BRPI0518780A2 - liga, e, junta soldada - Google Patents

liga, e, junta soldada

Info

Publication number
BRPI0518780A2
BRPI0518780A2 BRPI0518780-0A BRPI0518780A BRPI0518780A2 BR PI0518780 A2 BRPI0518780 A2 BR PI0518780A2 BR PI0518780 A BRPI0518780 A BR PI0518780A BR PI0518780 A2 BRPI0518780 A2 BR PI0518780A2
Authority
BR
Brazil
Prior art keywords
weight
alloy
welded joint
soldering process
chrome
Prior art date
Application number
BRPI0518780-0A
Other languages
English (en)
Inventor
Anthony Ingham
Gerard Campbell
Brian Lewis
Bawa Singh
John Laughlin
Ranjit Pandher
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Publication of BRPI0518780A2 publication Critical patent/BRPI0518780A2/pt
Publication of BRPI0518780B1 publication Critical patent/BRPI0518780B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/06—Making non-ferrous alloys with the use of special agents for refining or deoxidising
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

LIGA, E, JUNTA SOLDADA. É descrita uma liga adequada para uso em um processo de solda por ondas, processo de soldagem por refusão, processo de nivelamento com ar quente ou um arranjo de grade de esfera, a liga compreendendo de 0,08 - 3% em peso de bismuto, de 0,15 - 1,5% em peso de cobre, de 0,1 - 1,5% em peso de prata, de 0 - 0,1% em peso de fósforo, de 0 - 0,1% em peso de germânio, de 0 - 0,1% em peso de gálio, de 0 - 0,3% em peso de um ou mais elementos de terra rara, de 0 - 0,3% em peso de índio, de 0 - 0,3% em peso de magnésio, de 0 - 0,3% em peso de cálcio, de 0 - 0,3% em peso de silício, de 0 - 0,3% em peso de alumínio, de 0 - 0,3% em peso de zinco, e pelo menos um dos elementos seguintes de 0,02 - 0,3% em peso de níquel, de 0,008 - 0,2% em peso de manganês, de 0,01 - 0,3% em peso de cobalto, de 0,01 - 0,3% em peso de cromo, de 0,02 - 0,3% em peso de ferro e de 0,008 - 0,1% em peso de zircônio, e o estanho para equilíbrio, juntamente com impurezas inevitáveis.
BRPI0518780-0A 2004-12-01 2005-12-01 liga, e, junta soldada. BRPI0518780B1 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB0426383.6 2004-12-01
GB0426383A GB2421030B (en) 2004-12-01 2004-12-01 Solder alloy
US71091505P 2005-08-24 2005-08-24
US60/710,915 2005-08-24
PCT/GB2005/004609 WO2006059115A1 (en) 2004-12-01 2005-12-01 Solder alloy

Publications (2)

Publication Number Publication Date
BRPI0518780A2 true BRPI0518780A2 (pt) 2008-12-09
BRPI0518780B1 BRPI0518780B1 (pt) 2012-12-11

Family

ID=34043880

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0518780-0A BRPI0518780B1 (pt) 2004-12-01 2005-12-01 liga, e, junta soldada.

Country Status (11)

Country Link
US (2) US9221131B2 (pt)
EP (1) EP1841561B1 (pt)
JP (1) JP5147409B2 (pt)
KR (1) KR101345677B1 (pt)
CN (1) CN101132881B (pt)
BR (1) BRPI0518780B1 (pt)
CA (1) CA2589259C (pt)
GB (1) GB2421030B (pt)
MX (1) MX2007006353A (pt)
PL (1) PL1841561T3 (pt)
WO (1) WO2006059115A1 (pt)

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CN108941971B (zh) * 2018-08-16 2020-12-18 广东省科学院中乌焊接研究所 一种免清洗水性锡膏及其制备方法
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CN115229380A (zh) * 2022-06-06 2022-10-25 广州汉源新材料股份有限公司 一种抗氧化的焊料及其制备方法
CN115365699B (zh) * 2022-09-19 2024-08-23 云南锡业新材料有限公司 一种焊点无微裂纹Sn-Ag-Cu系无铅焊料合金及制备方法
CN115815872B (zh) * 2023-01-09 2023-06-27 广州汉源新材料股份有限公司 一种无铅无锑强化焊料合金及其制备方法
KR102880335B1 (ko) * 2023-06-30 2025-11-03 덕산하이메탈(주) 땜납 합금, 땜납 조인트, 및 땜납 조인트를 포함하는 반도체 패키지
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JP2003051729A (ja) * 2001-08-06 2003-02-21 Tdk Corp 積層型フィルタアレイ
CN1346728A (zh) * 2001-09-19 2002-05-01 大连理工大学 含稀土多合金组元无铅钎料合金
JP4144415B2 (ja) * 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
US7282175B2 (en) 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
DE10319888A1 (de) * 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis

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JP5147409B2 (ja) 2013-02-20
US20080292492A1 (en) 2008-11-27
JP2008521619A (ja) 2008-06-26
US20160107267A1 (en) 2016-04-21
EP1841561A1 (en) 2007-10-10
MX2007006353A (es) 2008-01-22
EP1841561B1 (en) 2015-08-12
US9221131B2 (en) 2015-12-29
GB2421030B (en) 2008-03-19
KR20070118588A (ko) 2007-12-17
GB2421030A (en) 2006-06-14
CN101132881A (zh) 2008-02-27
WO2006059115A1 (en) 2006-06-08
KR101345677B1 (ko) 2013-12-30
PL1841561T3 (pl) 2016-01-29
BRPI0518780B1 (pt) 2012-12-11
CA2589259C (en) 2014-11-18
CA2589259A1 (en) 2006-06-08
CN101132881B (zh) 2011-02-09

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