BR9911279A - Adesivos fundidos a quente à base de poliaminas de longo tempo abertos - Google Patents

Adesivos fundidos a quente à base de poliaminas de longo tempo abertos

Info

Publication number
BR9911279A
BR9911279A BR9911279-5A BR9911279A BR9911279A BR 9911279 A BR9911279 A BR 9911279A BR 9911279 A BR9911279 A BR 9911279A BR 9911279 A BR9911279 A BR 9911279A
Authority
BR
Brazil
Prior art keywords
diamines
melt adhesives
long open
hot
hot melt
Prior art date
Application number
BR9911279-5A
Other languages
English (en)
Inventor
Angela Rossini
Francesco Meda
Original Assignee
Henkel Komannditgesellschaft A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Komannditgesellschaft A filed Critical Henkel Komannditgesellschaft A
Publication of BR9911279A publication Critical patent/BR9911279A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C09J177/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/34—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids using polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/06—Polyamides derived from polyamines and polycarboxylic acids
    • C08L77/08—Polyamides derived from polyamines and polycarboxylic acids from polyamines and polymerised unsaturated fatty acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyamides (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Patente de Invenção: <B>"ADESIVOS FUNDIDOS A QUENTE à BASE DE POLIAMIDAS DE LONGO TEMPO ABERTOS"<D>. A presente invenção refere-se a composições de poliamida úteis como adesivos fundidos a quente, que têm um tempo de montagem em aberto muito longo. Uma composição típica da presente invenção compreende o produto de condensação de quantidades substancialmente equimolares de um componente ácido, que consiste, essencialmente, de um ou mais ácidos graxos poliméricos e um ou mais ácidos dicarboxílicos, e um componente amina, que consiste em uma ou mais diaminas alifáticas, em que os grupos amina são ligados a um número ímpar de átomos de carbono na cadeia alifática ou superior a quatro, e uma ou mais diaminas selecionadas do grupo de diaminas e/ ou polioxialquileno diaminas cíclicas. Esses adesivos fundidos a quente combinam longo tempo de montagem em aberto com uma alta resistência à tração.
BR9911279-5A 1998-06-16 1999-06-05 Adesivos fundidos a quente à base de poliaminas de longo tempo abertos BR9911279A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP98110959A EP0965627A1 (en) 1998-06-16 1998-06-16 Long open time hotmelts based on polyamides
PCT/EP1999/003901 WO1999066003A1 (en) 1998-06-16 1999-06-05 Long open time hotmelts based on polyamides

Publications (1)

Publication Number Publication Date
BR9911279A true BR9911279A (pt) 2001-03-13

Family

ID=8232127

Family Applications (1)

Application Number Title Priority Date Filing Date
BR9911279-5A BR9911279A (pt) 1998-06-16 1999-06-05 Adesivos fundidos a quente à base de poliaminas de longo tempo abertos

Country Status (6)

