BRPI0413376A - solução acìdica aquosa e método para depositar eletroliticamente revestimentos de cobre, assim como, uso da dita solução - Google Patents
solução acìdica aquosa e método para depositar eletroliticamente revestimentos de cobre, assim como, uso da dita soluçãoInfo
- Publication number
- BRPI0413376A BRPI0413376A BRPI0413376-5A BRPI0413376A BRPI0413376A BR PI0413376 A BRPI0413376 A BR PI0413376A BR PI0413376 A BRPI0413376 A BR PI0413376A BR PI0413376 A BRPI0413376 A BR PI0413376A
- Authority
- BR
- Brazil
- Prior art keywords
- sub
- solution
- aqueous acidic
- electrolytically depositing
- copper coatings
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Paints Or Removers (AREA)
Abstract
"SOLUçãO ACìDICA AQUOSA E MéTODO PARA DEPOSITAR ELETROLITICAMENTE REVESTIMENTOS DE COBRE, ASSIM COMO, USO DA DITA SOLUçãO". A presente invenção refere-se a uma solução acídica aquosa para deposição eletrolítica de revestimentos de cobre lisos e nivelados, brilhosos decorativos e altamente polidos sobre grandes partes de áreas de metal ou plástico, que compreende (a) pelo menos um aditivo de alto peso molecular contendo oxigênio; e (b)pelo menos um composto de enxofre solúvel em água, em que a solução adicionalmente contém (c) pelo menos um derivado halogenado aromático tendo a fórmula geral (I), onde R~ 1~, R~ 2~, R~ 3~, R~ 4~, R~ 5~ e R~ 6~, cada qual independentemente, representam radicais selecionados do grupo que consiste em hidrogênio, aldeído, acetila, hidróxi, hidroxialquila tendo de 1 a 4 átomos de carbono, alquila tendo de 1 a 4 átomos de carbono, e halogênio, com a condição de que o número de radicais R~ 1~, R~ 2~, R~ 3~, R~ 4~, R~ 5~ e R~ 6~, que são halogênios, varie de 1 a 5.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10337669A DE10337669B4 (de) | 2003-08-08 | 2003-08-08 | Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung |
| PCT/EP2004/008492 WO2005014891A2 (en) | 2003-08-08 | 2004-07-28 | Aqueous, acidic solution and method for electrolytically depositing copper coatings as well as use of said solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0413376A true BRPI0413376A (pt) | 2006-10-17 |
Family
ID=34112129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0413376-5A BRPI0413376A (pt) | 2003-08-08 | 2004-07-28 | solução acìdica aquosa e método para depositar eletroliticamente revestimentos de cobre, assim como, uso da dita solução |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US20080142370A1 (pt) |
| EP (1) | EP1651801B1 (pt) |
| JP (1) | JP4586020B2 (pt) |
| KR (1) | KR101105938B1 (pt) |
| CN (1) | CN1833054B (pt) |
| AT (1) | ATE384808T1 (pt) |
| BR (1) | BRPI0413376A (pt) |
| CA (1) | CA2532445C (pt) |
| DE (2) | DE10337669B4 (pt) |
| ES (1) | ES2298799T3 (pt) |
| MX (1) | MXPA06001555A (pt) |
| MY (1) | MY138397A (pt) |
| TW (1) | TW200512318A (pt) |
| WO (1) | WO2005014891A2 (pt) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4750486B2 (ja) * | 2005-07-06 | 2011-08-17 | 株式会社Adeka | 電解銅メッキ用添加剤、該添加剤を含有する電解銅メッキ浴及び該メッキ浴を使用する電解銅メッキ方法 |
| ATE506468T1 (de) * | 2008-04-28 | 2011-05-15 | Atotech Deutschland Gmbh | Wässriges saures bad und verfahren zum elektrolytischen abschneiden von kupfer |
| US8262894B2 (en) * | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| CN101899687A (zh) * | 2010-08-03 | 2010-12-01 | 济南德锡科技有限公司 | 单剂染料型光亮酸性镀铜添加剂及其制备方法和应用 |
| EP2465976B1 (en) | 2010-12-15 | 2013-04-03 | Rohm and Haas Electronic Materials LLC | Method of electroplating uniform copper layer on the edge and walls of though holes of a substrate. |
| CN103834972B (zh) * | 2014-02-10 | 2017-01-18 | 东莞华威铜箔科技有限公司 | 4微米无载体电解铜箔用添加剂、制备方法及其应用 |
| CN110295382B (zh) * | 2019-03-22 | 2021-07-13 | 苏州昕皓新材料科技有限公司 | 酸铜整平剂及其应用、铜电镀溶液及其制备方法 |
| CN110541179B (zh) * | 2019-09-23 | 2020-07-21 | 深圳市创智成功科技有限公司 | 用于晶圆级封装超级tsv铜互连材料的电镀铜溶液及电镀方法 |
| CN110846694B (zh) * | 2019-12-31 | 2020-12-08 | 天长市飞龙金属制品有限公司 | 一种镀锌液 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL291575A (pt) * | 1962-04-16 | |||
| DE1246347B (de) * | 1966-03-08 | 1967-08-03 | Schering Ag | Saures galvanisches Kupferbad |
| DE2039831C3 (de) * | 1970-06-06 | 1979-09-06 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge |
