BRPI0508205A - métodos de remoção de depósitos de superfìcie - Google Patents
métodos de remoção de depósitos de superfìcieInfo
- Publication number
- BRPI0508205A BRPI0508205A BRPI0508205-6A BRPI0508205A BRPI0508205A BR PI0508205 A BRPI0508205 A BR PI0508205A BR PI0508205 A BRPI0508205 A BR PI0508205A BR PI0508205 A BRPI0508205 A BR PI0508205A
- Authority
- BR
- Brazil
- Prior art keywords
- removal methods
- deposit removal
- surface deposit
- enhancement
- involves
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
- Y02C20/00—Capture or disposal of greenhouse gases
- Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Public Health (AREA)
- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Optics & Photonics (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- ing And Chemical Polishing (AREA)
Abstract
MéTODOS DE REMOçãO DE DEPóSITOS DE SUPERFìCIE A presente invenção refere-se a um método de limpeza de plasma remoto aprimorado para a remoção de depósitos superfíciais de uma superfície, tal como o lado interno de câmara de deposição que é utilizada na fabricação de dispositivos eletrónicos. O aprimoramento envolve o uso de gás ativado com alta temperatura neutra de pelo menos cerca de 3000 K. O aprimoramento também envolve a otimização de razões entre oxigênio e fluorocarbono para melhores velocidades de corrosão e controle dos gases de emissão.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US55622704P | 2004-03-24 | 2004-03-24 | |
| US64044404P | 2004-12-30 | 2004-12-30 | |
| US64083304P | 2004-12-30 | 2004-12-30 | |
| PCT/US2005/010692 WO2005098086A2 (en) | 2004-03-24 | 2005-03-24 | Remote chamber methods for removing surface deposits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0508205A true BRPI0508205A (pt) | 2007-07-17 |
Family
ID=34965582
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0508204-8A BRPI0508204A (pt) | 2004-03-24 | 2005-03-24 | método de remoção de depósitos de uma superfìcie |
| BRPI0508214-5A BRPI0508214A (pt) | 2004-03-24 | 2005-03-24 | métodos de remoção de depósitos de superfìcie |
| BRPI0508205-6A BRPI0508205A (pt) | 2004-03-24 | 2005-03-24 | métodos de remoção de depósitos de superfìcie |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0508204-8A BRPI0508204A (pt) | 2004-03-24 | 2005-03-24 | método de remoção de depósitos de uma superfìcie |
| BRPI0508214-5A BRPI0508214A (pt) | 2004-03-24 | 2005-03-24 | métodos de remoção de depósitos de superfìcie |
Country Status (6)
| Country | Link |
|---|---|
| EP (3) | EP1733071A2 (pt) |
| JP (3) | JP2007531288A (pt) |
| KR (3) | KR20070043697A (pt) |
| BR (3) | BRPI0508204A (pt) |
| TW (3) | TWI284929B (pt) |
| WO (3) | WO2005095670A2 (pt) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0697467A1 (en) * | 1994-07-21 | 1996-02-21 | Applied Materials, Inc. | Method and apparatus for cleaning a deposition chamber |
| US7581549B2 (en) * | 2004-07-23 | 2009-09-01 | Air Products And Chemicals, Inc. | Method for removing carbon-containing residues from a substrate |
| TW200718479A (en) * | 2005-08-02 | 2007-05-16 | Massachusetts Inst Technology | Method of using sulfur fluoride for removing surface deposits |
| US9034199B2 (en) | 2012-02-21 | 2015-05-19 | Applied Materials, Inc. | Ceramic article with reduced surface defect density and process for producing a ceramic article |
| US9212099B2 (en) | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
| CN104853855B (zh) * | 2012-12-18 | 2020-07-24 | 海星化学有限公司 | 用于薄膜沉积反应器和薄膜层的原位干式清洁的过程和方法 |
