BRPI0411937A - soluções de eletrodeposição por imersão acìdica aquosa e processos para depositar um revestimento protetor de liga de zinco sobre substratos de alumìnio ou de ligas a base de alumìnio e produtos obtidos através dos mesmos - Google Patents

soluções de eletrodeposição por imersão acìdica aquosa e processos para depositar um revestimento protetor de liga de zinco sobre substratos de alumìnio ou de ligas a base de alumìnio e produtos obtidos através dos mesmos

Info

Publication number
BRPI0411937A
BRPI0411937A BRPI0411937-1A BRPI0411937A BRPI0411937A BR PI0411937 A BRPI0411937 A BR PI0411937A BR PI0411937 A BRPI0411937 A BR PI0411937A BR PI0411937 A BRPI0411937 A BR PI0411937A
Authority
BR
Brazil
Prior art keywords
aluminum
depositing
aqueous acid
zinc alloy
processes
Prior art date
Application number
BRPI0411937-1A
Other languages
English (en)
Inventor
Nayan H Joshi
Maulik D Mehta
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BRPI0411937A publication Critical patent/BRPI0411937A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

"SOLUçõES DE ELETRODEPOSIçãO POR IMERSãO ACìDICA AQUOSA E PROCESSOS PARA DEPOSITAR UM REVESTIMENTO PROTETOR DE LIGA DE ZINCO SOBRE SUBSTRATOS DE ALUMINIO OU DE LIGAS A BASE DE ALUMìNIO E PRODUTOS OBTIDOS ATRAVéS DOS MESMOS". A presente invenção proporciona uma solução de eletrodeposição por imersão acídica aquosa sem cianeto que tem um pH de cerca de 3,5 a cerca de 6,5 e compreendendo íons de zinco, íons de níquel e/ou íons de ferro cobalto e íons de fluoreto. Em uma modalidade, as soluções de eletrodeposição por imersão da invenção também contêm pelo menos um inibidor contendo um ou mais átomos de nitrogênio, átomos de enxofre, ou tanto átomos de nitrogênio quanto átomos de enxofre. A presente invenção também se refere a métodos para depositar revestimentos protetores de liga de zinco sobre substratos de alumínio e de ligas a base de alumínio compreendendo imergir o substrato de alumínio ou de liga a base de alumínio na solução de eletrodeposição por imersão sem cianeto da invenção. Opcionalmente, o substrato de alumínio ou de liga a base de alumínio revestido por liga de zinco é depositado usando uma solução de eletrodeposição metal eletrolítica ou não eletrolítica.
BRPI0411937-1A 2003-06-26 2004-04-14 soluções de eletrodeposição por imersão acìdica aquosa e processos para depositar um revestimento protetor de liga de zinco sobre substratos de alumìnio ou de ligas a base de alumìnio e produtos obtidos através dos mesmos BRPI0411937A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/606,460 US7407689B2 (en) 2003-06-26 2003-06-26 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys
PCT/US2004/011417 WO2005010233A2 (en) 2003-06-26 2004-04-14 Aqueous acidic immersion plating solutions and methods for plating on aluminum and aluminum alloys

Publications (1)

Publication Number Publication Date
BRPI0411937A true BRPI0411937A (pt) 2006-08-15

Family

ID=33564180

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0411937-1A BRPI0411937A (pt) 2003-06-26 2004-04-14 soluções de eletrodeposição por imersão acìdica aquosa e processos para depositar um revestimento protetor de liga de zinco sobre substratos de alumìnio ou de ligas a base de alumìnio e produtos obtidos através dos mesmos

Country Status (9)