| FR2096936A1 (en) * | 1970-07-17 | 1972-03-03 | Labolac | Tin plating bath additive - 2,4,6-substd phenol for strong bright dep |
| JPS4916176B1 (pt) * | 1970-11-16 | 1974-04-20 | ||
| US4000047A (en) * | 1972-11-17 | 1976-12-28 | Lea-Ronal, Inc. | Electrodeposition of tin, lead and tin-lead alloys |
| AU496780B2 (en) * | 1975-03-11 | 1978-10-26 | Oxy Metal Industries Corporation | Additives in baths forthe electrodeposition of copper |
| DE2746938C2 (de) * | 1977-10-17 | 1987-04-09 | Schering AG, 1000 Berlin und 4709 Bergkamen | Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades |
| US4417956A (en) * | 1980-07-17 | 1983-11-29 | Electrochemical Products, Inc. | Alkaline plating baths and electroplating process |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| FR2510145B1 (fr) * | 1981-07-24 | 1986-02-07 | Rhone Poulenc Spec Chim | Additif pour bain de cuivrage electrolytique acide, son procede de preparation et son application au cuivrage des circuits imprimes |
| WO1984001393A1 (en) * | 1982-09-30 | 1984-04-12 | Learonal Inc | Electrolytic copper plating solutions |
| AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
| US4601847A (en) * | 1983-08-22 | 1986-07-22 | Macdermid, Incorporated | Composition for use in electroplating of metals |
| DE4032864A1 (de) * | 1990-10-13 | 1992-04-16 | Schering Ag | Saures bad zur galvanischen abscheidung von kupferueberzuegen und verfahren unter verwendung dieser kombination |
| JPH07316876A (ja) * | 1994-05-23 | 1995-12-05 | C Uyemura & Co Ltd | 電気銅めっき用添加剤及び電気銅めっき浴 |
| CN1222641C (zh) * | 1998-02-12 | 2005-10-12 | Acm研究公司 | 电镀设备及方法 |
| US6508927B2 (en) * | 1998-11-05 | 2003-01-21 | C. Uyemura & Co., Ltd. | Tin-copper alloy electroplating bath |
| US6911068B2 (en) * | 2001-10-02 | 2005-06-28 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6736954B2 (en) * | 2001-10-02 | 2004-05-18 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6773573B2 (en) * | 2001-10-02 | 2004-08-10 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
| US6652731B2 (en) * | 2001-10-02 | 2003-11-25 | Shipley Company, L.L.C. | Plating bath and method for depositing a metal layer on a substrate |
-
2003
- 2003-08-08 DE DE10337669A patent/DE10337669B4/de not_active Expired - Fee Related
-
2004
- 2004-07-28 US US10/566,913 patent/US20080142370A1/en not_active Abandoned
- 2004-07-28 WO PCT/EP2004/008492 patent/WO2005014891A2/en not_active Ceased
- 2004-07-28 BR BRPI0413376-5A patent/BRPI0413376A/pt not_active Application Discontinuation
- 2004-07-28 KR KR1020067002737A patent/KR101105938B1/ko not_active Expired - Fee Related
- 2004-07-28 EP EP04763597A patent/EP1651801B1/en not_active Expired - Lifetime
- 2004-07-28 DE DE602004011520T patent/DE602004011520T2/de not_active Expired - Lifetime
- 2004-07-28 AT AT04763597T patent/ATE384808T1/de active
- 2004-07-28 MX MXPA06001555A patent/MXPA06001555A/es active IP Right Grant
- 2004-07-28 ES ES04763597T patent/ES2298799T3/es not_active Expired - Lifetime
- 2004-07-28 CA CA2532445A patent/CA2532445C/en not_active Expired - Fee Related
- 2004-07-28 JP JP2006522934A patent/JP4586020B2/ja not_active Expired - Fee Related
- 2004-07-28 CN CN200480022211XA patent/CN1833054B/zh not_active Expired - Fee Related
- 2004-08-05 TW TW093123517A patent/TW200512318A/zh unknown
- 2004-08-06 MY MYPI20043199A patent/MY138397A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE10337669B4 (de) | 2006-04-27 |
| MY138397A (en) | 2009-05-29 |
| DE602004011520D1 (de) | 2008-03-13 |
| DE602004011520T2 (de) | 2009-02-05 |
| WO2005014891A2 (en) | 2005-02-17 |
| EP1651801A2 (en) | 2006-05-03 |
| TW200512318A (en) | 2005-04-01 |
| WO2005014891A3 (en) | 2005-05-26 |
| DE10337669A1 (de) | 2005-03-03 |
| JP4586020B2 (ja) | 2010-11-24 |
| MXPA06001555A (es) | 2006-05-15 |
| EP1651801B1 (en) | 2008-01-23 |
| CN1833054B (zh) | 2011-09-07 |
| CN1833054A (zh) | 2006-09-13 |
| US20080142370A1 (en) | 2008-06-19 |
| KR20060058109A (ko) | 2006-05-29 |
| CA2532445A1 (en) | 2005-02-17 |
| ES2298799T3 (es) | 2008-05-16 |
| ATE384808T1 (de) | 2008-02-15 |
| KR101105938B1 (ko) | 2012-01-18 |
| JP2007501899A (ja) | 2007-02-01 |
| CA2532445C (en) | 2012-03-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |