BR9907751A - Dispositivo eletrônico com memória eletrônica sem contato, e processo de fabricação desse dispositivo. - Google Patents

Dispositivo eletrônico com memória eletrônica sem contato, e processo de fabricação desse dispositivo.

Info

Publication number
BR9907751A
BR9907751A BR9907751-5A BR9907751A BR9907751A BR 9907751 A BR9907751 A BR 9907751A BR 9907751 A BR9907751 A BR 9907751A BR 9907751 A BR9907751 A BR 9907751A
Authority
BR
Brazil
Prior art keywords
electronic
contact
manufacturing process
electronic device
sheet
Prior art date
Application number
BR9907751-5A
Other languages
English (en)
Inventor
Laurent Oddou
Stephane Ayala
Michael Zafrany
Philippe Patrice
Gerard Bourneix
David Martin
Ray Freeman
Original Assignee
Gemplus Card Int
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card Int filed Critical Gemplus Card Int
Publication of BR9907751A publication Critical patent/BR9907751A/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Devices For Checking Fares Or Tickets At Control Points (AREA)

Abstract

Resumo de Patente de Invenção para <B>DISPOSITIVO ELETRôNICO COM MEMóRIA ELETRôNICA SEM CONTATO, E PROCESSO DE FABRICAçãO DESSE DISPOSITIVO''<D> A invenção diz respeito a um dispositivo eletrônico sem contato (10), tal como um cartão, uma etiqueta, um tíquete ou uma ficha, que comporta pelo menos um microcircuito eletrônico (20) que é disposto na espessura de um suporte rígido ou semi-rígido e que comporta cabos ligados (26) a uma antena de interface (24) disposta na espessura do suporte, sendo que este último comporta ao menos duas folhas opostas, inferior (12) e superior (14), de proteção, caracterizado pelo fato de compreender um empilhamento de uma folha inferior de proteção (12) cuja face interna (22) comporta pelo menos um microcircuito eletrônico e pelo menos uma antena de interface (24); de uma folha intermediária (14) de colagem cujas duas faces opostas inferior e superior são munidas de cola; e de uma folha superior de proteção (16).
BR9907751-5A 1998-02-27 1999-02-10 Dispositivo eletrônico com memória eletrônica sem contato, e processo de fabricação desse dispositivo. BR9907751A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9802727A FR2775533B1 (fr) 1998-02-27 1998-02-27 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif
PCT/FR1999/000291 WO1999044172A1 (fr) 1998-02-27 1999-02-10 Dispositif electronique a memoire electronique sans contact, et procede de fabrication d'un tel dispositif

Publications (1)

Publication Number Publication Date
BR9907751A true BR9907751A (pt) 2000-10-17

Family

ID=9523715

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9907751-5A BR9907751A (pt) 1998-02-27 1999-02-10 Dispositivo eletrônico com memória eletrônica sem contato, e processo de fabricação desse dispositivo.

Country Status (8)

Country Link
EP (1) EP1057139A1 (pt)
JP (1) JP2002505488A (pt)
CN (1) CN1292129A (pt)
AU (1) AU2428699A (pt)
BR (1) BR9907751A (pt)
CA (1) CA2321893A1 (pt)
FR (1) FR2775533B1 (pt)
WO (1) WO1999044172A1 (pt)