| JP6202423B2 (ja) * | 2013-03-05 | 2017-09-27 | パナソニックIpマネジメント株式会社 | プラズマクリーニング方法およびプラズマクリーニング装置 |
| US9850568B2 (en) | 2013-06-20 | 2017-12-26 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| US10109496B2 (en) * | 2013-12-30 | 2018-10-23 | The Chemours Company Fc, Llc | Chamber cleaning and semiconductor etching gases |
| SG11202106864TA (en) * | 2018-12-25 | 2021-07-29 | Showa Denko Kk | Adhesion removal method and film-forming method |
| US11854773B2 (en) | 2020-03-31 | 2023-12-26 | Applied Materials, Inc. | Remote plasma cleaning of chambers for electronics manufacturing systems |
| EP3954804A1 (de) * | 2020-08-14 | 2022-02-16 | Siltronic AG | Vorrichtung und verfahren zum abscheiden einer schicht aus halbleitermaterial auf einer substratscheibe |
| CN116145106B (zh) * | 2023-02-21 | 2024-12-24 | 苏州鼎芯光电科技有限公司 | 一种用于半导体镀膜工艺腔室的清洁方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5158644A (en) * | 1986-12-19 | 1992-10-27 | Applied Materials, Inc. | Reactor chamber self-cleaning process |
| JP2002280376A (ja) * | 2001-03-22 | 2002-09-27 | Research Institute Of Innovative Technology For The Earth | Cvd装置のクリーニング方法およびそのためのクリーニング装置 |
-
2005
- 2005-03-24 EP EP05734780A patent/EP1733071A2/en not_active Withdrawn
- 2005-03-24 WO PCT/US2005/010691 patent/WO2005095670A2/en not_active Ceased
- 2005-03-24 JP JP2007505282A patent/JP2007531288A/ja active Pending
- 2005-03-24 BR BRPI0508204-8A patent/BRPI0508204A/pt not_active IP Right Cessation
- 2005-03-24 EP EP05760380A patent/EP1733072A2/en not_active Withdrawn
- 2005-03-24 KR KR1020067021948A patent/KR20070043697A/ko not_active Withdrawn
- 2005-03-24 KR KR1020067021947A patent/KR20070037434A/ko not_active Withdrawn
- 2005-03-24 WO PCT/US2005/010693 patent/WO2005090638A2/en not_active Ceased
- 2005-03-24 WO PCT/US2005/010692 patent/WO2005098086A2/en not_active Ceased
- 2005-03-24 JP JP2007505283A patent/JP2007531289A/ja not_active Withdrawn
- 2005-03-24 EP EP05760434A patent/EP1737998A2/en not_active Withdrawn
- 2005-03-24 BR BRPI0508214-5A patent/BRPI0508214A/pt not_active IP Right Cessation
- 2005-03-24 JP JP2007505281A patent/JP2007530792A/ja not_active Withdrawn
- 2005-03-24 KR KR1020067021949A patent/KR20070040748A/ko not_active Withdrawn
- 2005-03-24 BR BRPI0508205-6A patent/BRPI0508205A/pt not_active Application Discontinuation
- 2005-06-28 TW TW094121537A patent/TWI284929B/zh not_active IP Right Cessation
- 2005-06-28 TW TW094121538A patent/TWI281714B/zh not_active IP Right Cessation
- 2005-06-28 TW TW094121536A patent/TWI281715B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070040748A (ko) | 2007-04-17 |
| WO2005090638A9 (en) | 2006-01-26 |
| JP2007531288A (ja) | 2007-11-01 |
| WO2005095670A2 (en) | 2005-10-13 |
| WO2005098086A3 (en) | 2006-05-04 |
| WO2005095670A3 (en) | 2006-05-04 |
| TWI281715B (en) | 2007-05-21 |
| TW200623251A (en) | 2006-07-01 |
| EP1733072A2 (en) | 2006-12-20 |
| JP2007530792A (ja) | 2007-11-01 |
| KR20070037434A (ko) | 2007-04-04 |
| KR20070043697A (ko) | 2007-04-25 |
| WO2005090638A8 (en) | 2006-11-16 |
| BRPI0508214A (pt) | 2007-07-17 |
| WO2005098086A2 (en) | 2005-10-20 |
| EP1733071A2 (en) | 2006-12-20 |
| WO2005090638A3 (en) | 2006-04-13 |
| TWI284929B (en) | 2007-08-01 |
| TWI281714B (en) | 2007-05-21 |
| BRPI0508204A (pt) | 2007-07-17 |
| TW200623281A (en) | 2006-07-01 |
| TW200623240A (en) | 2006-07-01 |
| JP2007531289A (ja) | 2007-11-01 |
| WO2005090638A2 (en) | 2005-09-29 |
| EP1737998A2 (en) | 2007-01-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
| B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |