BRPI0504768A - conjunto de diodos luminosos e processo para produção de um conjunto de diodos luminosos - Google Patents
conjunto de diodos luminosos e processo para produção de um conjunto de diodos luminososInfo
- Publication number
- BRPI0504768A BRPI0504768A BRPI0504768-4A BRPI0504768A BRPI0504768A BR PI0504768 A BRPI0504768 A BR PI0504768A BR PI0504768 A BRPI0504768 A BR PI0504768A BR PI0504768 A BRPI0504768 A BR PI0504768A
- Authority
- BR
- Brazil
- Prior art keywords
- light
- conductor line
- led set
- producing
- diode
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8582—Means for heat extraction or cooling characterised by their shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102004016847A DE102004016847A1 (de) | 2004-04-07 | 2004-04-07 | Leuchtdiodenanordnung und Verfahren zum Herstellen einer Leuchtdiodenanordnung |
| PCT/EP2005/003131 WO2005099323A2 (de) | 2004-04-07 | 2005-03-24 | Leuchtdiodenanordnung und verfahren zum herstellen einer leuchtdiodenanordnung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0504768A true BRPI0504768A (pt) | 2006-10-24 |
Family
ID=34970784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0504768-4A BRPI0504768A (pt) | 2004-04-07 | 2005-03-24 | conjunto de diodos luminosos e processo para produção de um conjunto de diodos luminosos |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1733599A2 (de) |
| BR (1) | BRPI0504768A (de) |
| DE (1) | DE102004016847A1 (de) |
| WO (1) | WO2005099323A2 (de) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100764380B1 (ko) | 2005-12-16 | 2007-10-08 | 삼성전기주식회사 | 슬림형 백라이트유닛 |
| KR101347486B1 (ko) * | 2006-01-31 | 2014-01-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 유연성 포일 구조를 구비한 led 조명 조립체 |
| US7806560B2 (en) | 2007-01-31 | 2010-10-05 | 3M Innovative Properties Company | LED illumination assembly with compliant foil construction |
| TWI324669B (en) * | 2007-03-15 | 2010-05-11 | Ind Tech Res Inst | Light modules |
| DE102007023918A1 (de) | 2007-05-23 | 2008-11-27 | Siemens Ag Österreich | Beleuchtungseinheit |
| KR100962706B1 (ko) | 2009-11-27 | 2010-06-15 | 주식회사 테크엔 | 파워 led를 갖는 대형 조명등의 제조 방법 |
| DE102009054840A1 (de) * | 2009-12-17 | 2011-06-22 | Poly-Tech Service GmbH, 67681 | Leuchtmittel mit einer Mehrzahl von Leuchtdioden |
| DE202014102862U1 (de) * | 2014-06-24 | 2015-09-25 | Zumtobel Lighting Gmbh | Anordnung zur Lichtabgabe mit LED und Trägerelement |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2751576B2 (ja) | 1990-06-14 | 1998-05-18 | 日立電線株式会社 | 発光ダイオード・マイクロチップの実装方法 |
| JPH09329395A (ja) * | 1996-06-06 | 1997-12-22 | Furukawa Electric Co Ltd:The | ヒートシンク |
| JP4056598B2 (ja) | 1997-10-09 | 2008-03-05 | シチズン電子株式会社 | 赤外線データ通信モジュール |
| DE19922176C2 (de) | 1999-05-12 | 2001-11-15 | Osram Opto Semiconductors Gmbh | Oberflächenmontierte LED-Mehrfachanordnung und deren Verwendung in einer Beleuchtungseinrichtung |
| JP2002162626A (ja) | 2000-11-22 | 2002-06-07 | Sony Corp | 液晶表示用光源の放熱装置及びその製造方法 |
| JP4737575B2 (ja) | 2001-01-30 | 2011-08-03 | ハリソン東芝ライティング株式会社 | 発光ダイオードアレイ及び光源装置 |
| WO2002089221A1 (en) | 2001-04-23 | 2002-11-07 | Matsushita Electric Works, Ltd. | Light emitting device comprising led chip |
| KR100419611B1 (ko) | 2001-05-24 | 2004-02-25 | 삼성전기주식회사 | 발광다이오드 및 이를 이용한 발광장치와 그 제조방법 |
| JP4045781B2 (ja) | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | 発光装置 |
| US6498355B1 (en) | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
| DE20120770U1 (de) * | 2001-12-21 | 2002-03-28 | OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg | Oberflächenmontierte LED-Mehrfachanordnung und Beleuchtungseinrichtung damit |
| DE10234995A1 (de) | 2002-07-31 | 2004-02-12 | Osram Opto Semiconductors Gmbh | Leuchtdiodenanordnung mit thermischem Chipanschluß und Leuchtdiodenmodul |
| DE20300626U1 (de) * | 2002-11-19 | 2003-05-28 | electronic service willms GmbH & Co. KG, 52223 Stolberg | Leiterkarte, Anordnung aus Leiterkarte, Bauteil und/oder Kühlelement sowie Hochleistungs-LED-Anordnung |
-
2004
- 2004-04-07 DE DE102004016847A patent/DE102004016847A1/de not_active Withdrawn
-
2005
- 2005-03-24 BR BRPI0504768-4A patent/BRPI0504768A/pt not_active IP Right Cessation
- 2005-03-24 WO PCT/EP2005/003131 patent/WO2005099323A2/de not_active Ceased
- 2005-03-24 EP EP05752758A patent/EP1733599A2/de not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| DE102004016847A1 (de) | 2005-12-22 |
| WO2005099323A2 (de) | 2005-10-20 |
| EP1733599A2 (de) | 2006-12-20 |
| WO2005099323A3 (de) | 2006-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 9A ANUIDADE. |
|
| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2259 DE 22/04/2014. |