BR9906873A - Eletrodeposição de metais em pequenos recessos usando campos elétricos modulados - Google Patents

Eletrodeposição de metais em pequenos recessos usando campos elétricos modulados

Info

Publication number
BR9906873A
BR9906873A BR9906873-7A BR9906873A BR9906873A BR 9906873 A BR9906873 A BR 9906873A BR 9906873 A BR9906873 A BR 9906873A BR 9906873 A BR9906873 A BR 9906873A
Authority
BR
Brazil
Prior art keywords
pulses
substrate
micrometers
metals
electric fields
Prior art date
Application number
BR9906873-7A
Other languages
English (en)
Inventor
E Jennings Taylor
Jenny J Sun
Chengdong Zhou
Original Assignee
Faraday Technology Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/172,299 external-priority patent/US6203684B1/en
Priority claimed from US09/239,811 external-priority patent/US6210555B1/en
Application filed by Faraday Technology Inc filed Critical Faraday Technology Inc
Publication of BR9906873A publication Critical patent/BR9906873A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9413—Dispositions of bond pads on encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

Patente de Invenção: "ELETRODEPOSIçãO DE METAIS EM PEQUENOS RECESSOS UTILIZANDO CAMPOS ELéTRICOS MODULADOS". Uma camada de um metal é eletrogalvanizada sobre um substrato eletricamente condutor possuindo uma superfície geralmente lisa com um pequeno recesso na mesma, possuindo uma dimensão transversal não maior do que cerca de 350 micrometros, tipicamente cerca de 5 micrometros a cerca de 350 micrometros, pela imersão do substrato e um contraeletrodo em um banho de eletrogalvanização do metal a ser eletrogalvanizado e passando uma corrente elétrica de reversão modulada entre os eletrodos. A corrente contém pulsos que são catódicos com relação ao substrato e pulsos que são anódicos com relação ao substrato. Os pulsos catódicos possuem um ciclo de trabalho menor do que cerca de 50% e os pulsos anódicos possuem um ciclo de trabalho maior do que cerca de 50%, a taxa de transferência de carga dos pulsos catódicos para os pulsos anódicos é maior do que um, e a freq³ência dos pulsos varia de cerca de 10 Hertz a cerca de 12000 Hertz.
BR9906873-7A 1998-10-14 1999-10-14 Eletrodeposição de metais em pequenos recessos usando campos elétricos modulados BR9906873A (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/172,299 US6203684B1 (en) 1998-10-14 1998-10-14 Pulse reverse electrodeposition for metallization and planarization of a semiconductor substrates
US09/239,811 US6210555B1 (en) 1999-01-29 1999-01-29 Electrodeposition of metals in small recesses for manufacture of high density interconnects using reverse pulse plating
PCT/US1999/023653 WO2000022193A2 (en) 1998-10-14 1999-10-14 Electrodeposition of metals in small recesses using modulated electric fields

Publications (1)

Publication Number Publication Date
BR9906873A true BR9906873A (pt) 2002-01-02

Family

ID=26867931

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9906873-7A BR9906873A (pt) 1998-10-14 1999-10-14 Eletrodeposição de metais em pequenos recessos usando campos elétricos modulados

Country Status (10)

Country Link
US (1) US6303014B1 (pt)
EP (1) EP1070159A4 (pt)
JP (1) JP2002527621A (pt)
KR (1) KR20010033089A (pt)
CN (1) CN1180133C (pt)
AU (1) AU765242B2 (pt)
BR (1) BR9906873A (pt)
CA (1) CA2314109A1 (pt)
MX (1) MXPA00005871A (pt)
WO (1) WO2000022193A2 (pt)

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Also Published As

Publication number Publication date
US6303014B1 (en) 2001-10-16
AU1444300A (en) 2000-05-01
AU765242B2 (en) 2003-09-11
CN1342220A (zh) 2002-03-27
EP1070159A4 (en) 2004-06-09
KR20010033089A (ko) 2001-04-25
CN1180133C (zh) 2004-12-15
CA2314109A1 (en) 2000-04-20
WO2000022193A2 (en) 2000-04-20
MXPA00005871A (es) 2002-08-06
EP1070159A1 (en) 2001-01-24
WO2000022193A3 (en) 2001-04-12
JP2002527621A (ja) 2002-08-27

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