BRPI0520346A2 - sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas - Google Patents

sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas

Info

Publication number
BRPI0520346A2
BRPI0520346A2 BRPI0520346-5A BRPI0520346A BRPI0520346A2 BR PI0520346 A2 BRPI0520346 A2 BR PI0520346A2 BR PI0520346 A BRPI0520346 A BR PI0520346A BR PI0520346 A2 BRPI0520346 A2 BR PI0520346A2
Authority
BR
Brazil
Prior art keywords
protection system
hardware protection
electronic data
sensitive electronic
data modules
Prior art date
Application number
BRPI0520346-5A
Other languages
English (en)
Inventor
Anton Wimmer
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of BRPI0520346A2 publication Critical patent/BRPI0520346A2/pt

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0275—Security details, e.g. tampering prevention or detection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Computer Security & Cryptography (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Combinations Of Printed Boards (AREA)
  • Storage Device Security (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Emergency Protection Circuit Devices (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

SISTEMA DE PROTEçãO DE HARDWARE PARA MóDULOS DE DADOS ELETRÈNICOS SENSìVEIS QUE PROTEGE CONTRA MANIPULAçõES EXTERNAS. A presente invenção refere-se a um sistema de proteção de hardware que é integrado em um suporte de circuito. Como resultado, um sistema sensor, o qual é integrado no suporte de circuito na forma de placas de circuito impresso, as quais podem ser produzidas por meio da tecnologia tradicional de placa de circuito impresso de alta tecnologia, e podem ser equipadas e processadas nas linhas tradicionais de inserção de instalações de módulo eletrónico, é obtido.
BRPI0520346-5A 2005-06-30 2005-06-30 sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas BRPI0520346A2 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2005/053111 WO2007003228A1 (de) 2005-06-30 2005-06-30 Hardwareschutz für sensible elektronik-datenbaugruppen gegen externe manipulationen

Publications (1)

Publication Number Publication Date
BRPI0520346A2 true BRPI0520346A2 (pt) 2009-05-05

Family

ID=35841712

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0520346-5A BRPI0520346A2 (pt) 2005-06-30 2005-06-30 sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas

Country Status (6)

Country Link
US (1) US8270174B2 (pt)
EP (1) EP1897425A1 (pt)
JP (1) JP4891994B2 (pt)
BR (1) BRPI0520346A2 (pt)
RU (1) RU2382531C2 (pt)
WO (1) WO2007003228A1 (pt)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2938953B1 (fr) * 2008-11-21 2011-03-11 Innova Card Dispositif de protection d'un boitier de circuit integre electronique contre les intrusions par voie physique ou chimique.
JP5378076B2 (ja) * 2009-06-11 2013-12-25 東プレ株式会社 データの安全ケース
KR20120035673A (ko) * 2010-10-06 2012-04-16 삼성전기주식회사 패키지기판
GB2484742B (en) 2010-10-22 2013-06-12 Murata Power Solutions Milton Keynes Ltd Electronic component for surface mounting
CH704884B1 (fr) * 2011-04-29 2015-04-30 Suisse Electronique Microtech Substrat destiné à recevoir des contacts électriques.
JP5455250B2 (ja) * 2011-06-20 2014-03-26 東芝テック株式会社 情報処理装置
JP4914530B1 (ja) * 2011-09-06 2012-04-11 パナソニック株式会社 端末装置
RU2489814C1 (ru) * 2012-07-20 2013-08-10 Открытое акционерное общество "Федеральный научно-производственный центр "Нижегородский научно-исследовательский институт радиотехники" Способ изготовления многослойных гибко-жестких интегральных плат
JP5622341B2 (ja) * 2013-09-25 2014-11-12 東プレ株式会社 データの安全ケース
US9108841B1 (en) * 2014-03-05 2015-08-18 Freescale Semiconductor, Inc. Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof
JP5703453B1 (ja) * 2014-03-28 2015-04-22 パナソニックＩｐマネジメント株式会社 情報処理装置
JP5656303B1 (ja) * 2014-03-28 2015-01-21 パナソニック株式会社 情報処理装置
GB2529622A (en) * 2014-08-22 2016-03-02 Johnson Electric Sa Improvements in or relating to an anti-tamper device
JP6572820B2 (ja) * 2016-04-25 2019-09-11 富士通株式会社 電源供給構造
EP3602451A4 (en) * 2017-03-30 2020-12-09 Molex, LLC INVIOLABLE PAYMENT READER
US10638608B2 (en) * 2017-09-08 2020-04-28 Apple Inc. Interconnect frames for SIP modules
CN108156756B (zh) * 2018-02-06 2024-05-10 国蓉科技有限公司 一种异构刚饶板及基于异构刚饶板的多层板卡制作方法
DE102021200770A1 (de) 2021-01-28 2022-07-28 Continental Automotive Gmbh Anordnung, die eine mehrschicht- leiterplatte aufweist, undverfahren zum betreiben einer mehrschicht- leiterplatte
US11765816B2 (en) 2021-08-11 2023-09-19 International Business Machines Corporation Tamper-respondent assemblies with pressure connector assemblies
FR3128090B1 (fr) * 2021-10-08 2024-08-16 St Microelectronics Grenoble 2 Dispositif électronique

