BRPI0513006A - composição adesiva, utilização, poliuretano pré-aderido, sistema adesivo, processo para fazer aderir um poliuretano curado a uma composição de elastÈmero diênico no estado não curado, compósito, utilização do mesmo, e, artigo de borracha - Google Patents

composição adesiva, utilização, poliuretano pré-aderido, sistema adesivo, processo para fazer aderir um poliuretano curado a uma composição de elastÈmero diênico no estado não curado, compósito, utilização do mesmo, e, artigo de borracha

Info

Publication number
BRPI0513006A
BRPI0513006A BRPI0513006-9A BRPI0513006A BRPI0513006A BR PI0513006 A BRPI0513006 A BR PI0513006A BR PI0513006 A BRPI0513006 A BR PI0513006A BR PI0513006 A BRPI0513006 A BR PI0513006A
Authority
BR
Brazil
Prior art keywords
composition
polyurethane
vinyl ester
adhesive
ester resin
Prior art date
Application number
BRPI0513006-9A
Other languages
English (en)
Inventor
Antonio Delfino
Philippe Chenaux
Corinne Deforel
Original Assignee
Conception & Dev Michelin Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Conception & Dev Michelin Sa filed Critical Conception & Dev Michelin Sa
Publication of BRPI0513006A publication Critical patent/BRPI0513006A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/6705—Unsaturated polymers not provided for in the groups C08G18/671, C08G18/6795, C08G18/68 or C08G18/69
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/68—Unsaturated polyesters

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Tires In General (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Liquid Crystal Substances (AREA)
  • Lubricants (AREA)
  • Steroid Compounds (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

COMPOSIçãO ADESIVA, UTILIZAçãO, POLIURETANO PRé-ADERIDO, SISTEMA ADESIVO, PROCESSO PARA FAZER ADERIR UM POLIURETANO CURADO A UMA COMPOSIçãO DE ELASTÈMERO DIêNICO NO ESTADO NãO CURADO, COMPóSITO, UTILIZAçãO DO MESMO, E, ARTIGO DE BORRACHA Composição adesiva utilizável notadamente como primeira demão de adesão, à base de um composto poliisocianato e de uma resina poliéster ou viniléster compreendendo grupos funcionais (notadamente hidroxila) reativos frente a grupos isocianatos do referido poliisocianato, o número total dos referidos grupos isocianato estando em excesso em relação ao número total dos referidos grupos funcionais da resina poliéster ou viniléster. O composto poliisocianato é preferivelmente um diisocianato, a resina é preferivelmente uma resina epoxiviniléster, notadamente à base novolaca e/ou bisfenólica. A referida composição é utilizável, a título de primeira demão de adesão, em combinação com uma segunda demão de adesão, preferivelmente à base de um elastómero polivinilpiridina-estireno-butadieno e de uma resina poliéster ou viniléster. Utilização de um tal sistema adesivo para a ligação de um poliuretano curado a uma composição de elastómero diênico no estado não curado, notadamente na fabricação de artigos de borracha consistindo em sistemas de ligação ao solo de veículos automotivos, particularmente bandas de rodagem pneumáticas ou não pneumáticas.
BRPI0513006-9A 2004-07-07 2005-07-06 composição adesiva, utilização, poliuretano pré-aderido, sistema adesivo, processo para fazer aderir um poliuretano curado a uma composição de elastÈmero diênico no estado não curado, compósito, utilização do mesmo, e, artigo de borracha BRPI0513006A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0407666A FR2872820B1 (fr) 2004-07-07 2004-07-07 Systeme adhesif pour le collage direct d'un polyurethane cuit a du caoutchouc cru
PCT/EP2005/007287 WO2006002998A1 (fr) 2004-07-07 2005-07-06 Systeme adhesif pour le collage direct d'un polyurethanne cuit a du caoutchouc cru

Publications (1)

Publication Number Publication Date
BRPI0513006A true BRPI0513006A (pt) 2008-04-22

Family

ID=34946987

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0513006-9A BRPI0513006A (pt) 2004-07-07 2005-07-06 composição adesiva, utilização, poliuretano pré-aderido, sistema adesivo, processo para fazer aderir um poliuretano curado a uma composição de elastÈmero diênico no estado não curado, compósito, utilização do mesmo, e, artigo de borracha

Country Status (9)

Country Link
US (2) US20080029215A1 (pt)
EP (1) EP1765952B1 (pt)
JP (1) JP5000498B2 (pt)
CN (1) CN1981011B (pt)
AT (1) ATE463547T1 (pt)
BR (1) BRPI0513006A (pt)
DE (1) DE602005020449D1 (pt)
FR (1) FR2872820B1 (pt)
WO (1) WO2006002998A1 (pt)

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CN101939349B (zh) * 2007-10-30 2013-08-14 米其林集团总公司 聚氨酯脲体系
FR2962938B1 (fr) * 2010-07-20 2013-06-14 Michelin Soc Tech Bandage flexible non pneumatique dont la structure porteuse comporte des lames metalliques
TWI534256B (zh) * 2011-05-16 2016-05-21 Showa Denko Kk Hardened heat dissipation composition
JP2015533689A (ja) * 2012-09-07 2015-11-26 キャタピラー インコーポレイテッドＣａｔｅｒｐｉｌｌａｒ Ｉｎｃｏｒｐｏｒａｔｅｄ 非空気式タイヤを形成するためのシステム及び方法
US8720921B1 (en) * 2012-10-30 2014-05-13 SuperSprings International, Inc. Vehicular suspension enhancement
FR3005054B1 (fr) 2013-04-26 2016-07-01 Michelin & Cie Polymere utilisable notamment comme primaire d'adhesion pour le collage de metal a du caoutchouc
CA2915483C (en) 2013-06-15 2021-11-16 Ronald Thompson Annular ring and non-pneumatic tire
CN103966853B (zh) * 2014-05-15 2016-01-20 河北寰宇橡胶科技有限公司 一种聚酯钢化棕丝粘合活化剂及聚酯钢化棕丝的处理工艺
US10041325B2 (en) 2014-08-01 2018-08-07 Utex Industries, Inc. High pressure seal with composite anti-extrusion mechanism
CA2976055A1 (en) 2015-02-04 2016-08-11 Advancing Mobility, Llc. Non-pneumatic tire and other annular devices
WO2017106750A1 (en) 2015-12-16 2017-06-22 Thompson Ronald H Track system for traction of a vehicle
WO2017175430A1 (ja) * 2016-04-06 2017-10-12 三菱ケミカル株式会社 熱硬化性樹脂組成物、シートモールディングコンパウンド及びその製造方法、並びに繊維強化複合材料
US10569600B2 (en) 2017-06-02 2020-02-25 Bridgestone Americas Tire Operations, Llc Adhesive systems for preparing composites of rubber and polar thermosets
US11179969B2 (en) 2017-06-15 2021-11-23 Camso Inc. Wheel comprising a non-pneumatic tire
JP6785196B2 (ja) 2017-06-16 2020-11-18 株式会社ブリヂストン タイヤ用樹脂金属複合部材、及びタイヤ
JP6785194B2 (ja) * 2017-06-16 2020-11-18 株式会社ブリヂストン タイヤ用樹脂金属複合部材、及びタイヤ
CN109337634B (zh) * 2018-09-26 2021-04-27 上海维凯光电新材料有限公司 用于铝塑复合标签的高耐水解抗粘背胶黏剂及其制备
KR102188669B1 (ko) * 2019-02-01 2020-12-08 한국타이어앤테크놀로지 주식회사 무용매 반응형 접착 조성물 및 이를 이용한 타이어의 제조방법
DE102020207204A1 (de) * 2020-06-09 2021-12-09 Rema Tip Top Ag Reparaturpflaster für ein elastomeres Bauteil mit verbesserter Verbindungsschicht
CN114907791B (zh) * 2021-02-08 2024-04-26 北京化工大学 一种非充气轮胎黏合材料及其制备方法及应用
JP7783722B2 (ja) * 2021-11-01 2025-12-10 Ｔｏｙｏ Ｔｉｒｅ株式会社 非空気圧タイヤの製造方法
CN114058312A (zh) * 2021-11-26 2022-02-18 中国科学院长春应用化学研究所 一种粘合体系、聚氨酯/橡胶复合材料及其制备方法
KR102677597B1 (ko) * 2022-09-06 2024-06-21 주식회사 대동농기계 트레드부와 스포크부 접합공정효율이 향상된 비공기압 타이어와 이의 제조방법
CN115926714B (zh) * 2022-12-01 2025-06-20 广东粤港澳大湾区黄埔材料研究院 一种单组分聚氨酯胶粘剂及其制备方法与应用
CN118995083B (zh) * 2024-08-13 2025-06-27 青岛朗道轮履技术有限公司 轮幅式非充气轮胎及其制备方法

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Also Published As

Publication number Publication date
CN1981011A (zh) 2007-06-13
DE602005020449D1 (de) 2010-05-20
FR2872820A1 (fr) 2006-01-13
US20130000841A1 (en) 2013-01-03
WO2006002998A1 (fr) 2006-01-12
JP5000498B2 (ja) 2012-08-15
US8623169B2 (en) 2014-01-07
CN1981011B (zh) 2012-03-14
FR2872820B1 (fr) 2008-09-05
ATE463547T1 (de) 2010-04-15
JP2008505238A (ja) 2008-02-21
EP1765952B1 (fr) 2010-04-07
EP1765952A1 (fr) 2007-03-28
US20080029215A1 (en) 2008-02-07

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2261 DE 06/05/2014.