Country Link
EP (1) EP0965627A1 (pt)
JP (1) JP2002518544A (pt)
KR (1) KR20010052930A (pt)
BR (1) BR9911279A (pt)
CA (1) CA2335375A1 (pt)
WO (1) WO1999066003A1 (pt)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10022701B4 (de) * 2000-05-10 2006-03-23 Ems-Chemie Ag Niedrigschmelzende Copolyamide sowie deren Verwendung als Schmelzklebemittel
RU2237697C1 (ru) * 2003-02-26 2004-10-10 Федеральное государственное унитарное предприятие "Научно-исследовательский институт химии и технологии полимеров им. акад. В.А. Каргина с опытным заводом" Клей-расплав (варианты)
WO2007112200A1 (en) 2006-03-24 2007-10-04 Henkel Corporation Polyamides
CA2671011A1 (en) 2006-11-29 2008-06-05 Henkel Ag & Co. Kgaa Molded parts from hot melt adhesives
US8362125B2 (en) 2007-04-03 2013-01-29 Henkel Ag & Co. Kgaa Hot melt adhesive
ATE532813T1 (de) 2009-09-18 2011-11-15 Henkel Ag & Co Kgaa Hydrolysestabile polyamide
US9771498B2 (en) * 2009-11-20 2017-09-26 Henkel IP & Holding GmbH Moisture curable polyamides and methods for using the same
JP2014506614A (ja) * 2011-02-15 2014-03-17 ディーエスエム アイピー アセッツ ビー．ブイ． １，４−ブチレンジアミンのモノマー単位を含有するポリアミド
CN102492135A (zh) * 2011-11-30 2012-06-13 上海天洋热熔胶有限公司 一种二聚酸型聚酰胺热熔胶的合成方法
EP2803688A4 (en) * 2012-01-12 2015-08-05 Mitsubishi Gas Chemical Co POLYETHER POLYAMIDE ELASTOMER
JP5929419B2 (ja) * 2012-03-29 2016-06-08 日立化成株式会社 粘着剤組成物、フィルム状粘着剤及び被着体の剥離方法
JP6420581B2 (ja) * 2014-07-15 2018-11-07 住友電気工業株式会社 高流動ポリアミド樹脂
DE112015003249T5 (de) * 2014-07-15 2017-04-13 Sumitomo Electric Fine Polymer, Inc. Wärmeschrumpfbares Rohr, wärmeschrumpfbarer Deckel und Verfahren zur Erzeugung einer Wasserresistenz bei einem elektrischen Drahtbündel
US11492544B2 (en) 2016-06-22 2022-11-08 Hexion Inc. Chemical products for adhesive applications
EP3628052A4 (en) 2016-06-22 2021-08-04 Hexion Research Belgium SA CHEMICAL PRODUCTS FOR ADHESIVE APPLICATIONS
WO2019143782A1 (en) * 2018-01-17 2019-07-25 Kraton Polymers Llc Pvc plasticizers and methods for making thereof
KR102211227B1 (ko) * 2019-11-05 2021-02-02 실버스타케미칼(주) 폴리아미드 수지 조성물을 이용한 핫멜트 접착제
EP3892246B1 (en) 2020-04-08 2024-06-19 The Procter & Gamble Company Method for applying a polymeric composition and absorbent articles comprising such composition
FR3112787B1 (fr) * 2020-07-23 2023-04-28 Arkema France Copolyamides thermoplastiques pour assemblage de textiles
FR3114815B1 (fr) * 2020-10-07 2023-04-28 Bostik Sa Composition polyamide
FR3125534B1 (fr) * 2021-07-22 2024-10-25 Bostik Sa Composition polyamide

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2601376B1 (fr) * 1986-07-08 1988-10-21 Rhone Poulenc Chimie Procede de preparation de copolyamides a base d'hexamethylenediamine, d'acide adipique, eventuellement d'au moins un autre diacide carboxylique a chaine courte et acide dimere
DE3723941A1 (de) * 1987-07-20 1989-02-02 Henkel Kgaa Neue polyamide aus dimerisierten fettsaeuren und polyetherharnstoffdiaminen sowie deren verwendung als klebstoffe
US4853460A (en) * 1988-03-24 1989-08-01 Union Camp Corporation Long open assembly time vinyl-bonding polyamide from dimer acid
US4946933A (en) * 1989-02-27 1990-08-07 Texaco Chemical Company Elastomeric polyamide hot melt adhesive from low molecular weight polyoxyethylene diamine
DE3934825A1 (de) * 1989-10-19 1991-04-25 Bayer Ag Polyamidelastomere, ihre herstellung und ihre verwendung
US5672677A (en) * 1996-01-12 1997-09-30 The Dexter Corporation Long open time polyamide compositions
US5807968A (en) * 1996-04-04 1998-09-15 Henkel Corporation Polyamide compositions and related methods

Also Published As

Publication number Publication date
WO1999066003A1 (en) 1999-12-23
CA2335375A1 (en) 1999-12-23
EP0965627A1 (en) 1999-12-22
JP2002518544A (ja) 2002-06-25
KR20010052930A (ko) 2001-06-25

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Legal Events

Date Code Title Description
B08F Application fees: application dismissed [chapter 8.6 patent gazette]

Free format text: REFERENTE A 5,6,7 E 8A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 1911 DE 21/08/2007.