BRPI0512837A - método de fabricação de dispositivos eletrÈnicos ou funcionais - Google Patents

método de fabricação de dispositivos eletrÈnicos ou funcionais

Info

Publication number
BRPI0512837A
BRPI0512837A BRPI0512837-4A BRPI0512837A BRPI0512837A BR PI0512837 A BRPI0512837 A BR PI0512837A BR PI0512837 A BRPI0512837 A BR PI0512837A BR PI0512837 A BRPI0512837 A BR PI0512837A
Authority
BR
Brazil
Prior art keywords
substrate
manufacturing electronic
functional devices
devices
flexible
Prior art date
Application number
BRPI0512837-4A
Other languages
English (en)
Inventor
Paul Raymond Drury
Original Assignee
Xaar Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xaar Technology Ltd filed Critical Xaar Technology Ltd
Publication of BRPI0512837A publication Critical patent/BRPI0512837A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/016—Temporary inorganic, non-metallic carrier, e.g. for processing or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7424—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used as a support during the manufacture of self-supporting substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Wire Bonding (AREA)
  • Structure Of Printed Boards (AREA)
  • Coating Apparatus (AREA)

Abstract

MéTODO DE FABRICAçãO DE DISPOSITIVOS ELETRÈNICOS OU FUNCIONAIS. Dispositivos plásticos ou outros dispositivos eletrónicos são formados em um substrato flexível, usando técnicas de impressão por jato de tinta. Para evitar dificuldades de inscrição que surgem de distorção do substrato, a deposição é conduzida em um substrato rígido, ao qual uma camada de liberação é aplicada. Depois da aplicação de um tipo de camada que serve como o substrato flexível, permanente, a estrutura é liberada do substrato rígido temporário.
BRPI0512837-4A 2004-06-29 2005-06-29 método de fabricação de dispositivos eletrÈnicos ou funcionais BRPI0512837A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0414487.9A GB0414487D0 (en) 2004-06-29 2004-06-29 Manufacture of electronic devices
PCT/GB2005/002540 WO2006000821A1 (en) 2004-06-29 2005-06-29 Method of manufacture of electronic or functional devices

Publications (1)

Publication Number Publication Date
BRPI0512837A true BRPI0512837A (pt) 2008-04-08

Family

ID=32800351

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0512837-4A BRPI0512837A (pt) 2004-06-29 2005-06-29 método de fabricação de dispositivos eletrÈnicos ou funcionais

Country Status (12)

Country Link
US (1) US20080189941A1 (pt)
EP (1) EP1766675A1 (pt)
JP (1) JP2008504709A (pt)
KR (1) KR20070033007A (pt)
CN (1) CN1985366A (pt)
AU (1) AU2005256868A1 (pt)
BR (1) BRPI0512837A (pt)
CA (1) CA2571544A1 (pt)
GB (1) GB0414487D0 (pt)
IL (1) IL180263A0 (pt)
RU (1) RU2007103194A (pt)
WO (1) WO2006000821A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190123811A (ko) 2012-12-27 2019-11-01 카티바, 인크. 정밀 공차 내로 유체를 증착하기 위한 인쇄 잉크 부피 제어를 위한 기법
US12330178B2 (en) 2012-12-27 2025-06-17 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
US11673155B2 (en) 2012-12-27 2023-06-13 Kateeva, Inc. Techniques for arrayed printing of a permanent layer with improved speed and accuracy
CN103531442B (zh) * 2013-10-25 2015-03-11 京东方科技集团股份有限公司 柔性基板制备方法
KR102348020B1 (ko) 2013-12-12 2022-01-07 카티바, 인크. 두께를 제어하기 위해 하프토닝을 이용하는 잉크-기반 층 제조
DE202014103821U1 (de) 2014-07-09 2014-09-09 Carmen Diegel Flexible elektrische Leiterstruktur

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584039A (en) * 1984-12-26 1986-04-22 Hughes Aircraft Co. Fine line flexible cable fabrication process
US5108819A (en) * 1990-02-14 1992-04-28 Eli Lilly And Company Thin film electrical component
DE69738994D1 (de) * 1996-04-08 2008-10-30 Raytheon Co Herstellungsmethode einer HDMI-Abziehstruktur und einer flexiblen Feinlinien-Verbindung
US7427526B2 (en) * 1999-12-20 2008-09-23 The Penn State Research Foundation Deposited thin films and their use in separation and sacrificial layer applications
WO2001046987A2 (en) * 1999-12-21 2001-06-28 Plastic Logic Limited Inkjet-fabricated integrated circuits
DE10122324A1 (de) * 2001-05-08 2002-11-14 Philips Corp Intellectual Pty Flexible integrierte monolithische Schaltung
AU2003205104A1 (en) * 2002-01-11 2003-07-30 The Pennsylvania State University Method of forming a removable support with a sacrificial layers and of transferring devices

Also Published As

Publication number Publication date
US20080189941A1 (en) 2008-08-14
EP1766675A1 (en) 2007-03-28
WO2006000821A1 (en) 2006-01-05
GB0414487D0 (en) 2004-07-28
AU2005256868A1 (en) 2006-01-05
CN1985366A (zh) 2007-06-20
KR20070033007A (ko) 2007-03-23
CA2571544A1 (en) 2006-01-05
RU2007103194A (ru) 2008-08-10
JP2008504709A (ja) 2008-02-14
IL180263A0 (en) 2007-07-04

Similar Documents

Publication Publication Date Title
MX363312B (es) Lamina de seguridad que comprende un soporte coextruido.
DE602007013280D1 (de) Zwischentransferglied und herstellungsverfahren dafür
JP2010502010A5 (pt)
BRPI0814693A2 (pt) Composição curável por radiação, óleo natural (met) acrilado, método de impressão, e, substrato inteiramente ou parcialmente revestido ou impresso.
IN2014DN06935A (pt)
ATE452031T1 (de) Druckkassette
WO2008005208A3 (en) Printing form precursor and process for preparing a stamp from the precursor
WO2008036837A3 (en) Release strategies for making transferable semiconductor structures, devices and device components
WO2008115530A3 (en) Polymer composition for preparing electronic devices by microcontact printing processes and products prepared by the processes
BR112015009655A2 (pt) método e aparelho para formar em um substrato um padrão de um material
WO2008009575A3 (en) Method of bonding
WO2011063089A3 (en) Surface-modified adhesives
WO2009009208A3 (en) Patterning structures using deformable substrates
EP1845416A3 (en) Coating compositions for photolithography
EP2062950A3 (en) Topcoat composition, alkali developer-soluble topcoat film using the composition and pattern forming method using the same
WO2010047769A8 (en) Reduction of stress during template separation from substrate
ATE484609T1 (de) Verfahren zur herstellung einer funktionsschicht
BR112015021771A8 (pt) rótulo adesivo para gravação por jato de tinta
WO2008078707A1 (ja) 光重合性樹脂積層体及びブラックマトリックスパターン付き基板の製造方法
DK3720673T3 (da) Fremgangsmåde til overførsel af en prægestruktur på overfladen af et belægningsmiddel og som forbindelse anvendelig som prægematrice
GB0613784D0 (en) Gravure plate, method for forming light emitting layer or hole injection layer using the same, and organic light emitting device
WO2008040322A3 (de) Deformierbares substrat mit mikrostrukturierter oberfläche aus aufgebrachtem material sowie verfahren zur herstellung eines solchen substrates
BRPI0512837A (pt) método de fabricação de dispositivos eletrÈnicos ou funcionais
DE502007003976D1 (de) Verfahren zum transferdrucken sowie druckvorlagen für diese zwecke
BR112012007593A2 (pt) micro-sistemas funcionais serigrafiados

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 4A, 5A, 6A E 7A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2158 DE 15/05/2012.