BRPI0518780A2 - liga, e, junta soldada - Google Patents

liga, e, junta soldada

Info

Publication number
BRPI0518780A2
BRPI0518780A2 BRPI0518780-0A BRPI0518780A BRPI0518780A2 BR PI0518780 A2 BRPI0518780 A2 BR PI0518780A2 BR PI0518780 A BRPI0518780 A BR PI0518780A BR PI0518780 A2 BRPI0518780 A2 BR PI0518780A2
Authority
BR
Brazil
Prior art keywords
weight
alloy
welded joint
soldering process
chrome
Prior art date
Application number
BRPI0518780-0A
Other languages
English (en)
Inventor
Anthony Ingham
Gerard Campbell
Brian Lewis
Bawa Singh
John Laughlin
Ranjit Pandher
Original Assignee
Alpha Fry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alpha Fry Ltd filed Critical Alpha Fry Ltd
Publication of BRPI0518780A2 publication Critical patent/BRPI0518780A2/pt
Publication of BRPI0518780B1 publication Critical patent/BRPI0518780B1/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/06Making non-ferrous alloys with the use of special agents for refining or deoxidising
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

LIGA, E, JUNTA SOLDADA. É descrita uma liga adequada para uso em um processo de solda por ondas, processo de soldagem por refusão, processo de nivelamento com ar quente ou um arranjo de grade de esfera, a liga compreendendo de 0,08 - 3% em peso de bismuto, de 0,15 - 1,5% em peso de cobre, de 0,1 - 1,5% em peso de prata, de 0 - 0,1% em peso de fósforo, de 0 - 0,1% em peso de germânio, de 0 - 0,1% em peso de gálio, de 0 - 0,3% em peso de um ou mais elementos de terra rara, de 0 - 0,3% em peso de índio, de 0 - 0,3% em peso de magnésio, de 0 - 0,3% em peso de cálcio, de 0 - 0,3% em peso de silício, de 0 - 0,3% em peso de alumínio, de 0 - 0,3% em peso de zinco, e pelo menos um dos elementos seguintes de 0,02 - 0,3% em peso de níquel, de 0,008 - 0,2% em peso de manganês, de 0,01 - 0,3% em peso de cobalto, de 0,01 - 0,3% em peso de cromo, de 0,02 - 0,3% em peso de ferro e de 0,008 - 0,1% em peso de zircônio, e o estanho para equilíbrio, juntamente com impurezas inevitáveis.
BRPI0518780-0A 2004-12-01 2005-12-01 liga, e, junta soldada. BRPI0518780B1 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
GB0426383.6 2004-12-01
GB0426383A GB2421030B (en) 2004-12-01 2004-12-01 Solder alloy
US71091505P 2005-08-24 2005-08-24
US60/710,915 2005-08-24
PCT/GB2005/004609 WO2006059115A1 (en) 2004-12-01 2005-12-01 Solder alloy

Publications (2)

Publication Number Publication Date
BRPI0518780A2 true BRPI0518780A2 (pt) 2008-12-09
BRPI0518780B1 BRPI0518780B1 (pt) 2012-12-11

Family

ID=34043880

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0518780-0A BRPI0518780B1 (pt) 2004-12-01 2005-12-01 liga, e, junta soldada.

Country Status (11)

Country Link
US (2) US9221131B2 (pt)
EP (1) EP1841561B1 (pt)
JP (1) JP5147409B2 (pt)
KR (1) KR101345677B1 (pt)
CN (1) CN101132881B (pt)
BR (1) BRPI0518780B1 (pt)
CA (1) CA2589259C (pt)
GB (1) GB2421030B (pt)
MX (1) MX2007006353A (pt)
PL (1) PL1841561T3 (pt)
WO (1) WO2006059115A1 (pt)

