BRPI0410277A - método para simular um comportamento de uma distribuição de energia dentro de um conjunto contendo um material multicamada reativo, dispositivo de armazenamento de programa legìvel por uma máquina, método para unir, e, junta - Google Patents

método para simular um comportamento de uma distribuição de energia dentro de um conjunto contendo um material multicamada reativo, dispositivo de armazenamento de programa legìvel por uma máquina, método para unir, e, junta

Info

Publication number
BRPI0410277A
BRPI0410277A BRPI0410277-0A BRPI0410277A BRPI0410277A BR PI0410277 A BRPI0410277 A BR PI0410277A BR PI0410277 A BRPI0410277 A BR PI0410277A BR PI0410277 A BRPI0410277 A BR PI0410277A
Authority
BR
Brazil
Prior art keywords
joining
behavior
simulating
energy distribution
energy
Prior art date
Application number
BRPI0410277-0A
Other languages
English (en)
Inventor
Etienne Besnoin
Jiaping Wang
Alan Duckham
Stephen John Spey Jr
David Peter Van Heerden
Timothy P Weihs
Omar M Knio
Original Assignee
Reactive Nanotechnologies Inc
Univ Johns Hopkins
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Reactive Nanotechnologies Inc, Univ Johns Hopkins filed Critical Reactive Nanotechnologies Inc
Publication of BRPI0410277A publication Critical patent/BRPI0410277A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0233—Sheets or foils
    • B23K35/0238—Sheets or foils layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • C—CHEMISTRY; METALLURGY
    • C06—EXPLOSIVES; MATCHES
    • C06B—EXPLOSIVES OR THERMIC COMPOSITIONS; MANUFACTURE THEREOF; USE OF SINGLE SUBSTANCES AS EXPLOSIVES
    • C06B45/00—Compositions or products which are defined by structure or arrangement of component of product
    • C06B45/12—Compositions or products which are defined by structure or arrangement of component of product having contiguous layers or zones
    • C06B45/14—Compositions or products which are defined by structure or arrangement of component of product having contiguous layers or zones a layer or zone containing an inorganic explosive or an inorganic explosive or an inorganic thermic component
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B17/00—Systems involving the use of models or simulators of said systems
    • G05B17/02—Systems involving the use of models or simulators of said systems electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B23K2103/05—Stainless steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B23K2103/10—Aluminium or alloys thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Laminated Bodies (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Ceramic Products (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)

Abstract

"MéTODO PARA SIMULAR UM COMPORTAMENTO DE UMA DISTRIBUIçãO DE ENERGIA DENTRO DE UM CONJUNTO CONTENDO UM MATERIAL MULTICAMADA REATIVO, DISPOSITIVO DE ARMAZENAMENTO DE PROGRAMA LEGìVEL POR UMA MáQUINA, MéTODO PARA UNIR, E, JUNTA". Um modo de realização da invenção inclui um método para simular um comportamento de uma distribuição de energia dentro de um conjunto formado por solda forte ou solda branca para predizer vários parâmetros físicos do conjunto. O conjunto inclui, tipicamente, um material multicamada reativo. O método compreende as etapas de prover uma equação de evolução de energia tendo um termo de fonte de energia associado a uma reação auto-propagável que se origina dentro do material multicamada reativo. O método inclui também as etapas de discretizar a equação de evolução de energia, e determinar o comportamento da distribuição de energia no conjunto pela integração da equação de evolução de energia discretizada usando outros parâmetros associados ao conjunto.
BRPI0410277-0A 2003-05-13 2004-05-12 método para simular um comportamento de uma distribuição de energia dentro de um conjunto contendo um material multicamada reativo, dispositivo de armazenamento de programa legìvel por uma máquina, método para unir, e, junta BRPI0410277A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46984103P 2003-05-13 2003-05-13
PCT/US2004/014775 WO2005005092A2 (en) 2003-05-13 2004-05-12 Method of controlling thermal waves in reactive multilayer joining and resulting product

Publications (1)

Publication Number Publication Date
BRPI0410277A true BRPI0410277A (pt) 2006-05-16

Family

ID=34061899

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0410277-0A BRPI0410277A (pt) 2003-05-13 2004-05-12 método para simular um comportamento de uma distribuição de energia dentro de um conjunto contendo um material multicamada reativo, dispositivo de armazenamento de programa legìvel por uma máquina, método para unir, e, junta

Country Status (10)

