BRPI0412515A - partìculas abrasivas para polimento quìmico mecánico - Google Patents

partìculas abrasivas para polimento quìmico mecánico

Info

Publication number
BRPI0412515A
BRPI0412515A BRPI0412515-0A BRPI0412515A BRPI0412515A BR PI0412515 A BRPI0412515 A BR PI0412515A BR PI0412515 A BRPI0412515 A BR PI0412515A BR PI0412515 A BRPI0412515 A BR PI0412515A
Authority
BR
Brazil
Prior art keywords
abrasive particles
nanometers
chemical polishing
mechanical chemical
volume
Prior art date
Application number
BRPI0412515-0A
Other languages
English (en)
Inventor
Jia-Ni Chu
James Neil Pryor
Original Assignee
Grace W R & Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34079279&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=BRPI0412515(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Grace W R & Co filed Critical Grace W R & Co
Publication of BRPI0412515A publication Critical patent/BRPI0412515A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

"PARTìCULAS ABRASIVAS PARA POLIMENTO QUìMICO MECáNICO". A presente invenção se refere a uma composição abrasiva para o polimento de substratos que incluem uma pluralidade de partículas abrasivas dotadas de uma distribuição de tamanho de partícula polidispersa com um tamanho médio, por volume, estando em cerca de 20 nanómetros a cerca de 100 nanómetros, o valor de amplitude, por volume, sendo superior ou igual a cerca de 20 nanómetros, onde a fração de partículas superior ou igual a cerca de 100 nanómetros é menor ou igual a 20% em volume das partículas abrasivas.
BRPI0412515-0A 2003-07-11 2004-07-09 partìculas abrasivas para polimento quìmico mecánico BRPI0412515A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US48668603P 2003-07-11 2003-07-11
PCT/US2004/021998 WO2005007770A1 (en) 2003-07-11 2004-07-09 Abrasive particles for chemical mechanical polishing

Publications (1)

Publication Number Publication Date
BRPI0412515A true BRPI0412515A (pt) 2006-09-19

Family

ID=34079279

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0412515-0A BRPI0412515A (pt) 2003-07-11 2004-07-09 partìculas abrasivas para polimento quìmico mecánico

Country Status (17)

Country Link
US (1) US20060175295A1 (pt)
EP (1) EP1660606B1 (pt)
JP (1) JP2007531631A (pt)
KR (1) KR101134827B1 (pt)
CN (1) CN1849379B (pt)
AU (1) AU2004257233A1 (pt)
BR (1) BRPI0412515A (pt)
CA (1) CA2532114A1 (pt)
DK (1) DK1660606T3 (pt)
ES (1) ES2436215T3 (pt)
MX (1) MXPA06000251A (pt)
NO (1) NO20060576L (pt)
PL (1) PL1660606T3 (pt)
PT (1) PT1660606E (pt)
RU (1) RU2356926C2 (pt)
TW (1) TWI415926B (pt)
WO (1) WO2005007770A1 (pt)

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JP5965907B2 (ja) * 2010-09-08 2016-08-10 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 電気機器や機械機器・光学機器用の基板の化学機械研磨用の水性研磨組成物と方法
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JP5979872B2 (ja) * 2011-01-31 2016-08-31 花王株式会社 磁気ディスク基板の製造方法
TWI605112B (zh) * 2011-02-21 2017-11-11 福吉米股份有限公司 研磨用組成物
JP5979871B2 (ja) * 2011-03-09 2016-08-31 花王株式会社 磁気ディスク基板の製造方法
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Also Published As

Publication number Publication date
RU2006104117A (ru) 2006-07-27
KR20060041220A (ko) 2006-05-11
EP1660606A1 (en) 2006-05-31
MXPA06000251A (es) 2006-03-30
DK1660606T3 (da) 2013-12-02
NO20060576L (no) 2006-02-03
KR101134827B1 (ko) 2012-04-13
AU2004257233A1 (en) 2005-01-27
CN1849379B (zh) 2011-12-14
US20060175295A1 (en) 2006-08-10
PL1660606T3 (pl) 2014-02-28
WO2005007770A1 (en) 2005-01-27
CN1849379A (zh) 2006-10-18
EP1660606B1 (en) 2013-09-04
CA2532114A1 (en) 2005-01-27
RU2356926C2 (ru) 2009-05-27
TWI415926B (zh) 2013-11-21
ES2436215T3 (es) 2013-12-27
TW200516132A (en) 2005-05-16
JP2007531631A (ja) 2007-11-08
PT1660606E (pt) 2013-12-09

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