BR8904662A - Processo para a fabricacao de circuito eletronico flexivel aperfeicoado,pela aplicacao,como um adesivo de laminacao,de uma dispersao aquosa de um polimero de latex insoluvel em agua,especialmente modificado - Google Patents

Processo para a fabricacao de circuito eletronico flexivel aperfeicoado,pela aplicacao,como um adesivo de laminacao,de uma dispersao aquosa de um polimero de latex insoluvel em agua,especialmente modificado

Info

Publication number
BR8904662A
BR8904662A BR898904662A BR8904662A BR8904662A BR 8904662 A BR8904662 A BR 8904662A BR 898904662 A BR898904662 A BR 898904662A BR 8904662 A BR8904662 A BR 8904662A BR 8904662 A BR8904662 A BR 8904662A
Authority
BR
Brazil
Prior art keywords
water
manufacture
electronic circuit
application
flexible electronic
Prior art date
Application number
BR898904662A
Other languages
English (en)
Inventor
Yen-Yau Harrison Chao
Albert Steven Will
Reginald T Smart
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of BR8904662A publication Critical patent/BR8904662A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/003—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained by reactions only involving unsaturated carbon-to-carbon bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Graft Or Block Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
BR898904662A 1988-09-16 1989-09-15 Processo para a fabricacao de circuito eletronico flexivel aperfeicoado,pela aplicacao,como um adesivo de laminacao,de uma dispersao aquosa de um polimero de latex insoluvel em agua,especialmente modificado BR8904662A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US24543088A 1988-09-16 1988-09-16

Publications (1)

Publication Number Publication Date
BR8904662A true BR8904662A (pt) 1990-05-01

Family

ID=22926622

Family Applications (1)

Application Number Title Priority Date Filing Date
BR898904662A BR8904662A (pt) 1988-09-16 1989-09-15 Processo para a fabricacao de circuito eletronico flexivel aperfeicoado,pela aplicacao,como um adesivo de laminacao,de uma dispersao aquosa de um polimero de latex insoluvel em agua,especialmente modificado

Country Status (16)

Country Link
EP (1) EP0359562A3 (pt)
JP (1) JPH02169679A (pt)
KR (1) KR900004767A (pt)
CN (1) CN1043331A (pt)
AU (1) AU4128289A (pt)
BR (1) BR8904662A (pt)
CA (1) CA1331442C (pt)
DK (1) DK455489A (pt)
FI (1) FI894373L (pt)
IE (1) IE892901L (pt)
IL (1) IL91621A0 (pt)
MX (1) MX174443B (pt)
NO (1) NO893673L (pt)
NZ (1) NZ230635A (pt)
PH (1) PH27583A (pt)
ZA (1) ZA897012B (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4213969A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213968A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213965A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213967A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersion
DE4213964A1 (de) * 1992-04-29 1993-11-04 Basf Ag Waessrige polymerisatdispersionen
DE4307683A1 (de) * 1993-03-11 1994-09-15 Basf Ag Verfahren zur Herstellung einer wäßrigen Polymerisatdispersion
CN1154671C (zh) 1996-09-09 2004-06-23 巴斯福股份公司 聚合物水分散体的制备方法
US7179531B2 (en) 2002-09-12 2007-02-20 Rohm And Haas Company Polymer particles having select pendant groups and composition prepared therefrom
JP5251518B2 (ja) * 2007-01-22 2013-07-31 信越化学工業株式会社 粘着剤組成物及び粘着剤付き光学フィルム
CN102286127B (zh) 2010-06-18 2014-12-10 罗门哈斯公司 含微区域的乳液聚合物
TWI865571B (zh) * 2019-09-03 2024-12-11 美商羅門哈斯公司 黏著劑組成物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3616195A (en) * 1968-12-26 1971-10-26 Richardson Co Printed circuit board having metal layer bonded to hydrocarbon base and method of making it
CA1284695C (en) * 1984-12-20 1991-06-04 Rohm And Haas Company Modified latex polymer compositions

Also Published As

Publication number Publication date
IL91621A0 (en) 1990-04-29
IE892901L (en) 1990-03-16
FI894373A7 (fi) 1990-03-17
ZA897012B (en) 1991-12-24
AU4128289A (en) 1990-03-22
DK455489D0 (da) 1989-09-15
EP0359562A3 (en) 1991-09-11
FI894373L (fi) 1990-03-17
MX174443B (es) 1994-05-17
KR900004767A (ko) 1990-04-13
CN1043331A (zh) 1990-06-27
FI894373A0 (fi) 1989-09-15
DK455489A (da) 1990-03-17
NZ230635A (en) 1992-04-28
JPH02169679A (ja) 1990-06-29
CA1331442C (en) 1994-08-16
EP0359562A2 (en) 1990-03-21
PH27583A (en) 1993-08-18
NO893673D0 (no) 1989-09-14
NO893673L (no) 1990-03-19

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