BRPI0520282A2 - composição curável por calor, composição adesiva, produtos de reação curados, pelìcula adesiva, composição sintática, pré-impregnado, estopa pré-impregnada, e, processo para produzir uma composição curável por calor - Google Patents

composição curável por calor, composição adesiva, produtos de reação curados, pelìcula adesiva, composição sintática, pré-impregnado, estopa pré-impregnada, e, processo para produzir uma composição curável por calor

Info

Publication number
BRPI0520282A2
BRPI0520282A2 BRPI0520282-5A BRPI0520282A BRPI0520282A2 BR PI0520282 A2 BRPI0520282 A2 BR PI0520282A2 BR PI0520282 A BRPI0520282 A BR PI0520282A BR PI0520282 A2 BRPI0520282 A2 BR PI0520282A2
Authority
BR
Brazil
Prior art keywords
composition
heat curable
prepreg
adhesive
curable composition
Prior art date
Application number
BRPI0520282-5A
Other languages
English (en)
Inventor
Wei Helen Li
Stanley L Lehmann
Raymond S Wong
Original Assignee
Henkel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Corp filed Critical Henkel Corp
Publication of BRPI0520282A2 publication Critical patent/BRPI0520282A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/12—Macromolecular compounds containing atoms other than carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/35—Heterocyclic compounds having nitrogen in the ring having also oxygen in the ring
    • C08K5/357—Six-membered rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2465/00—Presence of polyphenylene
    • C09J2465/006—Presence of polyphenylene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/02—Presence of polyamine or polyimide polyamine
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Adhesive Tapes (AREA)

Abstract

COMPOSIçãO CURáVEL POR CALOR, COMPOSIçãO ADESIVA, PRODUTOS DE REAçãO CURADOS, PELìCULA ADESIVA, COMPOSIçãO SINTáTICA, PRé-IMPREGNADO, ESTOPA PRé-IMPREGNADA, E, PROCESSO PARA PRODUZIR UMA COMPOSIçãO CURáVEL POR CALOR. As composições curáveis, tais como aquelas com base em benzoxazina, são úteis nas aplicações dentro da indústria aeroespacial, tal como, por exemplo, uma composição curável por calor para uso como uma resina matriz ou um adesivo, e formam a base da presente invenção.
BRPI0520282-5A 2004-12-03 2005-12-01 composição curável por calor, composição adesiva, produtos de reação curados, pelìcula adesiva, composição sintática, pré-impregnado, estopa pré-impregnada, e, processo para produzir uma composição curável por calor BRPI0520282A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/004,566 US7666938B2 (en) 2004-12-03 2004-12-03 Nanoparticle silica filled benzoxazine compositions
PCT/US2005/043909 WO2006062891A1 (en) 2004-12-03 2005-12-01 Nanoparticle silica filled benzoxazine compositions

Publications (1)

Publication Number Publication Date
BRPI0520282A2 true BRPI0520282A2 (pt) 2009-09-15

Family

ID=36178121

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0520282-5A BRPI0520282A2 (pt) 2004-12-03 2005-12-01 composição curável por calor, composição adesiva, produtos de reação curados, pelìcula adesiva, composição sintática, pré-impregnado, estopa pré-impregnada, e, processo para produzir uma composição curável por calor

Country Status (7)

Country Link
US (1) US7666938B2 (pt)
EP (1) EP1836247A1 (pt)
JP (1) JP2008523171A (pt)
KR (1) KR101461670B1 (pt)
CN (1) CN101068867A (pt)
BR (1) BRPI0520282A2 (pt)
WO (1) WO2006062891A1 (pt)

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ES2690653T3 (es) * 2008-06-16 2018-11-21 3M Innovative Properties Company Composiciones curables reforzadas
CA2728805A1 (en) * 2008-06-30 2010-01-07 Henkel Ag & Co. Kgaa High performance adhesives and methods of their use
JP5868707B2 (ja) * 2009-02-19 2016-02-24 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング オキサゾリンおよび／またはオキサジン組成物
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EP3058013B1 (en) * 2013-10-16 2018-01-31 3M Innovative Properties Company Benzoxazine polymerization
CN104845364B (zh) * 2014-02-14 2017-04-05 广东生益科技股份有限公司 一种无卤树脂组合物及其用途
KR102644664B1 (ko) * 2015-12-08 2024-03-07 디아이씨 가부시끼가이샤 옥사진 화합물, 조성물 및 경화물
EP3388460A4 (en) * 2015-12-08 2019-05-22 DIC Corporation OXAZINE COMPOUND, COMPOSITION AND CURED PRODUCT
WO2017098925A1 (ja) * 2015-12-08 2017-06-15 Dic株式会社 オキサジン化合物、組成物及び硬化物
CN105969178B (zh) * 2016-05-24 2018-05-01 济南大学 苯并噁嗪型超疏水纳米二氧化硅及其制备方法和应用
TWI656172B (zh) * 2017-09-18 2019-04-11 台燿科技股份有限公司 無溶劑之樹脂組合物及其應用
JP2019108516A (ja) * 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、プリプレグ、積層板、金属ベース基板およびパワーモジュール
CN109354825B (zh) * 2018-10-12 2021-06-22 北京玻钢院复合材料有限公司 一种耐高温的热熔型苯并噁嗪树脂及其制备方法
CN111892728B (zh) * 2020-06-23 2022-09-23 航天特种材料及工艺技术研究所 一种用于热压罐成型工艺的苯并噁嗪树脂热熔预浸料的制备方法
CN115559061B (zh) * 2022-09-30 2024-06-21 重庆美力斯新材料科技股份有限公司 一种高性能pe纤维复合无纬布及其生产工艺

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Also Published As

Publication number Publication date
WO2006062891A1 (en) 2006-06-15
CN101068867A (zh) 2007-11-07
JP2008523171A (ja) 2008-07-03
US20060240261A1 (en) 2006-10-26
US7666938B2 (en) 2010-02-23
KR101461670B1 (ko) 2014-11-13
KR20070086815A (ko) 2007-08-27
EP1836247A1 (en) 2007-09-26

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Legal Events

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B06G Technical and formal requirements: other requirements [chapter 6.7 patent gazette]

Free format text: SOLICITA-SE A REGULARIZACAO DA PROCURACAO, UMA VEZ QUE BASEADO NO ARTIGO 216 1O DA LPI, O DOCUMENTO DE PROCURACAO DEVE SER APRESENTADO EM SUA FORMA AUTENTICADA; OU SEGUNDO PARECER DA PROCURADORIA NO 074/93, DEVE CONSTAR UMA DECLARACAO DE VERACIDADE, A QUAL DEVE SER ASSINADA POR UMA PESSOA DEVIDAMENTE AUTORIZADA A REPRESENTAR O INTERESSADO, DEVENDO A MESMA CONSTAR NO INSTRUMENTO DE PROCURACAO, OU NO SEU SUBSTABELECIMENTO.

B25A Requested transfer of rights approved

Owner name: HENKEL US IP LLC (US)

B25A Requested transfer of rights approved

Owner name: HENKEL IP AND HOLDING GMBH (DE)

B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B15K Others concerning applications: alteration of classification

Ipc: C08G 61/12 (2006.01), C09J 7/02 (2006.01), C08K 3/

B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]
B15K Others concerning applications: alteration of classification

Ipc: C08G 61/12 (2006.01), C09J 7/00 (2018.01), C08K 3/