Families Citing this family (83)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CZ297596B6 (cs) * 2005-10-19 2007-01-10 JenĂ­k@Jan Bezolovnatá pájka
US8143722B2 (en) 2006-10-05 2012-03-27 Flipchip International, Llc Wafer-level interconnect for high mechanical reliability applications
CN100439027C (zh) * 2007-01-18 2008-12-03 广州有色金属研究院 适用于铜铝异种金属软钎焊的无铅焊料合金
EP2157842B1 (en) * 2007-05-17 2018-03-14 Fujikura, Ltd. Laminated wiring board and method for manufacturing the same
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN103008903A (zh) * 2007-08-14 2013-04-03 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
US20110091351A1 (en) * 2007-08-24 2011-04-21 Than Trong Long Bonding composition
US7847399B2 (en) * 2007-12-07 2010-12-07 Texas Instruments Incorporated Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles
JP5249958B2 (ja) * 2008-02-22 2013-07-31 株式会社日本スペリア社 Niを含む無鉛はんだのNi濃度調整法
CN102066042B (zh) * 2008-04-23 2016-03-23 千住金属工业株式会社 无铅焊料
WO2009131178A1 (ja) * 2008-04-23 2009-10-29 千住金属工業株式会社 引け巣が抑制された鉛フリーはんだ合金
JP5379402B2 (ja) * 2008-05-12 2013-12-25 株式会社弘輝 鉛フリーSn−Ag系半田合金及び半田合金粉末
CN102017107B (zh) * 2008-06-23 2013-05-08 松下电器产业株式会社 接合结构以及电子器件
US8013444B2 (en) * 2008-12-24 2011-09-06 Intel Corporation Solder joints with enhanced electromigration resistance
KR100968173B1 (ko) * 2009-12-23 2010-07-07 코리아 오토글라스 주식회사 자동차 유리 솔더링용 무연 솔더 조성물
CN101780608B (zh) * 2010-04-12 2011-09-21 天津市恒固科技有限公司 一种含Si和Ge的SnAgCu系无铅焊料
CN101920406B (zh) * 2010-09-16 2012-05-09 上海交通大学 Sn-Ag-Zn-Cr共晶无铅焊料
CN101927410B (zh) * 2010-09-16 2012-10-17 上海交通大学 Sn-Ag-Zn-Bi-Cr无铅焊料
CN102172805B (zh) * 2011-01-18 2013-01-02 哈尔滨理工大学 一种电子封装用低成本抗老化钎料及其制备方法
CN102085604A (zh) * 2011-03-04 2011-06-08 上海交通大学 Sn-Ag-Cu-Bi-Cr低银无铅焊料
WO2012127642A1 (ja) * 2011-03-23 2012-09-27 千住金属工業株式会社 鉛フリーはんだ合金
KR101275302B1 (ko) 2011-08-11 2013-06-17 엠케이전자 주식회사 주석계 솔더볼 및 이를 포함하는 반도체 패키지
KR101283580B1 (ko) * 2011-12-14 2013-07-05 엠케이전자 주식회사 주석계 솔더 볼 및 이를 포함하는 반도체 패키지
CN102554504B (zh) * 2011-12-28 2013-11-06 常熟市华银焊料有限公司 含镨、锆和镓的自钎性银钎料
CN102581516A (zh) * 2012-03-27 2012-07-18 郑州机械研究所 一种超塑性铜磷焊条及其制备方法
WO2014002304A1 (ja) * 2012-06-29 2014-01-03 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
JP5238088B1 (ja) * 2012-06-29 2013-07-17 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
WO2014013632A1 (ja) * 2012-07-19 2014-01-23 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
KR101438897B1 (ko) * 2012-08-13 2014-09-17 현대자동차주식회사 유리용 무연솔더 조성물
KR101738007B1 (ko) 2012-10-09 2017-05-29 알파 어셈블리 솔루션스 인크. 고온에서 신뢰성이 있는 무납 및 무안티몬 주석 납땜
CN102848100B (zh) * 2012-10-10 2015-03-25 南京航空航天大学 含Nd、Ga的低银Sn-Ag-Cu无铅钎料
CN102896438B (zh) * 2012-10-22 2014-10-08 王志祥 一种铜锌钎料及其制备方法
US20140284794A1 (en) * 2012-11-07 2014-09-25 Mk Electron Co., Ltd. Tin-based solder ball and semiconductor package including the same
CN103008919B (zh) * 2012-12-13 2015-05-27 郴州金箭焊料有限公司 一种低银无卤无铅焊锡膏
CN102974953B (zh) * 2012-12-17 2015-03-11 南京航空航天大学 含Fe和Nd的Sn-Cu-Co无铅钎料
CN103042315B (zh) * 2013-01-22 2015-05-27 马莒生 耐热耐湿低熔点无铅焊料合金
CN105189003A (zh) * 2013-03-13 2015-12-23 日本斯倍利亚社股份有限公司 焊剂接合物及焊剂接合方法
CN105143383B (zh) 2013-03-19 2016-12-14 日本A&L株式会社 粘接剂用共聚物胶乳以及粘接剂组合物
CN103212919A (zh) * 2013-03-22 2013-07-24 宁波市鄞州品达电器焊料有限公司 一种改进的无铅焊锡丝及其助焊剂
US10180035B2 (en) 2013-04-01 2019-01-15 Schlumberger Technology Corporation Soldered components for downhole use
JP5714191B1 (ja) 2013-05-29 2015-05-07 新日鉄住金マテリアルズ株式会社 半田ボールおよび電子部材
