BRPI0512138A - dispositivo e método para tratar eletronicamente peças chatas de trabalho - Google Patents

dispositivo e método para tratar eletronicamente peças chatas de trabalho

Info

Publication number
BRPI0512138A
BRPI0512138A BRPI0512138-8A BRPI0512138A BRPI0512138A BR PI0512138 A BRPI0512138 A BR PI0512138A BR PI0512138 A BRPI0512138 A BR PI0512138A BR PI0512138 A BRPI0512138 A BR PI0512138A
Authority
BR
Brazil
Prior art keywords
work pieces
conveying
contacting
conveyed
conveying path
Prior art date
Application number
BRPI0512138-8A
Other languages
English (en)
Inventor
Klaus Hechler
Franz Kohnle
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of BRPI0512138A publication Critical patent/BRPI0512138A/pt
Publication of BRPI0512138B1 publication Critical patent/BRPI0512138B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0642—Anodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0657—Conducting rolls

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

DISPOSITIVO E MéTODO PARA TRATAR ELETROLITICAMENTE PEçAS CHATAS DE TRABALHO. A presente invenção refere-se a um dispositivo e método para de maneira eletrolítica tratar peças chatas de trabalho (1), mais especificamente para tratar de maneira eletrolítica estruturas eletricamente condutoras S que são eletricamente isoladas uma contra a outra nas superfícies das peças de trabalho. O método compreende transportar e processar as peças de trabalho (1) em percursos de transporte T<39>, T" no dispositivo, o dito dispositivo compreendendo pelo menos um conjunto A localizado entre dois percursos de transporte, o dito conjunto incluindo um primeiro e um segundo eletrodo giratório de contato (2), (8) com os eletrodos de contato sendo associados um com o outro dos percursos de transporte, e o primeiro eletrodo de contato (2) apoiando-se contra as peças de trabalho sendo transportado em um primeiro percurso de transporte T e sendo espaçado do segundo percurso de transporte T<39> e o segundo eletrodo de contato (8) apoiando-se contra as peças de trabalho sendo transportado no segundo percurso de transporte T" e sendo espaçados do primeiro percurso de transporte T<39>. O conjunto e as peças de trabalho são colocados em contato com o líquido de tratamento. Os eletrodos de contato compreendem primeiro e segundo segmentos (9), (10) que são isolados um do outro e que são contatados a uma fonte de corrente 5 de tal modo que áreas de eletrólise E são formadas entre as peças de trabalho (1) sendo transportadas no primeiro e segundo percursos de transporte T<39>, T", respectivamente, e segundos segmentos (9) que são girados em direção ao primeiro e segundo percursos de transporte T<39>, T", respectivamente, e não estão contatando as peças de trabalho (1).
BRPI0512138-8A 2004-06-17 2005-06-15 Dispositivo e método para tratar eletroliticamente peças chatas de trabalho BRPI0512138B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102004029894A DE102004029894B3 (de) 2004-06-17 2004-06-17 Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
DE102004029894.7 2004-06-17
PCT/EP2005/006553 WO2005123990A1 (en) 2004-06-17 2005-06-15 Device and method for electrolytically treating flat work pieces

Publications (2)

Publication Number Publication Date
BRPI0512138A true BRPI0512138A (pt) 2008-02-12
BRPI0512138B1 BRPI0512138B1 (pt) 2015-08-11

Family

ID=34970026

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0512138-8A BRPI0512138B1 (pt) 2004-06-17 2005-06-15 Dispositivo e método para tratar eletroliticamente peças chatas de trabalho

Country Status (11)

Country Link
US (1) US7955487B2 (pt)
EP (1) EP1756336B1 (pt)
JP (1) JP4783785B2 (pt)
KR (1) KR101214418B1 (pt)
CN (1) CN1969065B (pt)
AT (1) ATE396291T1 (pt)
BR (1) BRPI0512138B1 (pt)
DE (2) DE102004029894B3 (pt)
PL (1) PL1756336T3 (pt)
TW (1) TWI359215B (pt)
WO (1) WO2005123990A1 (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI341554B (en) * 2007-08-02 2011-05-01 Enthone Copper metallization of through silicon via
JP5412198B2 (ja) * 2009-07-15 2014-02-12 三友セミコンエンジニアリング株式会社 連続部分めっき装置及びそれを用いた連続部分めっき方法
CN101887043B (zh) * 2010-07-19 2012-11-07 中南大学 一种用于电化学分析的可更新固体工作电极
WO2013117269A1 (en) * 2012-02-06 2013-08-15 Nv Bekaert Sa Multi-wire plating line at various levels
KR102023816B1 (ko) * 2017-09-21 2019-09-20 이윤재 축전지용 극판 제조용 도금장치
CN110592640A (zh) * 2019-10-14 2019-12-20 安徽豪鼎金属制品有限公司 一种不锈钢表面耐腐蚀处理系统及采用其进行处理的方法
CN221275929U (zh) * 2023-11-27 2024-07-05 江阴纳力新材料科技有限公司 一种多排镀膜装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2653787B1 (fr) * 1989-10-27 1992-02-14 Lorraine Laminage Installation et procede de revetement electrolytique d'une bande metallique.
DE4413149A1 (de) * 1994-04-15 1995-10-19 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
DE4425854C1 (de) * 1994-07-07 1995-11-09 Mannesmann Ag Elektrolytisches Oberflächenbehandlungsverfahren und Anlage zur Durchführung des Verfahrens
DE10015349A1 (de) * 2000-03-23 2001-10-25 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum Behandeln von durchgehende Löcher und/oder Vertiefungen aufweisenden Schaltungsträgern sowie Anwendung des Verfahrens und Verwendung der Vorrichtung
DE10065643C2 (de) * 2000-12-29 2003-03-20 Egon Huebel Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut
DE10141056C2 (de) * 2001-08-22 2003-12-24 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
WO2003038158A2 (de) * 2001-10-25 2003-05-08 Infineon Technologies Ag Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen

Also Published As

Publication number Publication date
JP2008502797A (ja) 2008-01-31
PL1756336T3 (pl) 2008-10-31
DE602005007022D1 (de) 2008-07-03
US20080257752A1 (en) 2008-10-23
KR20070024734A (ko) 2007-03-02
EP1756336A1 (en) 2007-02-28
BRPI0512138B1 (pt) 2015-08-11
JP4783785B2 (ja) 2011-09-28
ATE396291T1 (de) 2008-06-15
DE102004029894B3 (de) 2005-12-22
US7955487B2 (en) 2011-06-07
HK1102970A1 (zh) 2007-12-07
CN1969065B (zh) 2010-04-14
WO2005123990A1 (en) 2005-12-29
TWI359215B (en) 2012-03-01
TW200610842A (en) 2006-04-01
CN1969065A (zh) 2007-05-23
KR101214418B1 (ko) 2012-12-21
EP1756336B1 (en) 2008-05-21

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Legal Events

Date Code Title Description
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 11/08/2015, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 15A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2594 DE 24-09-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.