Country Link
US (1) US7407689B2 (pt)
EP (1) EP1649083B1 (pt)
JP (1) JP4714684B2 (pt)
KR (1) KR101078136B1 (pt)
CN (1) CN1839220B (pt)
BR (1) BRPI0411937A (pt)
CA (1) CA2530286A1 (pt)
TW (1) TWI306908B (pt)
WO (1) WO2005010233A2 (pt)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7064065B2 (en) * 2003-10-15 2006-06-20 Applied Materials, Inc. Silver under-layers for electroless cobalt alloys
US7704936B2 (en) * 2005-07-15 2010-04-27 Kobe Steel Ltd. Methods and removers for removing anodized films
KR100859259B1 (ko) * 2005-12-29 2008-09-18 주식회사 엘지화학 캡층 형성을 위한 코발트 계열 합금 무전해 도금 용액 및이를 이용하는 무전해 도금 방법
JP2007254866A (ja) * 2006-03-24 2007-10-04 Dowa Holdings Co Ltd アルミニウムまたはアルミニウム合金素材のめっき前処理方法
US8500985B2 (en) * 2006-07-21 2013-08-06 Novellus Systems, Inc. Photoresist-free metal deposition
US20080131728A1 (en) * 2006-12-01 2008-06-05 Manesh Nadupparambil Sekharan Acidic zincating solution
US7794530B2 (en) * 2006-12-22 2010-09-14 Lam Research Corporation Electroless deposition of cobalt alloys
JP2009191335A (ja) * 2008-02-15 2009-08-27 Ishihara Chem Co Ltd めっき液及び電子部品
US8486203B2 (en) * 2009-06-11 2013-07-16 Metalast International, Inc. Conversion coating and anodizing sealer with no chromium
CN102650058B (zh) * 2009-06-26 2015-04-15 中国石油化工股份有限公司 一种丁基橡胶氯甲烷甘醇脱水再生系统的复合缓蚀剂
CN102650059B (zh) * 2009-06-26 2015-04-15 中国石油化工股份有限公司 一种丁基橡胶氯甲烷甘醇脱水再生系统的复合缓蚀剂
CN102650057B (zh) * 2009-06-26 2015-04-15 中国石油化工股份有限公司 一种丁基橡胶氯甲烷甘醇脱水再生系统的复合缓蚀剂
US8608931B2 (en) * 2009-09-25 2013-12-17 Rohm And Haas Electronic Materials Llc Anti-displacement hard gold compositions
EP2463410B1 (en) * 2010-12-13 2018-07-04 Rohm and Haas Electronic Materials LLC Electrochemical etching of semiconductors
TWI477652B (zh) * 2011-01-04 2015-03-21 Hon Hai Prec Ind Co Ltd 鋁及鋁合金表面防腐處理方法及其鋁製品
JP5796963B2 (ja) * 2011-01-25 2015-10-21 東洋鋼鈑株式会社 ハードディスク装置用アルミニウム基板の製造方法
JP5590008B2 (ja) * 2011-11-14 2014-09-17 日本軽金属株式会社 燃料電池用集電板及びその製造方法
CN102888138A (zh) * 2012-09-21 2013-01-23 史昊东 汽车零件表面低温防腐保护剂
ES2727075T5 (es) * 2015-02-23 2022-05-27 Macdermid Enthone Inc Composición inhibidora para bastidores cuando se utilizan mordientes exentos de cromo en un proceso de galvanizado sobre materiales plásticos
CN105463525A (zh) * 2016-01-14 2016-04-06 深圳市瑞世兴科技有限公司 铝合金镀银方法
CN105463522A (zh) * 2016-01-22 2016-04-06 宏正（福建）化学品有限公司 一种铝或铝合金表面直接电镀金属锌的方法
WO2017146873A1 (en) * 2016-02-26 2017-08-31 Applied Materials, Inc. Enhanced plating bath and additive chemistries for cobalt plating
CN107338428B (zh) * 2017-06-02 2019-01-11 余卫民 钴、锌、铁三元体系磷酸盐金属表面处理剂、制备方法及复合沉积物
WO2020126687A1 (en) 2018-12-21 2020-06-25 Basf Se Composition for cobalt plating comprising additive for void-free submicron feature filling
WO2020220192A1 (en) * 2019-04-29 2020-11-05 Schaeffler Technologies AG & Co. KG An aluminum alloy cage and a processing method of the aluminum alloy cage
CN110129779B (zh) * 2019-06-12 2021-06-18 合肥工业大学 一种铝合金表面化学浸镀铁的方法
CN110565078B (zh) * 2019-07-11 2021-01-01 中国科学院兰州化学物理研究所 一种基于逆置换在铜表面制备钴硫薄膜的方法
KR102308251B1 (ko) * 2019-10-14 2021-09-30 주식회사 포스코 철 전기도금 용액, 이의 제조방법 및 이를 이용하여 제조된 철 전기도금 강판
JP7530759B2 (ja) * 2020-07-28 2024-08-08 上村工業株式会社 無電解パラジウムめっき浴
KR102699452B1 (ko) * 2021-10-08 2024-08-30 주식회사 써켐 알루미늄 또는 알루미늄 합금용 산성 징케이트 조성물 및 이를 이용한 징케이트 처리방법
CN113832507B (zh) * 2021-10-28 2023-03-21 重庆立道新材料科技有限公司 一种高硅铸铝合金环保浸锌固膜剂及其应用
JP7718962B2 (ja) * 2021-11-08 2025-08-05 上村工業株式会社 金属置換処理液、アルミニウム又はアルミニウム合金の表面処理方法
TW202407151A (zh) * 2022-06-16 2024-02-16 日商上村工業股份有限公司 蝕刻處理液、鋁或鋁合金的表面處理方法
CN117467991B (zh) * 2023-11-14 2026-01-27 金川集团镍钴股份有限公司 一种镍包铝粉及其制备方法
CN118002320B (zh) * 2024-03-19 2025-12-12 中南大学 一种铜钼混合精矿浮选组合抑制剂及应用

