BRPI0410277A - método para simular um comportamento de uma distribuição de energia dentro de um conjunto contendo um material multicamada reativo, dispositivo de armazenamento de programa legìvel por uma máquina, método para unir, e, junta - Google Patents
método para simular um comportamento de uma distribuição de energia dentro de um conjunto contendo um material multicamada reativo, dispositivo de armazenamento de programa legìvel por uma máquina, método para unir, e, juntaInfo
- Publication number
- BRPI0410277A BRPI0410277A BRPI0410277-0A BRPI0410277A BRPI0410277A BR PI0410277 A BRPI0410277 A BR PI0410277A BR PI0410277 A BRPI0410277 A BR PI0410277A BR PI0410277 A BRPI0410277 A BR PI0410277A
- Authority
- BR
- Brazil
- Prior art keywords
- joining
- behavior
- simulating
- energy distribution
- energy
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Soldering of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
- B23K35/0233—Sheets or foils
- B23K35/0238—Sheets or foils layered
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
-
- C—CHEMISTRY; METALLURGY
- C06—EXPLOSIVES; MATCHES
- C06B—EXPLOSIVES OR THERMIC COMPOSITIONS; MANUFACTURE THEREOF; USE OF SINGLE SUBSTANCES AS EXPLOSIVES
- C06B45/00—Compositions or products which are defined by structure or arrangement of component of product
- C06B45/12—Compositions or products which are defined by structure or arrangement of component of product having contiguous layers or zones
- C06B45/14—Compositions or products which are defined by structure or arrangement of component of product having contiguous layers or zones a layer or zone containing an inorganic explosive or an inorganic explosive or an inorganic thermic component
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B17/00—Systems involving the use of models or simulators of said systems
- G05B17/02—Systems involving the use of models or simulators of said systems electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
- B23K2103/05—Stainless steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Laminated Bodies (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Ceramic Products (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
"MéTODO PARA SIMULAR UM COMPORTAMENTO DE UMA DISTRIBUIçãO DE ENERGIA DENTRO DE UM CONJUNTO CONTENDO UM MATERIAL MULTICAMADA REATIVO, DISPOSITIVO DE ARMAZENAMENTO DE PROGRAMA LEGìVEL POR UMA MáQUINA, MéTODO PARA UNIR, E, JUNTA". Um modo de realização da invenção inclui um método para simular um comportamento de uma distribuição de energia dentro de um conjunto formado por solda forte ou solda branca para predizer vários parâmetros físicos do conjunto. O conjunto inclui, tipicamente, um material multicamada reativo. O método compreende as etapas de prover uma equação de evolução de energia tendo um termo de fonte de energia associado a uma reação auto-propagável que se origina dentro do material multicamada reativo. O método inclui também as etapas de discretizar a equação de evolução de energia, e determinar o comportamento da distribuição de energia no conjunto pela integração da equação de evolução de energia discretizada usando outros parâmetros associados ao conjunto.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US46984103P | 2003-05-13 | 2003-05-13 | |
| PCT/US2004/014775 WO2005005092A2 (en) | 2003-05-13 | 2004-05-12 | Method of controlling thermal waves in reactive multilayer joining and resulting product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0410277A true BRPI0410277A (pt) | 2006-05-16 |
Family
ID=34061899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0410277-0A BRPI0410277A (pt) | 2003-05-13 | 2004-05-12 | método para simular um comportamento de uma distribuição de energia dentro de um conjunto contendo um material multicamada reativo, dispositivo de armazenamento de programa legìvel por uma máquina, método para unir, e, junta |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20050136270A1 (pt) |
| EP (1) | EP1626836A2 (pt) |
| JP (1) | JP2007501715A (pt) |
| KR (1) | KR20060019531A (pt) |
| CN (1) | CN1816416A (pt) |
| AU (1) | AU2004256020A1 (pt) |
| BR (1) | BRPI0410277A (pt) |
| CA (1) | CA2525386A1 (pt) |
| TW (1) | TW200523058A (pt) |
| WO (1) | WO2005005092A2 (pt) |
Families Citing this family (42)
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| US20110027547A1 (en) * | 2000-05-02 | 2011-02-03 | Reactive Nanotechnologies, Inc. | Methods of making reactive composite materials and resulting products |
| US7121402B2 (en) * | 2003-04-09 | 2006-10-17 | Reactive Nano Technologies, Inc | Container hermetically sealed with crushable material and reactive multilayer material |
| US7278354B1 (en) | 2003-05-27 | 2007-10-09 | Surface Treatment Technologies, Inc. | Shock initiation devices including reactive multilayer structures |
| US7278353B2 (en) * | 2003-05-27 | 2007-10-09 | Surface Treatment Technologies, Inc. | Reactive shaped charges and thermal spray methods of making same |
| US9499895B2 (en) | 2003-06-16 | 2016-11-22 | Surface Treatment Technologies, Inc. | Reactive materials and thermal spray methods of making same |
| US7354659B2 (en) * | 2005-03-30 | 2008-04-08 | Reactive Nanotechnologies, Inc. | Method for fabricating large dimension bonds using reactive multilayer joining |
| US20080093418A1 (en) * | 2005-06-22 | 2008-04-24 | Weihs Timothy P | Multifunctional Reactive Composite Structures Fabricated From Reactive Composite Materials |
| JP4416704B2 (ja) | 2005-07-01 | 2010-02-17 | シャープ株式会社 | 無線伝送システム |
| US7687746B2 (en) * | 2005-07-11 | 2010-03-30 | Lawrence Livermore National Security, Llc | Electrical initiation of an energetic nanolaminate film |
| US8613808B2 (en) * | 2006-02-14 | 2013-12-24 | Surface Treatment Technologies, Inc. | Thermal deposition of reactive metal oxide/aluminum layers and dispersion strengthened aluminides made therefrom |
| KR20080103543A (ko) * | 2006-03-24 | 2008-11-27 | 파커-한니핀 코포레이션 | 반응성 포일 조립체 |
| CN101448600A (zh) * | 2006-04-25 | 2009-06-03 | 反应性纳米技术有限公司 | 利用反应性多层接合制备大尺寸结合物的方法 |
| US8342383B2 (en) * | 2006-07-06 | 2013-01-01 | Praxair Technology, Inc. | Method for forming sputter target assemblies having a controlled solder thickness |
| US9078294B2 (en) | 2006-08-07 | 2015-07-07 | University Of Massachusetts | Nanoheater elements, systems and methods of use thereof |
| US7469640B2 (en) | 2006-09-28 | 2008-12-30 | Alliant Techsystems Inc. | Flares including reactive foil for igniting a combustible grain thereof and methods of fabricating and igniting such flares |
| US7867441B2 (en) * | 2006-12-05 | 2011-01-11 | Lawrence Livermore National Security, Llc | Low to moderate temperature nanolaminate heater |
| JP4367493B2 (ja) | 2007-02-02 | 2009-11-18 | ソニー株式会社 | 無線通信システム、無線通信装置及び無線通信方法、並びにコンピュータ・プログラム |
| WO2009002852A2 (en) * | 2007-06-22 | 2008-12-31 | Reactive Nanotechnologies, Inc. | Reactive multilayer joining to control thermal stress |
| US20090032572A1 (en) * | 2007-08-03 | 2009-02-05 | Andy Oxfdord | System, method, and apparatus for reactive foil brazing of rock bit components. Hardfacing and compacts |
| US8882301B2 (en) * | 2007-08-31 | 2014-11-11 | Nanofoil Corporation | Method for low temperature bonding of electronic components |
| US8074869B2 (en) * | 2007-09-24 | 2011-12-13 | Baker Hughes Incorporated | System, method, and apparatus for reactive foil brazing of cutter components for fixed cutter bit |
| US8789366B2 (en) * | 2008-12-10 | 2014-07-29 | Raytheon Company | Shape memory stored energy assemblies and methods for using the same |
| US20110234362A1 (en) | 2008-12-10 | 2011-09-29 | Raytheon Company | Shape memory circuit breakers |
| US8764286B2 (en) * | 2008-12-10 | 2014-07-01 | Raytheon Company | Shape memory thermal sensors |
| US8418455B2 (en) * | 2008-12-10 | 2013-04-16 | Raytheon Company | Shape memory alloy separating apparatuses |
| DE102009006822B4 (de) * | 2009-01-29 | 2011-09-01 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Mikrostruktur, Verfahren zu deren Herstellung, Vorrichtung zum Bonden einer Mikrostruktur und Mikrosystem |
| JP2013016525A (ja) * | 2009-09-29 | 2013-01-24 | Fuji Electric Systems Co Ltd | パワー半導体モジュールおよびその製造方法 |
| GB2515411B (en) * | 2009-10-09 | 2015-06-10 | Senergy Holdings Ltd | Well simulation |
| US8590768B2 (en) * | 2010-06-14 | 2013-11-26 | GM Global Technology Operations LLC | Battery tab joint by reaction metallurgy |
| EP2662474A1 (de) * | 2012-05-07 | 2013-11-13 | Siemens Aktiengesellschaft | Verfahren zur Aufbringung einer Schutzschicht auf eine Turbinenkomponente |
| US9334675B2 (en) | 2012-08-15 | 2016-05-10 | Raytheon Company | Passive safety mechanism utilizing self-fracturing shape memory material |
| US9470213B2 (en) | 2012-10-16 | 2016-10-18 | Raytheon Company | Heat-actuated release mechanism |
| US9249014B2 (en) * | 2012-11-06 | 2016-02-02 | Infineon Technologies Austria Ag | Packaged nano-structured component and method of making a packaged nano-structured component |
| JP6111764B2 (ja) * | 2013-03-18 | 2017-04-12 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
| JP5672324B2 (ja) | 2013-03-18 | 2015-02-18 | 三菱マテリアル株式会社 | 接合体の製造方法及びパワーモジュール用基板の製造方法 |
| WO2015006452A1 (en) * | 2013-07-09 | 2015-01-15 | United Technologies Corporation | Vehicular engine and transmission components made of plated polymers |
| JP5720839B2 (ja) | 2013-08-26 | 2015-05-20 | 三菱マテリアル株式会社 | 接合体及びパワーモジュール用基板 |
| GB201401694D0 (en) * | 2014-01-31 | 2014-03-19 | Oxford Instr Nanotechnology Tools Ltd | Method of joining a superconductor |
| US10254097B2 (en) | 2015-04-15 | 2019-04-09 | Raytheon Company | Shape memory alloy disc vent cover release |
| DE102016115364A1 (de) * | 2016-08-18 | 2018-02-22 | Few Fahrzeugelektrik Werk Gmbh & Co. Kg | Verfahren zur Ausbildung einer stoffschlüssigen Fügeverbindung |
| JP7526116B2 (ja) | 2021-03-04 | 2024-07-31 | シチズンファインデバイス株式会社 | はんだの溶融持続時間算出方法 |
| CN113722894B (zh) * | 2021-08-16 | 2023-12-01 | 中山大学 | 一种基于模型简化的火灾蔓延模拟加速方法及系统 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3158927A (en) * | 1961-06-05 | 1964-12-01 | Burroughs Corp | Method of fabricating sub-miniature semiconductor matrix apparatus |
