BRPI0402798A - Componente semicondutor com proteção integrada contra o excesso de temperatura - Google Patents

Componente semicondutor com proteção integrada contra o excesso de temperatura

Info

Publication number
BRPI0402798A
BRPI0402798A BR0402798-1A BRPI0402798A BRPI0402798A BR PI0402798 A BRPI0402798 A BR PI0402798A BR PI0402798 A BRPI0402798 A BR PI0402798A BR PI0402798 A BRPI0402798 A BR PI0402798A
Authority
BR
Brazil
Prior art keywords
semiconductor component
overtemperature protection
integrated
protection
overtemperature
Prior art date
Application number
BR0402798-1A
Other languages
English (en)
Inventor
Manfred Uebele
Horst Meinders
Markus Wabro
Hartmut Michel
Jens Mohaupt
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of BRPI0402798A publication Critical patent/BRPI0402798A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/60—Integrated devices comprising arrangements for electrical or thermal protection, e.g. protection circuits against electrostatic discharge [ESD]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
    • F02P—IGNITION, OTHER THAN COMPRESSION IGNITION, FOR INTERNAL-COMBUSTION ENGINES; TESTING OF IGNITION TIMING IN COMPRESSION-IGNITION ENGINES
    • F02P3/00—Other installations
    • F02P3/02—Other installations having inductive energy storage, e.g. arrangements of induction coils
    • F02P3/04—Layout of circuits
    • F02P3/055—Layout of circuits with protective means to prevent damage to the circuit, e.g. semiconductor devices or the ignition coil
    • F02P3/0552—Opening or closing the primary coil circuit with semiconductor devices

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Protection Of Static Devices (AREA)

Abstract

"COMPONENTE SEMICONDUTOR COM PROTEçãO INTEGRADA CONTRA O EXCESSO DE TEMPERATURA". A presente invenção se refere a um componente semicondutor para regular uma corrente de carga que flui através do componente semicondutor, sendo que o componente semicondutor é dotado de uma proteção contra o excesso de temperatura que possui um sensor térmico, para evitar um excesso de temperatura decorrente de uma corrente de carga excessiva. A presente invenção prevê que a proteção contra o excesso de temperatura (5), incluindo aí o seu sensor térmico (7), esteja integrada dentro do componente semicondutor (1).
BR0402798-1A 2003-07-17 2004-07-19 Componente semicondutor com proteção integrada contra o excesso de temperatura BRPI0402798A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10332513A DE10332513A1 (de) 2003-07-17 2003-07-17 Halbleiterbauelement mit integriertem Übertemperaturschutz

Publications (1)

Publication Number Publication Date
BRPI0402798A true BRPI0402798A (pt) 2005-03-08

Family

ID=33461974

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0402798-1A BRPI0402798A (pt) 2003-07-17 2004-07-19 Componente semicondutor com proteção integrada contra o excesso de temperatura

Country Status (4)

Country Link
EP (1) EP1498951A3 (pt)
CN (1) CN1577838A (pt)
BR (1) BRPI0402798A (pt)
DE (1) DE10332513A1 (pt)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014203655A1 (de) * 2014-02-28 2015-09-03 Siemens Aktiengesellschaft Schaltungsanordnung und Verfahren zum Ansteuern eines Sperrschicht-Feldeffekttransistors
FI20146041A7 (fi) * 2014-11-27 2016-05-28 Lappeenrannan Teknillinen Yliopisto Elektroninen laite
CN110824337A (zh) * 2019-10-17 2020-02-21 福州瑞芯微电子股份有限公司 一种soc芯片高温测试的方法和装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5240017B2 (pt) * 1972-10-16 1977-10-08
US4779161A (en) * 1986-01-22 1988-10-18 Ge Company Multi-driver integrated circuit
IT1227586B (it) * 1988-12-13 1991-04-22 Sgs Thomson Microelectronics Circuito di diagnostica per unita' di controllo della corrente e di protezione da eccessiva dissipazione termica per dispositivo di potenza a semiconduttore
JP3216972B2 (ja) * 1995-08-04 2001-10-09 株式会社日立製作所 内燃機関の点火装置
WO1998012815A1 (de) * 1996-09-18 1998-03-26 Siemens Aktiengesellschaft Temperaturgeschütztes elektrisches schalter-bauelement
US5878824A (en) * 1996-11-27 1999-03-09 Digital Control Incorporated Boring tool or other device including thermal protection for an electronic component assembly and method
DE19810826B4 (de) * 1998-03-12 2012-06-21 Infineon Technologies Ag Meßvorrichtung zum digitalen Erfassen analoger Meßgrößen
JP3484133B2 (ja) * 2000-03-03 2004-01-06 株式会社日立製作所 内燃機関用点火装置および内燃機関点火用１チップ半導体

Also Published As

Publication number Publication date
CN1577838A (zh) 2005-02-09
EP1498951A2 (de) 2005-01-19
EP1498951A3 (de) 2008-03-26
DE10332513A1 (de) 2005-02-03

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2160 DE 29/05/2012.