BRPI0413778A - sistema de resina modificada contendo enchimento que tem alto tg, transparência e boa confiabilidade em aplicações de enchimento no nìvel de wafer - Google Patents

sistema de resina modificada contendo enchimento que tem alto tg, transparência e boa confiabilidade em aplicações de enchimento no nìvel de wafer

Info

Publication number
BRPI0413778A
BRPI0413778A BRPI0413778-7A BRPI0413778A BRPI0413778A BR PI0413778 A BRPI0413778 A BR PI0413778A BR PI0413778 A BRPI0413778 A BR PI0413778A BR PI0413778 A BRPI0413778 A BR PI0413778A
Authority
BR
Brazil
Prior art keywords
modified resin
transparency
good reliability
containing filler
filling applications
Prior art date
Application number
BRPI0413778-7A
Other languages
English (en)
Inventor
Slawomir Rubinsztajn
Sandeep Tonapi
David Gibson
John Campbell
Ananth Prabhakumar
Ryan Mills
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of BRPI0413778A publication Critical patent/BRPI0413778A/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3081—Treatment with organo-silicon compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Nanotechnology (AREA)
  • Composite Materials (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Paints Or Removers (AREA)

Abstract

"SISTEMA DE RESINA MODIFICADA CONTENDO ENCHIMENTO QUE TEM ALTO Tg, TRANSPARêNCIA E BOA CONFIABILIDADE EM APLICAçõES DE ENCHIMENTO NO NìVEL DE WAFER". Um material de enchimento de resina modificada de solvente compreendendo uma resina em combinação com um enchimento de silica coloidal functionalizada e um solvente para formar uma composição de resina transparente em estágio B, a qual pode ser curada para formar uma reina de baixo CTE e um alto Tg de termosete. Configurações da descrição incluem um enchimento de nível wafer e um chip eletrónico encapsulado.
BRPI0413778-7A 2003-09-03 2004-08-03 sistema de resina modificada contendo enchimento que tem alto tg, transparência e boa confiabilidade em aplicações de enchimento no nìvel de wafer BRPI0413778A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/654,378 US20050049334A1 (en) 2003-09-03 2003-09-03 Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications
PCT/US2004/024849 WO2005024939A1 (en) 2003-09-03 2004-08-03 SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS

Publications (1)

Publication Number Publication Date
BRPI0413778A true BRPI0413778A (pt) 2006-10-31

Family

ID=34218078

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0413778-7A BRPI0413778A (pt) 2003-09-03 2004-08-03 sistema de resina modificada contendo enchimento que tem alto tg, transparência e boa confiabilidade em aplicações de enchimento no nìvel de wafer

Country Status (14)

