BRPI0606944A2 - adesivos de contato de fusão a quente, reticuláveis por radiação - Google Patents

adesivos de contato de fusão a quente, reticuláveis por radiação

Info

Publication number
BRPI0606944A2
BRPI0606944A2 BRPI0606944-4A BRPI0606944A BRPI0606944A2 BR PI0606944 A2 BRPI0606944 A2 BR PI0606944A2 BR PI0606944 A BRPI0606944 A BR PI0606944A BR PI0606944 A2 BRPI0606944 A2 BR PI0606944A2
Authority
BR
Brazil
Prior art keywords
hot melt
radiation crosslinkable
melt contact
contact adhesives
groups
Prior art date
Application number
BRPI0606944-4A
Other languages
English (en)
Inventor
Holger Tinniessen
Thomas Miller
Original Assignee
Henkel Kgaa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel Kgaa filed Critical Henkel Kgaa
Publication of BRPI0606944A2 publication Critical patent/BRPI0606944A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J115/00—Adhesives based on rubber derivatives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J119/00—Adhesives based on rubbers, not provided for in groups C09J107/00 - C09J117/00
    • C09J119/006—Rubber characterised by functional groups, e.g. telechelic diene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0869—Acids or derivatives thereof
    • C09J123/0884—Epoxide containing esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
    • C08L2666/06—Homopolymers or copolymers of unsaturated hydrocarbons; Derivatives thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)

Abstract

ADESIVOS DE CONTATO DE FUSãO A QUENTE, RETICULáVEIS POR RADIAçãO. A invenção refere-se a um adesivo de contato de fusão a quente, reticulável por radiação, de poliolefinas epoxidadas, reticuláveis por radiação, sendo que os grupos epóxi estão distribuídos, substancialmente, sobre a cadeia de polímeros, bem como um componente (B) como resina promotora de viscosidade, que está livre de grupos epóxido, bem como, opcionalmente, um composto oligomérico (C), que apresenta grupos reativos, que podem reagir com os grupos epóxido do componente (A), junto com pelo menos um fotoiniciador e outros aditivos.
BRPI0606944-4A 2005-02-10 2006-01-11 adesivos de contato de fusão a quente, reticuláveis por radiação BRPI0606944A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510006282 DE102005006282A1 (de) 2005-02-10 2005-02-10 Strahlungsvernetzbare Schmelzhaftklebstoffe
PCT/EP2006/000172 WO2006084537A2 (de) 2005-02-10 2006-01-11 Strahlungsvernetzbare schmelzhaftklebstoffe

Publications (1)

Publication Number Publication Date
BRPI0606944A2 true BRPI0606944A2 (pt) 2009-07-28

Family

ID=36129679

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0606944-4A BRPI0606944A2 (pt) 2005-02-10 2006-01-11 adesivos de contato de fusão a quente, reticuláveis por radiação

Country Status (6)

Country Link
US (1) US7682477B2 (pt)
EP (1) EP1846529A2 (pt)
AU (1) AU2006212536B2 (pt)
BR (1) BRPI0606944A2 (pt)
DE (1) DE102005006282A1 (pt)
WO (1) WO2006084537A2 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006054196A1 (de) * 2006-11-15 2008-05-21 Henkel Kgaa Schmelzhaftklebstoffe mit verbesserter Haftung
DE102007023425A1 (de) 2007-05-16 2008-11-20 Henkel Ag & Co. Kgaa Verfahren zum Verkleben von Etiketten
US8796351B2 (en) * 2007-05-21 2014-08-05 Avery Dennison Corporation Pressure sensitive adhesives made from renewable resources and related methods
DE102011087834A1 (de) * 2011-12-06 2013-06-06 Henkel Ag & Co. Kgaa Reaktive 2K-Schmelzklebstoffzusammensetzung
EP2836078A1 (en) 2012-04-09 2015-02-18 Avery Dennison Corporation Pressure sensitive adhesives based on renewable resources, uv curing and related methods
JP6582363B2 (ja) * 2013-12-03 2019-10-02 オート化学工業株式会社 接着剤組成物及びその製造方法
DE102015200315B4 (de) * 2015-01-13 2018-05-30 Altana Ag Elektroisolierlack für OLED-Leuchtelemente sowie dessen Verwendung
CN112500805A (zh) * 2016-02-03 2021-03-16 河北永乐胶带有限公司 一种新型耐高温聚氯乙烯胶带的制作方法
EP3725826A1 (de) * 2019-04-16 2020-10-21 Henkel AG & Co. KGaA Pumpbare thermisch härt- und expandierbare zubereitungen

