BRPI0520346A2 - sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas - Google Patents

sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas

Info

Publication number
BRPI0520346A2
BRPI0520346A2 BRPI0520346-5A BRPI0520346A BRPI0520346A2 BR PI0520346 A2 BRPI0520346 A2 BR PI0520346A2 BR PI0520346 A BRPI0520346 A BR PI0520346A BR PI0520346 A2 BRPI0520346 A2 BR PI0520346A2
Authority
BR
Brazil
Prior art keywords
protection system
hardware protection
electronic data
sensitive electronic
data modules
Prior art date
Application number
BRPI0520346-5A
Other languages
English (en)
Inventor
Anton Wimmer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BRPI0520346A2 publication Critical patent/BRPI0520346A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Security & Cryptography (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Storage Device Security (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

SISTEMA DE PROTEçãO DE HARDWARE PARA MóDULOS DE DADOS ELETRÈNICOS SENSìVEIS QUE PROTEGE CONTRA MANIPULAçõES EXTERNAS. A presente invenção refere-se a um sistema de proteção de hardware que é integrado em um suporte de circuito. Como resultado, um sistema sensor, o qual é integrado no suporte de circuito na forma de placas de circuito impresso, as quais podem ser produzidas por meio da tecnologia tradicional de placa de circuito impresso de alta tecnologia, e podem ser equipadas e processadas nas linhas tradicionais de inserção de instalações de módulo eletrónico, é obtido.
BRPI0520346-5A 2005-06-30 2005-06-30 sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas BRPI0520346A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/053111 WO2007003228A1 (de) 2005-06-30 2005-06-30 Hardwareschutz für sensible elektronik-datenbaugruppen gegen externe manipulationen

Publications (1)

Publication Number Publication Date
BRPI0520346A2 true BRPI0520346A2 (pt) 2009-05-05

Family

ID=35841712

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0520346-5A BRPI0520346A2 (pt) 2005-06-30 2005-06-30 sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas

Country Status (6)

Country Link
US (1) US8270174B2 (pt)
EP (1) EP1897425A1 (pt)
JP (1) JP4891994B2 (pt)
BR (1) BRPI0520346A2 (pt)
RU (1) RU2382531C2 (pt)
WO (1) WO2007003228A1 (pt)

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JP5378076B2 (ja) * 2009-06-11 2013-12-25 東プレ株式会社 データの安全ケース
KR20120035673A (ko) * 2010-10-06 2012-04-16 삼성전기주식회사 패키지기판
GB2484742B (en) 2010-10-22 2013-06-12 Murata Power Solutions Milton Keynes Ltd Electronic component for surface mounting
CH704884B1 (fr) * 2011-04-29 2015-04-30 Suisse Electronique Microtech Substrat destiné à recevoir des contacts électriques.
JP5455250B2 (ja) * 2011-06-20 2014-03-26 東芝テック株式会社 情報処理装置
JP4914530B1 (ja) * 2011-09-06 2012-04-11 パナソニック株式会社 端末装置
RU2489814C1 (ru) * 2012-07-20 2013-08-10 Открытое акционерное общество "Федеральный научно-производственный центр "Нижегородский научно-исследовательский институт радиотехники" Способ изготовления многослойных гибко-жестких интегральных плат
JP5622341B2 (ja) * 2013-09-25 2014-11-12 東プレ株式会社 データの安全ケース
US9108841B1 (en) * 2014-03-05 2015-08-18 Freescale Semiconductor, Inc. Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
JP5656303B1 (ja) * 2014-03-28 2015-01-21 パナソニック株式会社 情報処理装置
JP5703453B1 (ja) * 2014-03-28 2015-04-22 パナソニックＩｐマネジメント株式会社 情報処理装置
GB2529622A (en) * 2014-08-22 2016-03-02 Johnson Electric Sa Improvements in or relating to an anti-tamper device
JP6572820B2 (ja) * 2016-04-25 2019-09-11 富士通株式会社 電源供給構造
JP6771849B2 (ja) * 2017-03-30 2020-10-21 モレックス エルエルシー 改ざん防止決済リーダー
US10638608B2 (en) * 2017-09-08 2020-04-28 Apple Inc. Interconnect frames for SIP modules
CN108156756B (zh) * 2018-02-06 2024-05-10 国蓉科技有限公司 一种异构刚饶板及基于异构刚饶板的多层板卡制作方法
DE102021200770A1 (de) 2021-01-28 2022-07-28 Continental Automotive Gmbh Anordnung, die eine mehrschicht- leiterplatte aufweist, undverfahren zum betreiben einer mehrschicht- leiterplatte
US11765816B2 (en) 2021-08-11 2023-09-19 International Business Machines Corporation Tamper-respondent assemblies with pressure connector assemblies
FR3128090B1 (fr) * 2021-10-08 2024-08-16 St Microelectronics Grenoble 2 Dispositif électronique

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Also Published As

Publication number Publication date
JP4891994B2 (ja) 2012-03-07
US8270174B2 (en) 2012-09-18
RU2008103343A (ru) 2009-08-10
WO2007003228A1 (de) 2007-01-11
US20080278922A1 (en) 2008-11-13
JP2008547240A (ja) 2008-12-25
RU2382531C2 (ru) 2010-02-20
EP1897425A1 (de) 2008-03-12

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2261 DE 06/05/2014.