CN103381526B (zh) * 2013-06-22 2016-02-03 宁波市鄞州品达电器焊料有限公司 一种新型焊料
JP5730354B2 (ja) * 2013-07-17 2015-06-10 ハリマ化成株式会社 はんだ組成物、ソルダペーストおよび電子回路基板
CN103480978A (zh) * 2013-09-29 2014-01-01 宁波市鄞州恒迅电子材料有限公司 环保无铅防电极溶出焊锡丝
KR102522501B1 (ko) * 2013-10-31 2023-04-14 알파 어셈블리 솔루션스 인크. 무연, 무은 솔더 합금
JP6075465B2 (ja) 2014-01-07 2017-02-08 株式会社村田製作所 補修方法および補修材
AU2015254179B2 (en) * 2014-04-30 2017-07-20 Nihon Superior Co., Ltd. Lead-free solder alloy
WO2015198497A1 (ja) * 2014-06-24 2015-12-30 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
WO2016012754A2 (en) * 2014-07-21 2016-01-28 Alpha Metals, Inc. Low temperature high reliability alloy for solder hierarchy
CN104400248A (zh) * 2014-10-24 2015-03-11 云南锡业锡材有限公司 一种光伏用锡合金焊料、制备方法及用途
JP6648468B2 (ja) * 2014-10-29 2020-02-14 Tdk株式会社 Pbフリーはんだ及び電子部品内蔵モジュール
JP5723056B1 (ja) * 2014-12-15 2015-05-27 ハリマ化成株式会社 はんだ合金、ソルダペーストおよび電子回路基板
CN104439751A (zh) * 2014-12-24 2015-03-25 深圳市亿铖达工业有限公司 新型低熔点无铅焊料
CN104942474B (zh) * 2015-07-06 2017-04-05 江苏科技大学 一种含锡、硅、锌和镨的无镉银钎料及其制备方法
CN105057910A (zh) * 2015-07-29 2015-11-18 瑞声光电科技(常州)有限公司 Sn-Zn系无铅钎料及其制备方法
JP6011709B1 (ja) * 2015-11-30 2016-10-19 千住金属工業株式会社 はんだ合金
KR101865727B1 (ko) * 2016-03-22 2018-06-08 현대자동차 주식회사 무연 솔더 조성물
JP6755546B2 (ja) * 2016-08-09 2020-09-16 株式会社日本スペリア社 接合方法
CN106181111A (zh) * 2016-08-16 2016-12-07 镇江市锶达合金材料有限公司 一种高性能铜铝复合焊料
JP6365653B2 (ja) 2016-08-19 2018-08-01 千住金属工業株式会社 はんだ合金、はんだ継手およびはんだ付け方法
GB2557439B (en) * 2016-10-24 2021-06-30 Jaguar Land Rover Ltd Apparatus and method relating to electrochemical migration
KR101941866B1 (ko) * 2016-12-19 2019-01-25 에이에치코리아 주식회사 전자부품용 솔더 크림
CN106956091A (zh) * 2017-05-02 2017-07-18 泰州朗瑞新能源科技有限公司 一种焊接材料及其制备方法
KR102247498B1 (ko) * 2017-07-07 2021-05-03 덕산하이메탈(주) 솔더 합금, 솔더볼 및 그 제조방법
JP6292342B1 (ja) * 2017-09-20 2018-03-14 千住金属工業株式会社 Cu管及び/又はFe管接合用はんだ合金、プリフォームはんだ、やに入りはんだおよびはんだ継手
CN108080810A (zh) * 2017-12-13 2018-05-29 柳州智臻智能机械有限公司 一种电子封装用焊料合金及其制备方法
CN108705222B (zh) * 2018-04-04 2021-02-09 胡妍 一种耐腐蚀低温焊接材料及其制备方法
CN111936264A (zh) * 2018-04-13 2020-11-13 千住金属工业株式会社 焊膏
JP6439893B1 (ja) * 2018-05-25 2018-12-19 千住金属工業株式会社 ハンダボール、ハンダ継手および接合方法
CN108941971B (zh) * 2018-08-16 2020-12-18 广东省科学院中乌焊接研究所 一种免清洗水性锡膏及其制备方法
CN108994479B (zh) * 2018-08-24 2020-08-07 温州市星峰新材料有限公司 一种耐腐蚀高强度的焊接材料及其制造方法
KR102187085B1 (ko) 2019-01-24 2020-12-04 주식회사 경동엠텍 고온 및 진동환경에 적합한 무연솔더 합금 조성물 및 그 제조방법
JP6649595B1 (ja) * 2019-05-27 2020-02-19 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびこれらを用いたはんだ継手
JP6721851B1 (ja) * 2019-06-28 2020-07-15 千住金属工業株式会社 はんだ合金、鋳造物、形成物およびはんだ継手
JP6700568B1 (ja) 2019-08-09 2020-05-27 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、Ball Grid Arrayおよびはんだ継手
JP6912742B1 (ja) * 2020-02-14 2021-08-04 千住金属工業株式会社 鉛フリーかつアンチモンフリーのはんだ合金、はんだボール、およびはんだ継手
CN111702280B (zh) * 2020-05-13 2021-09-24 中国科学院金属研究所 Ti2AlNb基合金同材或异材钎焊专用中温Ti基钎料及其制备方法和钎焊工艺
JP6889387B1 (ja) * 2020-06-23 2021-06-18 千住金属工業株式会社 はんだ合金、ソルダペースト、はんだボール、ソルダプリフォーム、はんだ継手、車載電子回路、ecu電子回路、車載電子回路装置、及びecu電子回路装置
CN113182726A (zh) * 2021-04-07 2021-07-30 河南鸿昌电子有限公司 一种焊接半导体所用的焊锡和焊锡的使用方法
CN114871628A (zh) * 2022-05-31 2022-08-09 杭州华光焊接新材料股份有限公司 一种低银高强度无铅锡基钎料及其制备方法
CN115365699B (zh) * 2022-09-19 2024-08-23 云南锡业新材料有限公司 一种焊点无微裂纹Sn-Ag-Cu系无铅焊料合金及制备方法
CN115815872B (zh) * 2023-01-09 2023-06-27 广州汉源新材料股份有限公司 一种无铅无锑强化焊料合金及其制备方法
CN120572205A (zh) * 2025-07-30 2025-09-02 云南锡业新材料有限公司 一种低铜溶蚀速率的锡铜系高温抗氧化焊料