Country Link
US (1) US20050136270A1 (pt)
EP (1) EP1626836A2 (pt)
JP (1) JP2007501715A (pt)
KR (1) KR20060019531A (pt)
CN (1) CN1816416A (pt)
AU (1) AU2004256020A1 (pt)
BR (1) BRPI0410277A (pt)
CA (1) CA2525386A1 (pt)
TW (1) TW200523058A (pt)
WO (1) WO2005005092A2 (pt)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110027547A1 (en) * 2000-05-02 2011-02-03 Reactive Nanotechnologies, Inc. Methods of making reactive composite materials and resulting products
US7121402B2 (en) * 2003-04-09 2006-10-17 Reactive Nano Technologies, Inc Container hermetically sealed with crushable material and reactive multilayer material
US7278354B1 (en) 2003-05-27 2007-10-09 Surface Treatment Technologies, Inc. Shock initiation devices including reactive multilayer structures
US7278353B2 (en) * 2003-05-27 2007-10-09 Surface Treatment Technologies, Inc. Reactive shaped charges and thermal spray methods of making same
US9499895B2 (en) 2003-06-16 2016-11-22 Surface Treatment Technologies, Inc. Reactive materials and thermal spray methods of making same
US7354659B2 (en) * 2005-03-30 2008-04-08 Reactive Nanotechnologies, Inc. Method for fabricating large dimension bonds using reactive multilayer joining
US20080093418A1 (en) * 2005-06-22 2008-04-24 Weihs Timothy P Multifunctional Reactive Composite Structures Fabricated From Reactive Composite Materials
JP4416704B2 (ja) 2005-07-01 2010-02-17 シャープ株式会社 無線伝送システム
US7687746B2 (en) * 2005-07-11 2010-03-30 Lawrence Livermore National Security, Llc Electrical initiation of an energetic nanolaminate film
US8613808B2 (en) * 2006-02-14 2013-12-24 Surface Treatment Technologies, Inc. Thermal deposition of reactive metal oxide/aluminum layers and dispersion strengthened aluminides made therefrom
KR20080103543A (ko) * 2006-03-24 2008-11-27 파커-한니핀 코포레이션 반응성 포일 조립체
CN101448600A (zh) * 2006-04-25 2009-06-03 反应性纳米技术有限公司 利用反应性多层接合制备大尺寸结合物的方法
US8342383B2 (en) * 2006-07-06 2013-01-01 Praxair Technology, Inc. Method for forming sputter target assemblies having a controlled solder thickness
US9078294B2 (en) 2006-08-07 2015-07-07 University Of Massachusetts Nanoheater elements, systems and methods of use thereof
US7469640B2 (en) 2006-09-28 2008-12-30 Alliant Techsystems Inc. Flares including reactive foil for igniting a combustible grain thereof and methods of fabricating and igniting such flares
US7867441B2 (en) * 2006-12-05 2011-01-11 Lawrence Livermore National Security, Llc Low to moderate temperature nanolaminate heater
JP4367493B2 (ja) 2007-02-02 2009-11-18 ソニー株式会社 無線通信システム、無線通信装置及び無線通信方法、並びにコンピュータ・プログラム
WO2009002852A2 (en) * 2007-06-22 2008-12-31 Reactive Nanotechnologies, Inc. Reactive multilayer joining to control thermal stress
US20090032572A1 (en) * 2007-08-03 2009-02-05 Andy Oxfdord System, method, and apparatus for reactive foil brazing of rock bit components. Hardfacing and compacts
US8882301B2 (en) * 2007-08-31 2014-11-11 Nanofoil Corporation Method for low temperature bonding of electronic components
US8074869B2 (en) * 2007-09-24 2011-12-13 Baker Hughes Incorporated System, method, and apparatus for reactive foil brazing of cutter components for fixed cutter bit
US8789366B2 (en) * 2008-12-10 2014-07-29 Raytheon Company Shape memory stored energy assemblies and methods for using the same
US20110234362A1 (en) 2008-12-10 2011-09-29 Raytheon Company Shape memory circuit breakers
US8764286B2 (en) * 2008-12-10 2014-07-01 Raytheon Company Shape memory thermal sensors
US8418455B2 (en) * 2008-12-10 2013-04-16 Raytheon Company Shape memory alloy separating apparatuses
DE102009006822B4 (de) * 2009-01-29 2011-09-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem
JP2013016525A (ja) * 2009-09-29 2013-01-24 Fuji Electric Systems Co Ltd パワー半導体モジュールおよびその製造方法
GB2515411B (en) * 2009-10-09 2015-06-10 Senergy Holdings Ltd Well simulation
US8590768B2 (en) * 2010-06-14 2013-11-26 GM Global Technology Operations LLC Battery tab joint by reaction metallurgy
EP2662474A1 (de) * 2012-05-07 2013-11-13 Siemens Aktiengesellschaft Verfahren zur Aufbringung einer Schutzschicht auf eine Turbinenkomponente
US9334675B2 (en) 2012-08-15 2016-05-10 Raytheon Company Passive safety mechanism utilizing self-fracturing shape memory material
US9470213B2 (en) 2012-10-16 2016-10-18 Raytheon Company Heat-actuated release mechanism
US9249014B2 (en) * 2012-11-06 2016-02-02 Infineon Technologies Austria Ag Packaged nano-structured component and method of making a packaged nano-structured component
JP6111764B2 (ja) * 2013-03-18 2017-04-12 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5672324B2 (ja) 2013-03-18 2015-02-18 三菱マテリアル株式会社 接合体の製造方法及びパワーモジュール用基板の製造方法
WO2015006452A1 (en) * 2013-07-09 2015-01-15 United Technologies Corporation Vehicular engine and transmission components made of plated polymers
JP5720839B2 (ja) 2013-08-26 2015-05-20 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
GB201401694D0 (en) * 2014-01-31 2014-03-19 Oxford Instr Nanotechnology Tools Ltd Method of joining a superconductor
US10254097B2 (en) 2015-04-15 2019-04-09 Raytheon Company Shape memory alloy disc vent cover release
DE102016115364A1 (de) * 2016-08-18 2018-02-22 Few Fahrzeugelektrik Werk Gmbh & Co. Kg Verfahren zur Ausbildung einer stoffschlüssigen Fügeverbindung
JP7526116B2 (ja) 2021-03-04 2024-07-31 シチズンファインデバイス株式会社 はんだの溶融持続時間算出方法
CN113722894B (zh) * 2021-08-16 2023-12-01 中山大学 一种基于模型简化的火灾蔓延模拟加速方法及系统

