BRPI0607295A2 - ferramenta de diamante - Google Patents

ferramenta de diamante

Info

Publication number
BRPI0607295A2
BRPI0607295A2 BRPI0607295-0A BRPI0607295A BRPI0607295A2 BR PI0607295 A2 BRPI0607295 A2 BR PI0607295A2 BR PI0607295 A BRPI0607295 A BR PI0607295A BR PI0607295 A2 BRPI0607295 A2 BR PI0607295A2
Authority
BR
Brazil
Prior art keywords
cutting
concentration
diamond
segment
diamond tool
Prior art date
Application number
BRPI0607295-0A
Other languages
English (en)
Inventor
Soo-Kwang Kim
Jong-Ho Kim
Hee-Dong Park
Original Assignee
Ehwa Diamond Ind Co Ltd
General Tool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ehwa Diamond Ind Co Ltd, General Tool Inc filed Critical Ehwa Diamond Ind Co Ltd
Publication of BRPI0607295A2 publication Critical patent/BRPI0607295A2/pt
Publication of BRPI0607295B1 publication Critical patent/BRPI0607295B1/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23DPLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/18Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/12Cut-off wheels
    • B24D5/123Cut-off wheels having different cutting segments
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121Circular saw blades

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mining & Mineral Resources (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

FERRAMENTA DE DIAMANTE. A invenção provê uma ferramenta de diamante do tipo de segmento capaz de melhorar a taxa de corte e de reduzir a quantidade de resíduos finos gerados durante o corte pela disposição apropriada de partículas de diamante em um segmento de corte da ferramenta de diamante. Na invenção, as camadas de partículas de diamante são dispostas de modo que as ranhuras de corte formadas em uma peça de trabalho por camadas de saída de partículas de diamante sejam dispostas entre ranhuras de corte formadas ali por camadas de entrada de partículas de diamante, respectivamente, no corte da peça de trabalho. O segmento de corte tem áreas de alta concentração e de baixa concentração. A área de alta concentração mostra uma concentração mais alta do que uma concentração média, e a área de baixa concentração mostra uma concentração mais baixa do que a concentração média. Também, pelo menos uma área de baixa concentração é formada na seção de entrada e/ou de saída do segmento de corte. A ferramenta de diamante da invenção assegura uma taxa de corte superior e uma quantidade reduzida de resíduos finos gerados durante o corte.
BRPI0607295-0A 2005-02-15 2006-02-13 Ferramenta de diamante BRPI0607295B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR1020050012458A KR100597717B1 (ko) 2005-02-15 2005-02-15 다이아몬드 공구
KR10-2005-0012458 2005-02-15
PCT/KR2006/000507 WO2006088302A1 (en) 2005-02-15 2006-02-13 Diamond tool

Publications (2)

Publication Number Publication Date
BRPI0607295A2 true BRPI0607295A2 (pt) 2009-08-25
BRPI0607295B1 BRPI0607295B1 (pt) 2020-02-11

Family

ID=36916676

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0607295-0A BRPI0607295B1 (pt) 2005-02-15 2006-02-13 Ferramenta de diamante

Country Status (10)

Country Link
US (1) US8028687B2 (pt)
EP (1) EP1937437B1 (pt)
JP (1) JP4724185B2 (pt)
KR (1) KR100597717B1 (pt)
CN (1) CN100563890C (pt)
AU (1) AU2006214879B2 (pt)
BR (1) BRPI0607295B1 (pt)
CA (1) CA2597284C (pt)
MX (1) MX2007009851A (pt)
WO (1) WO2006088302A1 (pt)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008526526A (ja) * 2004-12-30 2008-07-24 エーワ ダイアモンド インダストリアル カンパニイリミテッド 切削工具用切削チップ及び切削工具
KR100773606B1 (ko) 2006-01-24 2007-11-05 이창현 초연마재 프리폼을 이용한 가공팁 및 그 제조방법
AT511967B1 (de) 2011-12-01 2013-04-15 Swarovski Tyrolit Schleif Schleifwerkzeug sowie verfahren zur herstellung desselben
US9555485B2 (en) * 2014-04-25 2017-01-31 Gws Tool, Llc Diamond plated grinding endmill for advanced hardened ceramics machining
CN107671752A (zh) * 2017-11-01 2018-02-09 青岛百瑞福橡塑有限公司 一种打磨用金刚砂轮及装置
CN112008884B (zh) * 2019-05-29 2022-02-22 江苏友和工具有限公司 一种3d排列金刚石锯片
USD995585S1 (en) 2020-08-28 2023-08-15 Husqvarna Ab Cutting blade
USD994737S1 (en) 2020-08-28 2023-08-08 Husqvarna Ab Cutting blade
US12559657B2 (en) 2021-12-29 2026-02-24 Saint-Gobain Abrasives, Inc. Abrasive articles and methods for forming same
CN116571773A (zh) * 2023-05-04 2023-08-11 泉州众志新材料科技有限公司 一种金刚石刀头