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8807730D0 (en) * 1988-03-31 1988-05-05 Cookson Group Plc Low toxicity soldering compositions
US4879096A (en) * 1989-04-19 1989-11-07 Oatey Company Lead- and antimony-free solder composition
WO1997012719A1 (en) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Lead-free solder
JP3693762B2 (ja) * 1996-07-26 2005-09-07 株式会社ニホンゲンマ 無鉛はんだ
US5837191A (en) * 1996-10-22 1998-11-17 Johnson Manufacturing Company Lead-free solder
US6649127B2 (en) * 1996-12-17 2003-11-18 Sony Chemicals Corp Lead-free solder material having good wettability
KR19980068127A (ko) * 1997-02-15 1998-10-15 김광호 납땜용 무연 합금
JP2000015476A (ja) 1998-06-29 2000-01-18 Ishikawa Kinzoku Kk 無鉛はんだ
JP2000094181A (ja) 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物
MY116246A (en) * 1999-01-28 2003-12-31 Murata Manufacturing Co Lead-free solder and soldered article
JP3262113B2 (ja) * 1999-01-29 2002-03-04 富士電機株式会社 はんだ合金
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP3753168B2 (ja) * 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
US6517602B2 (en) * 2000-03-14 2003-02-11 Hitachi Metals, Ltd Solder ball and method for producing same
JP2002096191A (ja) * 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd はんだ材料およびこれを利用する電気・電子機器
ES2541439T3 (es) * 2001-03-01 2015-07-20 Senju Metal Industry Co., Ltd Pasta de soldadura sin plomo
JP2003001482A (ja) * 2001-06-19 2003-01-08 Tokyo Daiichi Shoko:Kk 無鉛半田合金
US20030021718A1 (en) * 2001-06-28 2003-01-30 Osamu Munekata Lead-free solder alloy
JP2003051729A (ja) * 2001-08-06 2003-02-21 Tdk Corp 積層型フィルタアレイ
CN1346728A (zh) * 2001-09-19 2002-05-01 大连理工大学 含稀土多合金组元无铅钎料合金
JP4144415B2 (ja) * 2003-01-07 2008-09-03 千住金属工業株式会社 鉛フリーはんだ
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
DE10319888A1 (de) * 2003-04-25 2004-11-25 Siemens Ag Lotmaterial auf SnAgCu-Basis

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US20160107267A1 (en) 2016-04-21
WO2006059115A1 (en) 2006-06-08
CN101132881A (zh) 2008-02-27
US9221131B2 (en) 2015-12-29
EP1841561A1 (en) 2007-10-10
JP2008521619A (ja) 2008-06-26
KR20070118588A (ko) 2007-12-17
EP1841561B1 (en) 2015-08-12
CN101132881B (zh) 2011-02-09
BRPI0518780B1 (pt) 2012-12-11
PL1841561T3 (pl) 2016-01-29
JP5147409B2 (ja) 2013-02-20
GB2421030A (en) 2006-06-14
GB0426383D0 (en) 2005-01-05
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