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
FR2801707B1 (fr) * 1999-11-29 2002-02-15 A S K Procede de fabrication d'une carte a puce hybride contact- sans contact avec un support d'antenne en materiau fibreux
FR2801708B1 (fr) * 1999-11-29 2003-12-26 A S K Procede de fabrication d'une carte a puce sans contact avec un support d'antenne en materiau fibreux
US6951596B2 (en) 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
GB0106082D0 (en) 2001-03-13 2001-05-02 Mat & Separations Tech Int Ltd Method and equipment for removing volatile compounds from air
FR2824018B1 (fr) 2001-04-26 2003-07-04 Arjo Wiggins Sa Couverture incorporant un dispositif d'identification radiofrequence
US6851617B2 (en) * 2002-04-19 2005-02-08 Avery Dennison Corporation Laser imageable RFID label/tag
US8010405B1 (en) 2002-07-26 2011-08-30 Visa Usa Inc. Multi-application smart card device software solution for smart cardholder reward selection and redemption
US7023347B2 (en) 2002-08-02 2006-04-04 Symbol Technologies, Inc. Method and system for forming a die frame and for transferring dies therewith
US7117581B2 (en) 2002-08-02 2006-10-10 Symbol Technologies, Inc. Method for high volume assembly of radio frequency identification tags
US7121456B2 (en) 2002-09-13 2006-10-17 Visa U.S.A. Inc. Method and system for managing token image replacement
US8015060B2 (en) 2002-09-13 2011-09-06 Visa Usa, Inc. Method and system for managing limited use coupon and coupon prioritization
US9852437B2 (en) 2002-09-13 2017-12-26 Visa U.S.A. Inc. Opt-in/opt-out in loyalty system
US8626577B2 (en) 2002-09-13 2014-01-07 Visa U.S.A Network centric loyalty system
US7233498B2 (en) * 2002-09-27 2007-06-19 Eastman Kodak Company Medium having data storage and communication capabilities and method for forming same
US6920611B1 (en) 2002-11-25 2005-07-19 Visa U.S.A., Inc. Method and system for implementing a loyalty merchant component
DE10304824A1 (de) * 2003-01-31 2004-08-12 Varta Microbattery Gmbh Dünne elektronische Chipkarte
JP3739752B2 (ja) 2003-02-07 2006-01-25 株式会社 ハリーズ ランダム周期変速可能な小片移載装置
JP4103653B2 (ja) * 2003-03-27 2008-06-18 株式会社デンソー Ｉｃカード
US7827077B2 (en) 2003-05-02 2010-11-02 Visa U.S.A. Inc. Method and apparatus for management of electronic receipts on portable devices
US7404199B2 (en) 2003-06-12 2008-07-22 Symbol Technologies, Inc. Method, system, and apparatus for high volume assembly of compact discs and digital video discs incorporating radio frequency identification tag technology
US8554610B1 (en) 2003-08-29 2013-10-08 Visa U.S.A. Inc. Method and system for providing reward status
US7104446B2 (en) 2003-09-03 2006-09-12 Visa U.S.A., Inc. Method, system and portable consumer device using wildcard values
US7051923B2 (en) 2003-09-12 2006-05-30 Visa U.S.A., Inc. Method and system for providing interactive cardholder rewards image replacement
US8005763B2 (en) 2003-09-30 2011-08-23 Visa U.S.A. Inc. Method and system for providing a distributed adaptive rules based dynamic pricing system
US8407083B2 (en) 2003-09-30 2013-03-26 Visa U.S.A., Inc. Method and system for managing reward reversal after posting
US7653602B2 (en) 2003-11-06 2010-01-26 Visa U.S.A. Inc. Centralized electronic commerce card transactions
CN1322467C (zh) * 2003-12-30 2007-06-20 上海东方磁卡工程有限公司 一种非接触式智能低频卡制造方法
US7370808B2 (en) 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
EP1733337A4 (en) 2004-01-12 2008-06-25 Symbol Technologies Inc INLAY SORTING AND MODULE OF A HIGH FREQUENCY IDENTIFICATION LABEL
FR2868987B1 (fr) 2004-04-14 2007-02-16 Arjo Wiggins Secutity Sas Soc Structure comportant un dispositif electronique, notamment pour la fabrication d'un document de securite ou de valeur
EP1784803A4 (en) 2004-08-17 2010-07-14 Symbol Technologies Inc SINGULATION OF LABELS OF HIGH FREQUENCY IDENTIFICATION (RFID) FOR TESTING AND / OR PROGRAMMING
US7500307B2 (en) 2004-09-22 2009-03-10 Avery Dennison Corporation High-speed RFID circuit placement method
FR2877462B1 (fr) 2004-10-29 2007-01-26 Arjowiggins Security Soc Par A Structure comportant un dispositif electronique pour la fabrication d'un document de securite.
DE602005024861D1 (de) 2004-12-03 2010-12-30 Hallys Corp Zwischenglied-bondierungseinrichtung
JP2006277178A (ja) * 2005-03-29 2006-10-12 Aruze Corp ゲーム用カード
EP1876877B1 (en) 2005-04-06 2010-08-25 Hallys Corporation Electronic component manufacturing apparatus
US7623034B2 (en) 2005-04-25 2009-11-24 Avery Dennison Corporation High-speed RFID circuit placement method and device
DE102005028066B3 (de) 2005-06-16 2006-12-07 Deutsche Exide Gmbh Polbrücke für eine Batterie
DE102006026105B4 (de) * 2005-06-28 2011-07-07 Mühlbauer AG, 93426 Verfahren und Vorrichtung zur Herstellung von selbstklebenden RFID-Transpondern
US7555826B2 (en) 2005-12-22 2009-07-07 Avery Dennison Corporation Method of manufacturing RFID devices
US7992781B2 (en) 2009-12-16 2011-08-09 Visa International Service Association Merchant alerts incorporating receipt data
US8429048B2 (en) 2009-12-28 2013-04-23 Visa International Service Association System and method for processing payment transaction receipts
FR3049739B1 (fr) * 2016-03-30 2021-03-12 Linxens Holding Procedes de fabrication de cartes a puce et de supports d’antenne pour carte a puce
SE1751265A1 (en) * 2017-10-13 2019-03-12 Stora Enso Oyj Method and arrangement for producing a label with integrated electrically conductive pattern
CN113147094A (zh) * 2021-03-18 2021-07-23 淮安赫德兹彩色印刷包装有限公司 带装饰贴的包装纸袋加工设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2641102B1 (pt) * 1988-12-27 1991-02-22 Ebauchesfabrik Eta Ag
NL9301457A (nl) * 1993-08-23 1995-03-16 Nedap Nv Contactloze identificatiekaart of smart card.
FR2724040B1 (fr) * 1994-08-25 1996-09-27 Schlumberger Ind Sa Procede de fabrication d'une carte a puce et carte ainsi obtenue
JPH09511704A (ja) * 1994-09-30 1997-11-25 シーメンス アクチエンゲゼルシヤフト 無接触チップカードに埋込むための支持装置
EP0706152B1 (de) * 1994-11-03 1998-06-10 Fela Holding AG Basis Folie für Chip Karte
DE19509233A1 (de) * 1995-03-19 1996-09-26 Melzer Maschinenbau Gmbh Verfahren zum Herstellen von Elektronik-Komponenten enthaltenden Kunststoffkarten

Also Published As

Publication number Publication date
CA2321893A1 (fr) 1999-09-02
FR2775533B1 (fr) 2003-02-14
AU2428699A (en) 1999-09-15
EP1057139A1 (fr) 2000-12-06
CN1292129A (zh) 2001-04-18
FR2775533A1 (fr) 1999-09-03
JP2002505488A (ja) 2002-02-19
WO1999044172A1 (fr) 1999-09-02

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTA A 4O, 5O, 6O, 7O E 8O ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1911 DE 21/08/2007.