BRPI0406401A - Blindagem para componentes eletrônicos e/ou circuitos de aparelhos eletrônicos sob riscos de emi - Google Patents

Blindagem para componentes eletrônicos e/ou circuitos de aparelhos eletrônicos sob riscos de emi

Info

Publication number
BRPI0406401A
BRPI0406401A BR0406401-1A BRPI0406401A BRPI0406401A BR PI0406401 A BRPI0406401 A BR PI0406401A BR PI0406401 A BRPI0406401 A BR PI0406401A BR PI0406401 A BRPI0406401 A BR PI0406401A
Authority
BR
Brazil
Prior art keywords
emi
circuits
risk
electronic
electronic components
Prior art date
Application number
BR0406401-1A
Other languages
English (en)
Inventor
Matthias Lungwitz
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BRPI0406401A publication Critical patent/BRPI0406401A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09618—Via fence, i.e. one-dimensional array of vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

"BLINDAGEM PARA COMPONENTES ELETRôNICOS E/OU CIRCUITOS DE APARELHOS ELETRôNICOS SOB RISCO DE EMI". A presente invenção refere-se à disponibilidade de uma blindagem para componentes e/ou circuitos eletrônicos sob risco de EMI (20) de aparelhos eletrônicos, especialmente para equipamentos de emissão de rádio e/ou de recepção de rádio de terminais de telecomunicação para a telecomunicação sem cabos, como telefones sem fios e telefones de rádio móvel, a qual possa ser produzida sem trabalhos dispendiosos de fabricação e de montagem sem necessidade adicional de espaço, no qual instalam-se os componentes e/ou circuitos eletrônicos sob risco de EMI (20) sobre uma placa condutora (2) à parte, com pelo menos duas camadas, projetada como módulo de placa condutora. Essa placa condutora e uma outra placa condutora à parte (1), projetada como placa condutora básica, com pelo menos duas camadas, apresentando componentes e/ou circuitos eletrônicos sem risco de EMI (10) e um rebaixo (11) para os componentes e/ou circuitos eletrônicos sob risco de EMI (20), acham-se juntadas por técnica de ligação, de preferência por soldagem, de preferência na região de zonas de contato (12, 14, 22, 23), para formar uma unidade de um modo tal que através do rebaixo (11) disposto entre duas camadas metálicas projetadas como superfícies de massa (13, 21), sendo que as superfícies de massa (13, 21) estão ligadas respectivamente com as superfícies de blindagem (12, 22) através de passagens de contato (14, 23) dispostas bastante perto uma da outra, forma-se uma gaiola (3) que blinda os componentes e/ou circuitos eletrônicos sob risco de EMI (20) por todos os lados.
BR0406401-1A 2003-07-02 2004-07-02 Blindagem para componentes eletrônicos e/ou circuitos de aparelhos eletrônicos sob riscos de emi BRPI0406401A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10329879 2003-07-02
PCT/EP2004/051332 WO2005004572A1 (de) 2003-07-02 2004-07-02 Abschirmung für emi-gefährdete elektronische bauelemente und/oder schaltungen von elektronischen geräten

Publications (1)

Publication Number Publication Date
BRPI0406401A true BRPI0406401A (pt) 2005-08-09

Family

ID=33559826

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0406401-1A BRPI0406401A (pt) 2003-07-02 2004-07-02 Blindagem para componentes eletrônicos e/ou circuitos de aparelhos eletrônicos sob riscos de emi

Country Status (8)