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2580773A (en) * 1948-07-31 1952-01-01 Philadelphia Rust Proof Co Method and composition for coating aluminum with zinc
US2676916A (en) * 1949-09-23 1954-04-27 Aluminum Co Of America Electroplating on aluminum
US2892760A (en) * 1954-10-28 1959-06-30 Dehydag Gmbh Production of metal electrodeposits
FR1496225A (fr) 1966-08-19 1967-09-29 Pechiney Prod Chimiques Sa Procédé de préparation de surface de l'aluminium et de ses alliages avant dépôt galvanique
FR1587618A (pt) 1968-06-25 1970-03-27
US3669854A (en) * 1970-08-03 1972-06-13 M & T Chemicals Inc Zinc electroplating electrolyte and process
US3672964A (en) 1971-03-17 1972-06-27 Du Pont Plating on aluminum,magnesium or zinc
SU398704A1 (ru) 1971-07-15 1973-09-27 Раствор для предварительной подготовки
US3930081A (en) * 1972-11-06 1975-12-30 Oxy Metal Industries Corp Composition and process for displacement plating of zinc surfaces
US3928147A (en) * 1973-10-09 1975-12-23 Monsanto Co Method for electroplating
JPS5345787B2 (pt) * 1973-12-10 1978-12-08
SE380549B (sv) 1974-03-22 1975-11-10 Nordstjernan Rederi Ab Forfarande for beleggning av foremal av aluminium, magnesium eller legeringar, som innehaller aluminium och/eller magnesium med en metall
US3960677A (en) * 1974-09-27 1976-06-01 The Harshaw Chemical Company Acid zinc electroplating
GB1464048A (en) 1975-10-17 1977-02-09 Ass Elect Ind Processes for the manufacture of aluminium articles coated with metals
US4134802A (en) * 1977-10-03 1979-01-16 Oxy Metal Industries Corporation Electrolyte and method for electrodepositing bright metal deposits
US4356067A (en) * 1979-06-13 1982-10-26 Electrochemical Products, Inc. Alkaline plating baths and electroplating process
FR2475582A1 (fr) 1980-02-13 1981-08-14 Peugeot Cycles Procede de nickelage avec particules
US4686017A (en) * 1981-11-05 1987-08-11 Union Oil Co. Of California Electrolytic bath and methods of use
US4416737A (en) * 1982-02-11 1983-11-22 National Steel Corporation Process of electroplating a nickel-zinc alloy on steel strip
JPS59205467A (ja) 1983-05-09 1984-11-21 Nippon Light Metal Co Ltd アルミニウム材の表面に亜鉛拡散処理に適した亜鉛析出層を形成する方法
US4488942A (en) * 1983-08-05 1984-12-18 Omi International Corporation Zinc and zinc alloy electroplating bath and process
US4670312A (en) 1985-02-07 1987-06-02 John Raymond Method for preparing aluminum for plating
US4755265A (en) 1985-06-28 1988-07-05 Union Oil Company Of California Processes for the deposition or removal of metals
JPH02141596A (ja) * 1988-11-21 1990-05-30 Yuken Kogyo Kk ジンケート型亜鉛合金メッキ浴
ES2027496A6 (es) * 1989-10-12 1992-06-01 Enthone Metodo para precipitar una capa metalica no electrica lisa sobre un substrato de aluminio.
JP2671612B2 (ja) * 1991-01-30 1997-10-29 住友金属工業株式会社 アルミニウム帯への亜鉛系直接電気めっき方法
US5182006A (en) 1991-02-04 1993-01-26 Enthone-Omi Inc. Zincate solutions for treatment of aluminum and aluminum alloys
US5965279A (en) 1993-11-22 1999-10-12 Axon'cable Sa Electrical conductor made of copper-plated and tin-plated aluminum
US5405523A (en) * 1993-12-15 1995-04-11 Taskem Inc. Zinc alloy plating with quaternary ammonium polymer
JP3422595B2 (ja) * 1995-06-12 2003-06-30 日本パーカライジング株式会社 アルミニウム合金用亜鉛置換処理浴
JP2901523B2 (ja) 1995-08-09 1999-06-07 日本カニゼン株式会社 無電解黒色めっき浴組成と皮膜の形成方法
JPH09125282A (ja) * 1995-10-30 1997-05-13 Chemitec:Kk アルミニウムおよびアルミニウム合金上へのジンケート処理剤
US6162343A (en) * 1996-06-11 2000-12-19 C. Uyemura & Co., Ltd. Method of preparing hard disc including treatment with amine-containing zincate solution
JP2000256864A (ja) * 1999-03-05 2000-09-19 Okuno Chem Ind Co Ltd アルミニウム又はアルミニウム合金表面の亜鉛置換方法、そのための置換液及び亜鉛置換皮膜を有するアルミニウム又はアルミニウム合金
DE10054544A1 (de) 2000-11-01 2002-05-08 Atotech Deutschland Gmbh Verfahren zum chemischen Metallisieren von Oberflächen
JP4849749B2 (ja) * 2001-08-31 2012-01-11 日本表面化学株式会社 アルカリ性電気亜鉛めっき浴およびめっき方法
US6790265B2 (en) * 2002-10-07 2004-09-14 Atotech Deutschland Gmbh Aqueous alkaline zincate solutions and methods