| US4607779A (en) * | 1983-08-11 | 1986-08-26 | National Semiconductor Corporation | Non-impact thermocompression gang bonding method |
| US4715526A (en) * | 1986-11-20 | 1987-12-29 | General Dynamics, Pomona Division | Floating seal and method of its use |
| US5038996A (en) * | 1988-10-12 | 1991-08-13 | International Business Machines Corporation | Bonding of metallic surfaces |
| US5175410A (en) * | 1991-06-28 | 1992-12-29 | Digital Equipment Corporation | IC package hold-down fixture |
| US5381944A (en) * | 1993-11-04 | 1995-01-17 | The Regents Of The University Of California | Low temperature reactive bonding |
| US5589489A (en) * | 1993-12-15 | 1996-12-31 | Zeneca Limited | Cyclic amide derivatives for treating asthma |
| US5477009A (en) * | 1994-03-21 | 1995-12-19 | Motorola, Inc. | Resealable multichip module and method therefore |
| US5538795B1 (en) * | 1994-07-15 | 2000-04-18 | Univ California | Ignitable heterogeneous stratified structure for the propagation of an internal exothermic chemical reaction along an expanding wavefront and method making same |
| US5641713A (en) * | 1995-03-23 | 1997-06-24 | Texas Instruments Incorporated | Process for forming a room temperature seal between a base cavity and a lid using an organic sealant and a metal seal ring |
| US5956576A (en) * | 1996-09-13 | 1999-09-21 | International Business Machines Corporation | Enhanced protection of semiconductors with dual surface seal |
| KR20020020809A (ko) * | 1999-08-13 | 2002-03-15 | 프리돌린 클라우스너, 롤란드 비. 보레르 | 페길화-인터페론-알파와 관련된 미코페놀레이트 모페틸 |
| US6544662B2 (en) * | 1999-10-25 | 2003-04-08 | Alliedsignal Inc. | Process for manufacturing of brazed multi-channeled structures |
| US6736942B2 (en) * | 2000-05-02 | 2004-05-18 | Johns Hopkins University | Freestanding reactive multilayer foils |
| US6991856B2 (en) * | 2000-05-02 | 2006-01-31 | Johns Hopkins University | Methods of making and using freestanding reactive multilayer foils |
| ATE411162T1 (de) * | 2000-05-02 | 2008-10-15 | Univ Johns Hopkins | Verfahren zur herstellung einer reaktiven mehrschichtfolie sowie daraus resultierendes produkt |
| US20020179921A1 (en) * | 2001-06-02 | 2002-12-05 | Cohn Michael B. | Compliant hermetic package |
-
2004
- 2004-05-12 BR BRPI0410277-0A patent/BRPI0410277A/pt not_active Application Discontinuation
- 2004-05-12 EP EP04775980A patent/EP1626836A2/en not_active Withdrawn
- 2004-05-12 US US10/843,352 patent/US20050136270A1/en not_active Abandoned
- 2004-05-12 CA CA002525386A patent/CA2525386A1/en not_active Abandoned
- 2004-05-12 CN CNA2004800193102A patent/CN1816416A/zh active Pending
- 2004-05-12 WO PCT/US2004/014775 patent/WO2005005092A2/en not_active Ceased
- 2004-05-12 JP JP2006532967A patent/JP2007501715A/ja active Pending
- 2004-05-12 AU AU2004256020A patent/AU2004256020A1/en not_active Abandoned
- 2004-05-12 KR KR1020057021365A patent/KR20060019531A/ko not_active Withdrawn
- 2004-05-13 TW TW093113478A patent/TW200523058A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP1626836A2 (en) | 2006-02-22 |
| WO2005005092A3 (en) | 2005-05-06 |
| WO2005005092A2 (en) | 2005-01-20 |
| US20050136270A1 (en) | 2005-06-23 |
| AU2004256020A1 (en) | 2005-01-20 |
| TW200523058A (en) | 2005-07-16 |
| KR20060019531A (ko) | 2006-03-03 |
| JP2007501715A (ja) | 2007-02-01 |
| CN1816416A (zh) | 2006-08-09 |
| CA2525386A1 (en) | 2005-01-20 |
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