Country Link
US (2) US20050049334A1 (pt)
EP (1) EP1665376A1 (pt)
JP (1) JP2007504321A (pt)
KR (1) KR20060093707A (pt)
CN (2) CN100490130C (pt)
AT (1) ATE446589T1 (pt)
AU (1) AU2004271534A1 (pt)
BR (1) BRPI0413778A (pt)
CA (1) CA2537828A1 (pt)
DE (1) DE602004023734D1 (pt)
MX (1) MXPA06002522A (pt)
RU (1) RU2358353C2 (pt)
WO (1) WO2005024939A1 (pt)
ZA (2) ZA200602267B (pt)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060147719A1 (en) * 2002-11-22 2006-07-06 Slawomir Rubinsztajn Curable composition, underfill, and method
US7022410B2 (en) * 2003-12-16 2006-04-04 General Electric Company Combinations of resin compositions and methods of use thereof
US20050266263A1 (en) * 2002-11-22 2005-12-01 General Electric Company Refractory solid, adhesive composition, and device, and associated method
US20050170188A1 (en) * 2003-09-03 2005-08-04 General Electric Company Resin compositions and methods of use thereof
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US7446136B2 (en) * 2005-04-05 2008-11-04 Momentive Performance Materials Inc. Method for producing cure system, adhesive system, and electronic device
US7405246B2 (en) * 2005-04-05 2008-07-29 Momentive Performance Materials Inc. Cure system, adhesive system, electronic device
US7339834B2 (en) 2005-06-03 2008-03-04 Sandisk Corporation Starting program voltage shift with cycling of non-volatile memory
DE102005040126A1 (de) * 2005-08-25 2007-03-01 Altana Electrical Insulation Gmbh Überzugsmasse
TWI305389B (en) * 2005-09-05 2009-01-11 Advanced Semiconductor Eng Matrix package substrate process
US7551482B2 (en) 2006-12-27 2009-06-23 Sandisk Corporation Method for programming with initial programming voltage based on trial
US7570520B2 (en) 2006-12-27 2009-08-04 Sandisk Corporation Non-volatile storage system with initial programming voltage based on trial
JPWO2009008509A1 (ja) * 2007-07-11 2010-09-09 日産化学工業株式会社 無機粒子を含有した液状エポキシ樹脂形成用製剤
ES2644759T3 (es) * 2008-07-18 2017-11-30 Evonik Degussa Gmbh Dispersión de partículas de dióxido de silicio hidrofobizadas y granulado de la misma
DE102008048874A1 (de) * 2008-09-25 2010-04-08 Siemens Aktiengesellschaft Beschichtungen für elektronische Schaltungen
WO2010043638A2 (en) * 2008-10-15 2010-04-22 Basf Se Curable epoxide formulation containing silica
JP5353629B2 (ja) * 2008-11-14 2013-11-27 信越化学工業株式会社 熱硬化性樹脂組成物
JP5638812B2 (ja) * 2010-02-01 2014-12-10 株式会社ダイセル 硬化性エポキシ樹脂組成物
BR112012032981A2 (pt) * 2010-06-25 2016-11-22 Dow Global Technologies Llc composição de resina epóxi curável livre de diluente para preparar um compósito, processo para preparar uma composição ou sistema de resina curável, livre de diluente, produto compósito curado e processo para preparar produto compósito curado
US8070046B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Amine flux composition and method of soldering
US8070045B1 (en) * 2010-12-02 2011-12-06 Rohm And Haas Electronic Materials Llc Curable amine flux composition and method of soldering
JP5598343B2 (ja) * 2011-01-17 2014-10-01 信越化学工業株式会社 半導体封止用液状エポキシ樹脂組成物及び半導体装置
US8531821B2 (en) * 2011-01-28 2013-09-10 Raytheon Company System for securing a semiconductor device to a printed circuit board
JP5685451B2 (ja) * 2011-02-01 2015-03-18 アイカ工業株式会社 難燃化用組成物及び化粧板
CN102876179B (zh) * 2011-07-13 2015-03-11 中国科学院化学研究所 用于喷墨打印直接制版用铝版基的涂料及其制法和应用
KR20130059291A (ko) 2011-11-28 2013-06-05 닛토덴코 가부시키가이샤 언더필재 및 반도체 장치의 제조 방법
KR102244404B1 (ko) * 2014-02-24 2021-04-26 헨켈 아이피 앤드 홀딩 게엠베하 열전도성 선-적용형 언더필 제제 및 그의 용도
US9833450B2 (en) * 2015-02-19 2017-12-05 Lixte Biotechnology, Inc. Oxabicycloheptanes and oxabicycloheptenes for the treatment of depressive and stress disorders
DE112017003987T5 (de) * 2016-08-10 2019-04-18 Panasonic Intellectual Property Management Co., Ltd. Acrylzusammensetzung zur versiegelung, folienmaterial, mehrschichtige folie, gehärtetes produkt, halbleitervorrichtung und verfahren zur herstellung einer halbleitervorrichtung
TWI606565B (zh) * 2016-08-31 2017-11-21 金寶電子工業股份有限公司 封裝結構及其製作方法
TWI654218B (zh) 2018-01-08 2019-03-21 財團法人工業技術研究院 樹脂組合物與導熱材料的形成方法
CN109504327A (zh) * 2018-11-13 2019-03-22 烟台德邦科技有限公司 一种高Tg高可靠性的环氧树脂封装导电胶及其制备方法
CN116323700A (zh) * 2020-10-09 2023-06-23 株式会社大赛璐 固化性化合物产品
CN114149725B (zh) * 2021-11-25 2022-07-08 中国船舶重工集团公司第七二五研究所 一种破冰船用破冰涂料及其制备方法
CN119432145A (zh) * 2023-07-31 2025-02-14 华为技术有限公司 分散液、浆料及其应用
CN116814174B (zh) * 2023-08-24 2023-11-28 佛山市奥川顺新材料实业有限公司 一种复合型pet保护膜及其制备方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4217438A (en) * 1978-12-15 1980-08-12 General Electric Company Polycarbonate transesterification process
JPH04154861A (ja) * 1990-10-19 1992-05-27 Toshiba Silicone Co Ltd 樹脂組成物
CA2066497A1 (en) * 1991-05-01 1992-11-02 Michael K. Gallagher Epoxy molding composition for surface mount applications
US5249101A (en) * 1992-07-06 1993-09-28 International Business Machines Corporation Chip carrier with protective coating for circuitized surface
US5307438A (en) * 1992-08-13 1994-04-26 Minnesota Mining And Manufacturing Company Index matching compositions with improved DNG/DT
JPH06232296A (ja) * 1993-02-05 1994-08-19 Nitto Denko Corp 半導体装置
RU2069461C1 (ru) * 1994-03-05 1996-11-20 Фирма "ЗИ" Способ герметизации изделий
NL9402233A (nl) * 1994-12-29 1996-08-01 3P Licensing Bv Werkwijze voor het omhullen van een elektronische component, een aldus omhulde elektronische component en daarvoor bestemd kunststofmateriaal.
JPH1176928A (ja) * 1997-09-03 1999-03-23 Asahi Glass Co Ltd 透明被覆成形品の製造方法
US6210790B1 (en) * 1998-07-15 2001-04-03 Rensselaer Polytechnic Institute Glass-like composites comprising a surface-modified colloidal silica and method of making thereof
US6576718B1 (en) * 1999-10-05 2003-06-10 General Electric Company Powder coating of thermosetting resin(s) and poly(phenylene ethers(s))
US6555602B1 (en) * 1999-10-06 2003-04-29 Nitto Denko Corporation Composition of epoxy resin, anhydride and microcapsule accelerator
JP4633214B2 (ja) * 1999-12-08 2011-02-16 富士通株式会社 エポキシ樹脂組成物
US6578718B2 (en) * 2000-05-01 2003-06-17 Raymond H. Levy Paint chip display system
US6548189B1 (en) * 2001-10-26 2003-04-15 General Electric Company Epoxy adhesive
US6833629B2 (en) * 2001-12-14 2004-12-21 National Starch And Chemical Investment Holding Corporation Dual cure B-stageable underfill for wafer level
US7037399B2 (en) * 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
US20030164555A1 (en) * 2002-03-01 2003-09-04 Tong Quinn K. B-stageable underfill encapsulant and method for its application
ATE482608T1 (de) * 2002-05-23 2010-10-15 3M Innovative Properties Co Elektronische baugruppe und verfahren zur herstellung einer elektronischen baugruppe
US20040102529A1 (en) * 2002-11-22 2004-05-27 Campbell John Robert Functionalized colloidal silica, dispersions and methods made thereby
US20040101688A1 (en) * 2002-11-22 2004-05-27 Slawomir Rubinsztajn Curable epoxy compositions, methods and articles made therefrom
JP4481672B2 (ja) * 2003-02-07 2010-06-16 株式会社日本触媒 半導体封止材用微粒子および半導体封止用樹脂組成物

