8400009D0 (en) 1984-02-08
ES528624A0 (en) 1984-12-01
FR2538815A1 (en) 1984-07-06
ES8506112A1 (en) 1985-06-16
GB2133040B (en) 1987-02-04

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Legal Events

Date Code Title Description
B21A Expiry acc. art. 78, item i of ipl- expiry of the term of protection

Free format text: PATENTE EXTINTA EM 02/01/99