BRPI0408460A - sistema de radiação de calor - Google Patents

sistema de radiação de calor

Info

Publication number
BRPI0408460A
BRPI0408460A BRPI0408460-8A BRPI0408460A BRPI0408460A BR PI0408460 A BRPI0408460 A BR PI0408460A BR PI0408460 A BRPI0408460 A BR PI0408460A BR PI0408460 A BRPI0408460 A BR PI0408460A
Authority
BR
Brazil
Prior art keywords
heat radiation
switching elements
plate
base
radiation plate
Prior art date
Application number
BRPI0408460-8A
Other languages
English (en)
Inventor
Shinya Shimizu
Satoshi Ikeya
Atsuyuki Hiruma
Yoshinori Murashige
Takahisa Endo
Norihisa Hasegawa
Original Assignee
Toshiba Carrier Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Carrier Corp filed Critical Toshiba Carrier Corp
Publication of BRPI0408460A publication Critical patent/BRPI0408460A/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02J—ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries
    • H02J7/60—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries including safety or protection arrangements
    • H02J7/65—Circuit arrangements for charging or discharging batteries or for supplying loads from batteries including safety or protection arrangements against overtemperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/235—Arrangements for cooling characterised by their places of attachment or cooling paths attached to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Dc-Dc Converters (AREA)

Abstract

"SISTEMA DE RADIAçãO DE CALOR". é um objetivo fornecer um radiador de calor capaz de confiavelmente contatar seis elementos de comutação estreitamente com uma placa de radiação de calor por meio de uma única placa de fixação, mesmo se os elementos de comutação variarem em espessura. A placa de fixação por meio da qual seis elementos de comutação (U, V, W, X, Y, Z) arranjados em uma única linha em uma placa impressa são fixados na placa de radiação de calor, e feita sujeitando uma única placa metálica a um processo de conformação e compreende uma base (11) alongada como visto na direção de disposição dos elementos de comutação, três seções de suporte de elemento (15) se estendendo a um lado da base em uma relação mutuamente espaçada e conectada à base através de conectores (14), em que cada seção de suporte de elemento possui uma largura adaptada para suportar dói elementos de comutação como um ajuste na direção longitudinal da base, e é formado com um furo transpassante (16) receptor de parafuso para suportar o elemento de comutação na seção intermediária de modo amplo e fixá-lo à placa de radiação de calor, o conector possuindo uma largura menor do que a seção de suporte de elemento de modo a permitir que a seção de suporte de elemento incline em relação à placa de radiação de calor.
BRPI0408460-8A 2003-03-25 2004-03-03 sistema de radiação de calor BRPI0408460A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003082337A JP3790225B2 (ja) 2003-03-25 2003-03-25 放熱装置
PCT/JP2004/002618 WO2004086501A1 (ja) 2003-03-25 2004-03-03 放熱装置

Publications (1)

Publication Number Publication Date
BRPI0408460A true BRPI0408460A (pt) 2006-04-04

Family

ID=33094916

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0408460-8A BRPI0408460A (pt) 2003-03-25 2004-03-03 sistema de radiação de calor

Country Status (8)

Country Link
EP (1) EP1608014A1 (pt)
JP (1) JP3790225B2 (pt)
KR (1) KR100687372B1 (pt)
CN (1) CN100373600C (pt)
AU (1) AU2004224861B2 (pt)
BR (1) BRPI0408460A (pt)
RU (1) RU2299496C2 (pt)
WO (1) WO2004086501A1 (pt)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005050028A1 (de) * 2005-10-14 2007-04-19 Robert Bosch Gmbh Elektrische Vorrichtung, insbesondere zur Ansteuerung einer motorisch und/oder generatorisch betreibbaren elektrischen Maschine
EP1981159A1 (en) * 2006-01-31 2008-10-15 Toshiba Carrier Corporation Refrigeration cycle device
JP2008218840A (ja) * 2007-03-06 2008-09-18 Funai Electric Co Ltd Ｉｃ固定構造
JPWO2010119546A1 (ja) * 2009-04-16 2012-10-22 三菱電機株式会社 発熱部品固定金具
WO2013088642A1 (ja) * 2011-12-13 2013-06-20 富士電機株式会社 電力変換装置
CN103391703B (zh) * 2012-05-11 2017-08-18 尼得科控制技术有限公司 夹紧装置
CN103712171B (zh) * 2012-09-28 2018-04-20 海洋王（东莞）照明科技有限公司 整流器支架及照明设备
KR101846307B1 (ko) * 2013-07-08 2018-04-09 지멘스 악티엔게젤샤프트 다중레벨 변환기
JP2013214770A (ja) * 2013-07-10 2013-10-17 Mitsubishi Electric Corp 発熱部品固定金具および発熱部品固定構造
CN104684337B (zh) * 2013-11-26 2017-12-22 台达电子企业管理（上海）有限公司 电子装置及其组装方法
KR101624733B1 (ko) * 2014-09-25 2016-06-07 프레스토라이트아시아 주식회사 방열기능이 개선된 모터구동 제어기
US20160149380A1 (en) * 2014-11-20 2016-05-26 Hamilton Sundstrand Corporation Power control assembly with vertically mounted power devices
JP7288363B2 (ja) * 2019-07-10 2023-06-07 ダイヤゼブラ電機株式会社 電子機器および電子制御装置
WO2021186935A1 (ja) * 2020-03-19 2021-09-23 富士電機株式会社 電力変換装置
CN115513073B (zh) * 2022-11-23 2023-03-07 季华实验室 一种功率器件散热结构及其装配方法
JP2024140019A (ja) * 2023-03-28 2024-10-10 パナソニックオートモーティブシステムズ株式会社 電力変換装置、電力変換装置の構造及び電力変換装置の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621252Y2 (ja) * 1988-12-02 1994-06-01 光洋電子工業株式会社 半導体素子の取付装置
JPH0351891U (pt) * 1989-09-27 1991-05-20
SU1767712A1 (ru) * 1990-04-18 1992-10-07 Институт Точной Механики И Вычислительной Техники Им.С.А.Лебедева Радиоэлектронный модуль
JPH05218248A (ja) * 1992-02-03 1993-08-27 Murata Mfg Co Ltd 発熱素子の放熱板への取付構造
CN1152428C (zh) * 1995-10-13 2004-06-02 热合金公司 可焊式晶体管夹子和夹子与散热器的组合装置
US5960535A (en) * 1997-10-28 1999-10-05 Hewlett-Packard Company Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink
JP2002198477A (ja) * 2000-12-25 2002-07-12 Toyota Motor Corp 半導体装置
US6469898B1 (en) * 2001-05-21 2002-10-22 Rouchon Industries Inc. Heat dissipating device
US6525941B1 (en) * 2001-12-27 2003-02-25 Tai-Sol Electronics Co., Ltd. Heat dissipating device with a pressing member that is rotatable to urge a fan module toward a circuit board

Also Published As

Publication number Publication date
JP3790225B2 (ja) 2006-06-28
RU2299496C2 (ru) 2007-05-20
AU2004224861B2 (en) 2007-06-07
CN1765018A (zh) 2006-04-26
CN100373600C (zh) 2008-03-05
EP1608014A1 (en) 2005-12-21
KR20050116154A (ko) 2005-12-09
KR100687372B1 (ko) 2007-02-26
WO2004086501A1 (ja) 2004-10-07
JP2004289076A (ja) 2004-10-14
RU2005132829A (ru) 2006-02-27
AU2004224861A1 (en) 2004-10-07

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 12A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2367 DE 17-05-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.