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100227998B1 (ko) * 1991-04-29 1999-11-01 오노 알버어스 가교-결합 에폭시 관능화 폴리디엔 블럭 중합체, 그들의 제조 방법, 그들을 포함하는 조성물 및 출발 블럭 공중합체
TW226380B (pt) * 1992-04-03 1994-07-11 Shell Internat Res Schappej B V
US5247026A (en) * 1992-06-19 1993-09-21 Shell Oil Company Randomly epoxidized small star polymers
US5393818A (en) * 1993-04-06 1995-02-28 Shell Oil Company Solvent-free laminating adhesive composition from epoxidized block polymer
US5436063A (en) * 1993-04-15 1995-07-25 Minnesota Mining And Manufacturing Company Coated abrasive article incorporating an energy cured hot melt make coat
TW309535B (pt) * 1994-10-11 1997-07-01 Shell Int Research
US5837749A (en) * 1996-04-26 1998-11-17 Shell Oil Company Non-aqueous solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers (III)
US5766277A (en) * 1996-09-20 1998-06-16 Minnesota Mining And Manufacturing Company Coated abrasive article and method of making same
JPH10158626A (ja) * 1996-12-02 1998-06-16 Daicel Chem Ind Ltd 耐熱性・耐寒性に優れたホットメルト接着剤組成物
US5789512A (en) 1996-12-23 1998-08-04 Sartomer Company Method for the epoxidation of unsaturated polymers
US6077601A (en) * 1998-05-01 2000-06-20 3M Innovative Properties Company Coated abrasive article
JP2000017242A (ja) * 1998-06-29 2000-01-18 Minnesota Mining & Mfg Co <3M> ホットメルト接着剤組成物、熱圧着性フィルムおよびホットメルト接着剤組成物を用いた接着方法
ATE276326T1 (de) 1998-10-09 2004-10-15 Kraton Polymers Res Bv Strahlenhärtbares klebemittel
AU1716000A (en) 1998-11-10 2000-05-29 Ato Findley, Inc. Radiation curable pressure sensitive hot melt adhesive
US6579915B2 (en) 2000-01-31 2003-06-17 H.B. Fuller Licensing & Financing Inc. Radiation curable adhesive compositions comprising block copolymers having vinyl functionalized polydiene blocks
US6649259B1 (en) * 2000-02-29 2003-11-18 National Starch And Chemical Investment Holding Corporation Adhesives for thermally shrinkable films or labels
DE10036804A1 (de) 2000-07-28 2002-02-07 Tesa Ag Haftklebemassen auf Basis von Blockcopolymeren der Struktur P(B)-P(A/C)-P(B)
EP1217011B1 (en) 2000-12-21 2005-10-12 Kuraray Co., Ltd. Process for producing an expoxidized polymer
US6803081B2 (en) * 2001-06-26 2004-10-12 National Starch And Chemical Investment Holding Corporation Radiation curable adhesive
DE10234396A1 (de) * 2002-07-23 2004-01-29 Küper, Klaus, Prof. Dr.med. Verfahren und Anordnung zum Simulieren von Jagd- und Sportschießen
DE10234369A1 (de) 2002-07-27 2004-02-12 Henkel Kgaa Strahlungsvernetzbare Schmelzhaftklebstoffe
US7163968B2 (en) * 2004-03-16 2007-01-16 Kraton Polymers U.S. Llc UV curable pressure sensitive adhesives
JP5046366B2 (ja) * 2005-10-20 2012-10-10 信越化学工業株式会社 接着剤組成物及び該接着剤からなる接着層を備えたシート

Also Published As

Publication number Publication date
EP1846529A2 (de) 2007-10-24
AU2006212536B2 (en) 2012-04-19
DE102005006282A1 (de) 2006-08-24
US7682477B2 (en) 2010-03-23
AU2006212536A1 (en) 2006-08-17
US20080039594A1 (en) 2008-02-14
WO2006084537A3 (de) 2007-04-26
WO2006084537A2 (de) 2006-08-17

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Legal Events

Date Code Title Description
B25D Requested change of name of applicant approved

Owner name: HENKEL AG AND CO. KGAA (DE)

Free format text: NOME ALTERADO DE: HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 8A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2260 DE 29/04/2014.