Also Published As

Publication number Publication date
CN1875477A (zh) 2006-12-06
ATE446589T1 (de) 2009-11-15
US20050049352A1 (en) 2005-03-03
AU2004271534A1 (en) 2005-03-17
ZA200602267B (en) 2007-07-25
EP1665376A1 (en) 2006-06-07
KR20060093707A (ko) 2006-08-25
MXPA06002522A (es) 2006-06-20
RU2358353C2 (ru) 2009-06-10
ZA200602266B (en) 2007-07-25
CN1875478A (zh) 2006-12-06
DE602004023734D1 (de) 2009-12-03
WO2005024939A1 (en) 2005-03-17
US20050049334A1 (en) 2005-03-03
CN100490130C (zh) 2009-05-20
RU2006110520A (ru) 2007-10-10
JP2007504321A (ja) 2007-03-01
CA2537828A1 (en) 2005-03-17

Similar Documents

Publication Publication Date Title
BRPI0413778A (pt) sistema de resina modificada contendo enchimento que tem alto tg, transparência e boa confiabilidade em aplicações de enchimento no nìvel de wafer
MY126953A (en) Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same
CA2029970C (en) Radiation curable organosiloxane gel composition
BR9806743A (pt) Composições de resina de termocura
MY148272A (en) Curable silicone composition
TWI299748B (en) Adhesive composition, its manufacturing method, and adhesive film, substrate for carrying a semiconductor device and semiconductor device using such adhesive composition
MY149331A (en) Composition containing cycloaliphatic epoxide, polyol oligomer, curing agent and curing accelerator
MY142243A (en) Curing accelerator, epoxy resin composition, and semiconductor device
TW200940672A (en) Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods
KR970701742A (ko) 에폭시 수지 조성물
MY151073A (en) Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the same
TW200730578A (en) Liquid resin composition for electronic element and electronic element device
TW200726812A (en) Liquid resin composition for electronic components and electronic components device
DE602006020885D1 (de) Harzzusammensetzung und integrierte hybridleiterplatte damit
MY157414A (en) Epoxy resin composition and semiconductor device
BRPI0413780A (pt) composições de resina de solvente modificada e método de uso das mesmas
CN111423835A (zh) 一种cob电子封装胶及其制备方法
CN104934382A (zh) 附半导体密封用基材的密封材料、半导体装置、及半导体装置的制造方法
JP3819148B2 (ja) エポキシ封止用樹脂組成物、それを用いた半導体装置、半導体チップモジュール、および半導体チップパッケージ
KR100899720B1 (ko) 다이 접착 필름과 이를 위한 수지 조성물
JP2005089645A (ja) 封止用樹脂組成物およびそれを用いた半導体装置
MY162107A (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
Xiao et al. Breaking the Thermal Conductivity–Adhesion–Viscosity Trade‐off in Thermally Conductive Adhesive via Hyperbranched Networks and Multi‐Scale Fillers
MY126565A (en) Epoxy resin composition and resin-encapsulated semiconductor device
JP2006265370A (ja) 光半導体封止用エポキシ樹脂組成物及び光半導体装置

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2159 DE 22/05/2012.