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3158927A (en) * 1961-06-05 1964-12-01 Burroughs Corp Method of fabricating sub-miniature semiconductor matrix apparatus
US4607779A (en) * 1983-08-11 1986-08-26 National Semiconductor Corporation Non-impact thermocompression gang bonding method
US4715526A (en) * 1986-11-20 1987-12-29 General Dynamics, Pomona Division Floating seal and method of its use
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
US5175410A (en) * 1991-06-28 1992-12-29 Digital Equipment Corporation IC package hold-down fixture
US5381944A (en) * 1993-11-04 1995-01-17 The Regents Of The University Of California Low temperature reactive bonding
US5589489A (en) * 1993-12-15 1996-12-31 Zeneca Limited Cyclic amide derivatives for treating asthma
US5477009A (en) * 1994-03-21 1995-12-19 Motorola, Inc. Resealable multichip module and method therefore
US5538795B1 (en) * 1994-07-15 2000-04-18 Univ California Ignitable heterogeneous stratified structure for the propagation of an internal exothermic chemical reaction along an expanding wavefront and method making same
US5641713A (en) * 1995-03-23 1997-06-24 Texas Instruments Incorporated Process for forming a room temperature seal between a base cavity and a lid using an organic sealant and a metal seal ring
US5956576A (en) * 1996-09-13 1999-09-21 International Business Machines Corporation Enhanced protection of semiconductors with dual surface seal
KR20020020809A (ko) * 1999-08-13 2002-03-15 프리돌린 클라우스너, 롤란드 비. 보레르 페길화-인터페론-알파와 관련된 미코페놀레이트 모페틸
US6544662B2 (en) * 1999-10-25 2003-04-08 Alliedsignal Inc. Process for manufacturing of brazed multi-channeled structures
US6736942B2 (en) * 2000-05-02 2004-05-18 Johns Hopkins University Freestanding reactive multilayer foils
US6991856B2 (en) * 2000-05-02 2006-01-31 Johns Hopkins University Methods of making and using freestanding reactive multilayer foils
ATE411162T1 (de) * 2000-05-02 2008-10-15 Univ Johns Hopkins Verfahren zur herstellung einer reaktiven mehrschichtfolie sowie daraus resultierendes produkt
US20020179921A1 (en) * 2001-06-02 2002-12-05 Cohn Michael B. Compliant hermetic package

Also Published As

Publication number Publication date
EP1626836A2 (en) 2006-02-22
WO2005005092A3 (en) 2005-05-06
WO2005005092A2 (en) 2005-01-20
US20050136270A1 (en) 2005-06-23
AU2004256020A1 (en) 2005-01-20
TW200523058A (en) 2005-07-16
KR20060019531A (ko) 2006-03-03
JP2007501715A (ja) 2007-02-01
CN1816416A (zh) 2006-08-09
CA2525386A1 (en) 2005-01-20

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