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2195478B (en) 1986-09-24 1990-06-13 Ncr Co Security device for sensitive data
US5269378A (en) 1990-05-19 1993-12-14 Bayer Aktiengesellschaft Housing arrangement for fire-endangered installations
RU2026611C1 (ru) * 1991-04-29 1995-01-09 Владимир Мурадович Кочарян Соединитель преимущественно в установках для подключения больших интегральных схем к контактным элементам печатных плат
GB9115972D0 (en) 1991-07-24 1991-09-11 Gore W L & Ass Uk Improvements in security enclosures
US5233505A (en) 1991-12-30 1993-08-03 Yeng-Ming Chang Security device for protecting electronically-stored data
JP2541487B2 (ja) * 1993-11-29 1996-10-09 日本電気株式会社 半導体装置パッケ―ジ
DE19512266C2 (de) 1994-09-23 1998-11-19 Rainer Jacob Diebstahlschutzsystem für Fahrzeuge
FR2758935B1 (fr) 1997-01-28 2001-02-16 Matra Marconi Space France Boitier micro-electronique multi-niveaux
RU2119276C1 (ru) * 1997-11-03 1998-09-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный гибкий электронный модуль
US6100113A (en) * 1998-07-13 2000-08-08 Institute Of Microelectronics Very thin multi-chip-package and method of mass producing the same
US6075700A (en) * 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
CN1246730A (zh) 1999-09-13 2000-03-08 后健慈 集成电路封装盒的保全结构
GB2358957B (en) * 1999-10-27 2004-06-23 Ibm Ball grid array module
US6404043B1 (en) 2000-06-21 2002-06-11 Dense-Pac Microsystems, Inc. Panel stacking of BGA devices to form three-dimensional modules
DE10047436A1 (de) 2000-09-21 2002-08-29 Giesecke & Devrient Gmbh Sicherheitsmodul
EP1421549B1 (en) 2001-08-31 2007-08-22 VeriFone Systems Ireland Limited A pin pad
JP2003229510A (ja) * 2001-11-30 2003-08-15 Ngk Spark Plug Co Ltd 配線基板
US20040089943A1 (en) * 2002-11-07 2004-05-13 Masato Kirigaya Electronic control device and method for manufacturing the same
JP2004158700A (ja) * 2002-11-07 2004-06-03 Denso Corp 電子制御装置およびその製造方法
US6853093B2 (en) * 2002-12-20 2005-02-08 Lipman Electronic Engineering Ltd. Anti-tampering enclosure for electronic circuitry
JP4342174B2 (ja) * 2002-12-27 2009-10-14 新光電気工業株式会社 電子デバイス及びその製造方法
US7170155B2 (en) * 2003-06-25 2007-01-30 Intel Corporation MEMS RF switch module including a vertical via
US7368808B2 (en) * 2003-06-30 2008-05-06 Intel Corporation MEMS packaging using a non-silicon substrate for encapsulation and interconnection
JP2005116897A (ja) * 2003-10-09 2005-04-28 Matsushita Electric Ind Co Ltd 回路基板、回路基板の設計支援装置及び方法、設計支援プログラム、及び設計支援プログラム記録媒体
ATE393423T1 (de) 2003-10-24 2008-05-15 Verifone Systems Ireland Ltd Schaltungs-sicherheit
US7576426B2 (en) * 2005-04-01 2009-08-18 Skyworks Solutions, Inc. Wafer level package including a device wafer integrated with a passive component

Also Published As

Publication number Publication date
RU2008103343A (ru) 2009-08-10
RU2382531C2 (ru) 2010-02-20
EP1897425A1 (de) 2008-03-12
WO2007003228A1 (de) 2007-01-11
US8270174B2 (en) 2012-09-18
JP4891994B2 (ja) 2012-03-07
US20080278922A1 (en) 2008-11-13
JP2008547240A (ja) 2008-12-25

Similar Documents

Publication Publication Date Title
BRPI0520346A2 (pt) sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas
MX2009005409A (es) Empaquetado mejorado para seguridad de computadora personal (pc).
BRPI0520789A2 (pt) artigo absorvente compreendendo meios de detecção de umidade
WO2007109773A3 (en) Electromagnetic interference containment in a transceiver module
TW200740313A (en) Customizable printed circuit board
GB2475658B (en) Mainboard assembly including a package overlying a die directly attached to the mainboard
NZ590264A (en) A system for sensing electrophysiological signals
DE602006012571D1 (de) Vorrichtung zum Schutz einer elektronischen Schaltung
TW200723002A (en) Memory interface to bridge memory buses
BR112013023980A2 (pt) aparelho eletrônico com substrato em uma carcaça de inserção
IN2015DN02918A (pt)
BRPI0913162A8 (pt) Sistema de transporte
EP2057762A4 (en) ARMING AND RESETTING DEVICE FOR THE IRONING TYPE FOR A POWERED OPTOELECTRONIC MODULE TURNED ON
EP2259666A4 (en) CIRCUIT BOARD WITH BUILT-IN ELECTRONIC PARTS AND METHOD FOR THE PRODUCTION THEREOF
BR112019003959A2 (pt) plataforma estendida com slots de módulo de memória adicionais por soquete cpu
GB2461226A (en) Slot in housing adapted to receive at least a portion of a printed paper item for optical character recognition
GB2490384B (en) Circuit board
FR2944625B1 (fr) Lecteur de carte memoire.
TW200833236A (en) Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment
TW200742532A (en) Fixing structure for electronic device
MY167837A (en) Integrated circuit film and method of manufacturing the same
BRPI0520345A2 (pt) sensor para um sistema de proteção de hardware para módulos de dados eletrÈnicos sensìveis que protege contra manipulações externas
TW200638841A (en) Fastening device for interface card
TW200705622A (en) Method and system for a semiconductor package with an air vent
TW200614882A (en) A layout structure of a printed circuit board

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2261 DE 06/05/2014.