BRPI0504768A - conjunto de diodos luminosos e processo para produção de um conjunto de diodos luminosos - Google Patents

conjunto de diodos luminosos e processo para produção de um conjunto de diodos luminosos

Info

Publication number
BRPI0504768A
BRPI0504768A BRPI0504768-4A BRPI0504768A BRPI0504768A BR PI0504768 A BRPI0504768 A BR PI0504768A BR PI0504768 A BRPI0504768 A BR PI0504768A BR PI0504768 A BRPI0504768 A BR PI0504768A
Authority
BR
Brazil
Prior art keywords
light
conductor line
led set
producing
diode
Prior art date
Application number
BRPI0504768-4A
Other languages
English (en)
Portuguese (pt)
Inventor
Ulrich Keth
Original Assignee
P M C Projekt Man Consult Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P M C Projekt Man Consult Gmbh filed Critical P M C Projekt Man Consult Gmbh
Publication of BRPI0504768A publication Critical patent/BRPI0504768A/pt

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S45/00Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
    • F21S45/40Cooling of lighting devices
    • F21S45/47Passive cooling, e.g. using fins, thermal conductive elements or openings
    • F21S45/48Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8582Means for heat extraction or cooling characterised by their shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S43/00Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
    • F21S43/10Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
    • F21S43/13Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
    • F21S43/14Light emitting diodes [LED]
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0302Properties and characteristics in general
    • H05K2201/0305Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
BRPI0504768-4A 2004-04-07 2005-03-24 conjunto de diodos luminosos e processo para produção de um conjunto de diodos luminosos BRPI0504768A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004016847A DE102004016847A1 (de) 2004-04-07 2004-04-07 Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung
PCT/EP2005/003131 WO2005099323A2 (de) 2004-04-07 2005-03-24 Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung

Publications (1)

Publication Number Publication Date
BRPI0504768A true BRPI0504768A (pt) 2006-10-24

Family

ID=34970784

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0504768-4A BRPI0504768A (pt) 2004-04-07 2005-03-24 conjunto de diodos luminosos e processo para produção de um conjunto de diodos luminosos

Country Status (4)

Country Link
EP (1) EP1733599A2 (de)
BR (1) BRPI0504768A (de)
DE (1) DE102004016847A1 (de)
WO (1) WO2005099323A2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100764380B1 (ko) 2005-12-16 2007-10-08 삼성전기주식회사 슬림형 백라이트유닛
KR101347486B1 (ko) * 2006-01-31 2014-01-02 쓰리엠 이노베이티브 프로퍼티즈 컴파니 유연성 포일 구조를 구비한 led 조명 조립체
US7806560B2 (en) 2007-01-31 2010-10-05 3M Innovative Properties Company LED illumination assembly with compliant foil construction
TWI324669B (en) * 2007-03-15 2010-05-11 Ind Tech Res Inst Light modules
DE102007023918A1 (de) 2007-05-23 2008-11-27 Siemens Ag Österreich Beleuchtungseinheit
KR100962706B1 (ko) 2009-11-27 2010-06-15 주식회사 테크엔 파워 led를 갖는 대형 조명등의 제조 방법
DE102009054840A1 (de) * 2009-12-17 2011-06-22 Poly-Tech Service GmbH, 67681 Leuchtmittel mit einer Mehrzahl von Leuchtdioden
DE202014102862U1 (de) * 2014-06-24 2015-09-25 Zumtobel Lighting Gmbh Anordnung zur Lichtabgabe mit LED und Trägerelement

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2751576B2 (ja) 1990-06-14 1998-05-18 日立電線株式会社 発光ダイオード・マイクロチップの実装方法
JPH09329395A (ja) * 1996-06-06 1997-12-22 Furukawa Electric Co Ltd:The ヒートシンク
JP4056598B2 (ja) 1997-10-09 2008-03-05 シチズン電子株式会社 赤外線データ通信モジュール
DE19922176C2 (de) 1999-05-12 2001-11-15 Osram Opto Semiconductors Gmbh Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung
JP2002162626A (ja) 2000-11-22 2002-06-07 Sony Corp 液晶表示用光源の放熱装置及びその製造方法
JP4737575B2 (ja) 2001-01-30 2011-08-03 ハリソン東芝ライティング株式会社 発光ダイオードアレイ及び光源装置
WO2002089221A1 (en) 2001-04-23 2002-11-07 Matsushita Electric Works, Ltd. Light emitting device comprising led chip
KR100419611B1 (ko) 2001-05-24 2004-02-25 삼성전기주식회사 발광다이오드 및 이를 이용한 발광장치와 그 제조방법
JP4045781B2 (ja) 2001-08-28 2008-02-13 松下電工株式会社 発光装置
US6498355B1 (en) 2001-10-09 2002-12-24 Lumileds Lighting, U.S., Llc High flux LED array
DE20120770U1 (de) * 2001-12-21 2002-03-28 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Oberflächenmontierte LED-Mehrfachanordnung und Beleuchtungseinrichtung damit
DE10234995A1 (de) 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung mit thermischem Chipanschluß und Leuchtdiodenmodul
DE20300626U1 (de) * 2002-11-19 2003-05-28 electronic service willms GmbH & Co. KG, 52223 Stolberg Leiterkarte, Anordnung aus Leiterkarte, Bauteil und/oder Kühlelement sowie Hochleistungs-LED-Anordnung

Also Published As

Publication number Publication date
DE102004016847A1 (de) 2005-12-22
WO2005099323A2 (de) 2005-10-20
EP1733599A2 (de) 2006-12-20
WO2005099323A3 (de) 2006-02-16

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2259 DE 22/04/2014.