Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/0213—Electrical arrangements not otherwise provided for
  • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
  • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
  • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
  • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K9/00—Screening of apparatus or components against electric or magnetic fields
  • H05K9/0007—Casings
  • H05K9/002—Casings with localised screening
  • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/70—Coupling devices
  • H01R12/71—Coupling devices for rigid printing circuits or like structures
  • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
  • H01R12/716—Coupling device provided on the PCB
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
  • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
  • H01R12/70—Coupling devices
  • H01R12/71—Coupling devices for rigid printing circuits or like structures
  • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
  • H01R12/716—Coupling device provided on the PCB
  • H01R12/718—Contact members provided on the PCB without an insulating housing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/04—Assemblies of printed circuits
  • H05K2201/044—Details of backplane or midplane for mounting orthogonal PCBs

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Electromagnetism (AREA)
• Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
• Structure Of Printed Boards (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)
• Multi-Conductor Connections (AREA)
• Bending Of Plates, Rods, And Pipes (AREA)
• Panels For Use In Building Construction (AREA)
• Mounting Of Printed Circuit Boards And The Like (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=6471686

Family Applications (1)

Country Status (7)

Families Citing this family (3)

Family Cites Families (9)

• 1992
  • 1992-10-29 DE DE4236593A patent/DE4236593A1/de not_active Ceased
• 1993
  • 1993-10-08 WO PCT/DE1993/000956 patent/WO1994010824A1/de not_active Ceased
  • 1993-10-08 AT AT93921807T patent/ATE147929T1/de not_active IP Right Cessation
  • 1993-10-08 EP EP93921807A patent/EP0667094B1/de not_active Expired - Lifetime
  • 1993-10-08 BR BR9307345A patent/BR9307345A/pt not_active IP Right Cessation
  • 1993-10-08 DE DE59305177T patent/DE59305177D1/de not_active Expired - Fee Related
  • 1993-10-08 JP JP6510527A patent/JPH08502627A/ja active Pending
  • 1993-10-29 CN CN93119807A patent/CN1051905C/zh not_active Expired - Fee Related

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