Country Link
US (1) US7269032B2 (pt)
EP (1) EP1537767B1 (pt)
KR (1) KR100851683B1 (pt)
CN (1) CN100386010C (pt)
BR (1) BRPI0406401A (pt)
DE (1) DE502004008576D1 (pt)
ES (1) ES2314409T3 (pt)
WO (1) WO2005004572A1 (pt)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8452594B2 (en) 2005-10-27 2013-05-28 Nuance Communications Austria Gmbh Method and system for processing dictated information
DE102006058000B4 (de) * 2006-12-08 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Platinenanordnung
US7965520B2 (en) 2007-01-22 2011-06-21 Sony Ericsson Mobile Communications Ab Electronic device with flip module having low height
DE102007006462A1 (de) * 2007-02-05 2008-08-14 Siemens Ag Elektronische Schaltungsanordnung mit einer ersten und zweiten Leiterplatte
CN100556248C (zh) * 2007-04-27 2009-10-28 富葵精密组件(深圳)有限公司 柔性电路板激光加工承载装置
US7939766B2 (en) * 2009-01-06 2011-05-10 Honeywell International Inc. Apparatus for electromagentically shielding a portion of a circuit board
US8461855B2 (en) * 2009-10-02 2013-06-11 Teradyne, Inc. Device interface board with cavity back for very high frequency applications
US20120170230A1 (en) * 2010-12-30 2012-07-05 Research In Motion Limited Combining printed circuit boards
TWI433618B (zh) 2012-02-08 2014-04-01 環旭電子股份有限公司 堆疊式基板結構
DE102012212574B4 (de) * 2012-07-18 2017-01-12 Siemens Healthcare Gmbh Verfahren zur elektromagnetischen Abschirmung für eine Magnetresonanzanlage sowie entsprechend abgeschirmte Vorrichtung
CN202795296U (zh) * 2012-08-31 2013-03-13 华为终端有限公司 触控显示屏和移动通讯设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940006427Y1 (ko) * 1991-04-12 1994-09-24 윤광렬 독서용 확대경
US5198963A (en) * 1991-11-21 1993-03-30 Motorola, Inc. Multiple integrated circuit module which simplifies handling and testing
US5376759A (en) * 1993-06-24 1994-12-27 Northern Telecom Limited Multiple layer printed circuit board
GB2297868B (en) 1995-02-07 1999-04-28 Nokia Mobile Phones Ltd A shielding device
DE29505327U1 (de) 1995-03-29 1995-08-03 Siemens AG, 80333 München Abschirmung für Logik- und Hochfrequenzschaltkreise
JPH0936512A (ja) 1995-07-20 1997-02-07 Japan Aviation Electron Ind Ltd プリント回路装置
JPH10112517A (ja) 1996-10-03 1998-04-28 Ngk Spark Plug Co Ltd 電子部品収納用パッケージ
DE29710640U1 (de) 1997-06-18 1997-08-21 Siemens AG, 80333 München Schirmung
KR100266637B1 (ko) * 1997-11-15 2000-09-15 김영환 적층형볼그리드어레이반도체패키지및그의제조방법
US6483406B1 (en) 1998-07-31 2002-11-19 Kyocera Corporation High-frequency module using slot coupling
DE19945427C1 (de) 1999-09-22 2000-11-02 Siemens Ag Abschirmvorrichtung und Verfahren zu deren Herstellung
US6243265B1 (en) * 1999-10-06 2001-06-05 Intel Corporation Processor EMI shielding
GB2358957B (en) * 1999-10-27 2004-06-23 Ibm Ball grid array module
JP2001237586A (ja) 2000-02-25 2001-08-31 Matsushita Electric Ind Co Ltd 回路基板、回路部品内蔵モジュールおよびそれらの製造方法
US6486534B1 (en) * 2001-02-16 2002-11-26 Ashvattha Semiconductor, Inc. Integrated circuit die having an interference shield
JP3734807B2 (ja) * 2003-05-19 2006-01-11 Ｔｄｋ株式会社 電子部品モジュール

Also Published As

Publication number Publication date
KR100851683B1 (ko) 2008-08-11
EP1537767B1 (de) 2008-12-03
DE502004008576D1 (de) 2009-01-15
CN1706233A (zh) 2005-12-07
CN100386010C (zh) 2008-04-30
WO2005004572A1 (de) 2005-01-13
US7269032B2 (en) 2007-09-11
ES2314409T3 (es) 2009-03-16
EP1537767A1 (de) 2005-06-08
US20060027913A1 (en) 2006-02-09
KR20060025516A (ko) 2006-03-21

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012.