Also Published As

Publication number Publication date
WO2005010233A2 (en) 2005-02-03
CA2530286A1 (en) 2005-02-03
EP1649083A2 (en) 2006-04-26
JP2007521390A (ja) 2007-08-02
KR20060031644A (ko) 2006-04-12
US7407689B2 (en) 2008-08-05
EP1649083B1 (en) 2013-10-23
CN1839220A (zh) 2006-09-27
WO2005010233A3 (en) 2005-02-24
TW200500502A (en) 2005-01-01
CN1839220B (zh) 2012-12-05
TWI306908B (en) 2009-03-01
JP4714684B2 (ja) 2011-06-29
US20050008788A1 (en) 2005-01-13
KR101078136B1 (ko) 2011-10-28

Similar Documents

Publication Publication Date Title
BRPI0411937A (pt) soluções de eletrodeposição por imersão acìdica aquosa e processos para depositar um revestimento protetor de liga de zinco sobre substratos de alumìnio ou de ligas a base de alumìnio e produtos obtidos através dos mesmos
PT1114206E (pt) Banho aquoso alcalino e isento de cianeto para a electrodeposicao de revestimento de zinco ou de ligas de zinco
EP1405934B1 (en) Zinc-diffused alloy coating for corrosion/heat protection
MY131133A (en) Aqueous alkaline zincate solutions and methods
BRPI0418577A (pt) banhos, sistemas e processos para eletrodeposição de ligas ternárias e superiores de zinco-nìquel e artigos eletrodepositados
WO2007147605A3 (de) Tripyridinium-verbindungen als zusätze in wässrigen alkalischen, cyanidfreien bädern zur galvanischen abscheidung von zink- und zinklegierungsüberzügen
CN102162110A (zh) 一种甲基磺酸盐镀锡电解液及钢带或钢板的镀锡方法
BR0113458A (pt) Peças de alumìnio eletrogalvanizadas, processo para sua produção e produto obtido
CN105102689B (zh) 锌镍合金镀液及镀敷方法
US5234574A (en) Process for direct zinc electroplating of aluminum strip
WO2007021327A3 (en) Pretreatment of magnesium substrates for electroplating
ATE285489T1 (de) Elektrolytisches bad zum elektrochemischen abscheiden von gold und goldlegierungen
WO2002004713A3 (de) Verfahren zur elektrolytischen verzinkung aus alkansulfonsäurehaltigen elektrolyten
SE8300416D0 (sv) Zink cobalt alloy plating
EP1930478B1 (en) Electrolyte composition and method for the deposition of quaternary copper alloys
US20080110762A1 (en) Electrolyte Composition and Method for the Deposition of a Zinc-Nickel Alloy Layer on a Cast Iron Or Steel Substrate
PL437007A1 (pl) Sposób galwanicznego nakładania powłok metalicznych na powierzchni aluminium i stopów aluminium
EP2784188A1 (en) Process for corrosion protection of iron containing materials
TW200502339A (en) Method of coating with lead-free electrodeposition coating composition and coated article
JP2717406B2 (ja) 亜鉛合金メッキの黒色化方法
JP2619440B2 (ja) 加工性と塗装性に優れた表面処理鋼板
JP2004360004A (ja) 半田付け性に優れる錫めっき鋼板
TH70436A (th) สารละลายเอเควียสที่มีความเป็นกรดสำหรับชุดเคลือบและวิธีการสำหรับเคลือบบนอะลูมินัมและอะลูมินัม อัลลอย
JPH07166371A (ja) 耐食性、耐パウダリング性、耐低温衝撃剥離性、摺動性及びリン酸塩処理性にすぐれるＺｎ−Ｎｉ系合金めっき鋼板及びその製造方法
CA1233429A (en) Process for preparing zn-ni-alloy-electroplated steel sheets excellent in corrosion resistance

Legal Events

Date Code Title Description
B06A Notification to applicant to reply to the report for non-patentability or inadequacy of the application [chapter 6.1 patent gazette]
B11B Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements