BRPI0514895A - tratamento de estria - Google Patents

tratamento de estria

Info

Publication number
BRPI0514895A
BRPI0514895A BRPI0514895-2A BRPI0514895A BRPI0514895A BR PI0514895 A BRPI0514895 A BR PI0514895A BR PI0514895 A BRPI0514895 A BR PI0514895A BR PI0514895 A BRPI0514895 A BR PI0514895A
Authority
BR
Brazil
Prior art keywords
stretch mark
mark treatment
stretch
treatment
strey
Prior art date
Application number
BRPI0514895-2A
Other languages
English (en)
Inventor
Eric R First
Original Assignee
Allergan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Allergan Inc filed Critical Allergan Inc
Priority claimed from PCT/US2005/030285 external-priority patent/WO2006028724A1/en
Publication of BRPI0514895A publication Critical patent/BRPI0514895A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61P—SPECIFIC THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS
    • A61P17/00—Drugs for dermatological disorders
    • A61P17/02—Drugs for dermatological disorders for treating wounds, ulcers, burns, scars, keloids, or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/479—Leadframes on or in insulating or insulated package substrates, interposers, or redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Dermatology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Organic Chemistry (AREA)
  • Pharmacology & Pharmacy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Medicines Containing Material From Animals Or Micro-Organisms (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)

Abstract

TRATAMENTO DE ESTRIA Métodos para tratamento de estrias através da administração local de uma toxina Clostridial, tal como uma toxina botulina, a um paciente com uma estria.
BRPI0514895-2A 2004-09-03 2005-08-24 tratamento de estria BRPI0514895A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/934,813 US7112873B2 (en) 2004-09-03 2004-09-03 Flip chip metal bonding to plastic leadframe
PCT/US2005/030285 WO2006028724A1 (en) 2004-09-03 2005-08-24 Stretch mark treatment with botulinum toxic

Publications (1)

Publication Number Publication Date
BRPI0514895A true BRPI0514895A (pt) 2008-06-24

Family

ID=35995385

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0514895-2A BRPI0514895A (pt) 2004-09-03 2005-08-24 tratamento de estria

Country Status (2)

Country Link
US (1) US7112873B2 (pt)
BR (1) BRPI0514895A (pt)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6338547B2 (ja) * 2015-03-31 2018-06-06 オリンパス株式会社 成形回路部品、成形回路部品の製造方法および回路モジュール

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE758871A (fr) * 1969-11-13 1971-05-12 Philips Nv Procede pour relier des emplacements de contact metalliques de composants electriques avec des conducteurs metalliques d'un substratflasque
US3778530A (en) * 1971-04-01 1973-12-11 W Reimann Flatpack lead positioning device
US3781596A (en) * 1972-07-07 1973-12-25 R Galli Semiconductor chip carriers and strips thereof
JPS52124865A (en) * 1976-04-13 1977-10-20 Sharp Corp Semiconductor device
US4447857A (en) * 1981-12-09 1984-05-08 International Business Machines Corporation Substrate with multiple type connections
US5540378A (en) 1993-09-27 1996-07-30 Olin Corporation Method for the assembly of an electronic package
US5744383A (en) 1995-11-17 1998-04-28 Altera Corporation Integrated circuit package fabrication method
US5771157A (en) 1996-03-08 1998-06-23 Honeywell, Inc. Chip-on-board printed circuit assembly using aluminum wire bonded to copper pads
US6022583A (en) 1997-12-16 2000-02-08 Nordson Corporation Method of encapsulating a wire bonded die
FR2773642B1 (fr) * 1998-01-13 2000-03-03 Schlumberger Ind Sa Procede de connexion de plots d'un composant a circuits integres a des plages de connexion d'un substrat plastique au moyen de protuberances
US6247650B1 (en) * 1998-12-21 2001-06-19 Eastman Kodak Company Integral image element with display control parameters
SG93832A1 (en) 1999-05-07 2003-01-21 Inst Of Microelectronics Epoxy resin compositions for liquid encapsulation
US20030057541A1 (en) * 1999-07-12 2003-03-27 Francesco Betori Un-packaged or semi-packaged electrically tested electronic device free from infantile mortality and process for manufacture thereof
US6492197B1 (en) 2000-05-23 2002-12-10 Unitive Electronics Inc. Trilayer/bilayer solder bumps and fabrication methods therefor
US6378759B1 (en) 2000-07-18 2002-04-30 Chartered Semiconductor Manufacturing Ltd. Method of application of conductive cap-layer in flip-chip, COB, and micro metal bonding
US6707135B2 (en) 2000-11-28 2004-03-16 Texas Instruments Incorporated Semiconductor leadframe for staggered board attach
US20020182773A1 (en) 2001-06-04 2002-12-05 Walsin Advanced Electronics Ltd Method for bonding inner leads of leadframe to substrate
US6657298B1 (en) * 2001-07-18 2003-12-02 Amkor Technology, Inc. Integrated circuit chip package having an internal lead
US6489229B1 (en) 2001-09-07 2002-12-03 Motorola, Inc. Method of forming a semiconductor device having conductive bumps without using gold

Also Published As

Publication number Publication date
US7112873B2 (en) 2006-09-26
US20060049529A1 (en) 2006-03-09

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B07D Technical examination (opinion) related to article 229 of industrial property law [chapter 7.4 patent gazette]
B07G Grant request does not fulfill article 229-c lpi (prior consent of anvisa) [chapter 7.7 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]
B09B Patent application refused [chapter 9.2 patent gazette]

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