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1488912A (en) * 1922-09-16 1924-04-01 Foerster Emanuel Saw tooth
US1866356A (en) * 1930-12-01 1932-07-05 Homer V Jones Saw tooth
US2811960A (en) * 1957-02-26 1957-11-05 Fessel Paul Abrasive cutting body
JPH03161278A (ja) * 1989-11-15 1991-07-11 Asahi Daiyamondo Kogyo Kk ダイヤモンドソーブレード
JPH05345280A (ja) * 1992-06-12 1993-12-27 Noritake Dia Kk ダイヤモンド切断砥石のチップ構造
JPH07266239A (ja) * 1994-03-25 1995-10-17 Hitachi Koki Co Ltd ダイヤモンドコアビット
KR200160680Y1 (ko) 1995-10-25 1999-11-15 이구택 소입자고체의 월류회수장치
DE19653975A1 (de) * 1995-12-31 1997-10-30 Kimiko Sueta Trennscheibe
TW394723B (en) 1997-04-04 2000-06-21 Sung Chien Min Abrasive tools with patterned grit distribution and method of manufacture
KR100231361B1 (ko) * 1997-07-25 1999-11-15 김세광 다이아몬드 공구용 세그먼트
KR100285415B1 (ko) * 1998-09-03 2001-04-02 김세광 세그먼트타입의다이아몬드소우브레이드
KR100285413B1 (ko) * 1998-09-03 2001-04-02 김세광 림타입의다이아몬드브레이드
KR20010060680A (ko) 1999-12-27 2001-07-07 구자홍 냉장고용 증발기
JP3739304B2 (ja) * 2001-07-26 2006-01-25 株式会社ノリタケスーパーアブレーシブ 回転円盤砥石
KR100428947B1 (ko) * 2001-09-28 2004-04-29 이화다이아몬드공업 주식회사 다이아몬드 공구
KR100554755B1 (ko) 2001-12-27 2006-02-24 주식회사 포스코 표면경도 및 외관이 우수한 전기아연도금강판 제조방법
KR100531499B1 (ko) * 2002-02-08 2005-11-28 이화다이아몬드공업 주식회사 다이아몬드 공구용 절삭팁 및 다이아몬드 공구
KR100527395B1 (ko) 2003-08-11 2005-11-09 이화다이아몬드공업 주식회사 다이아몬드 공구
KR200355532Y1 (ko) 2004-04-03 2004-07-07 박종익 책걸상의 높이조절 고정레버
US7134430B2 (en) * 2004-04-21 2006-11-14 Ehwa Diamond Industrial Co. Ltd. Cutting segment, method of manufacturing cutting segment, and cutting tool
JP4409365B2 (ja) 2004-06-03 2010-02-03 株式会社ガステック インジケータ
KR100556189B1 (ko) 2004-12-30 2006-03-06 이화다이아몬드공업 주식회사 절삭공구용 절삭팁 및 절삭공구
KR100680850B1 (ko) * 2005-04-20 2007-02-09 이화다이아몬드공업 주식회사 다이아몬드 공구용 절삭팁 및 다이아몬드 공구
EP1879717A4 (en) * 2005-04-21 2012-08-01 Ehwa Diamond Ind Co Ltd Cutting segment for cutting tools and cutting tools
US7178517B1 (en) * 2006-01-31 2007-02-20 Fang-Chun Yu Diamond saw blade for milling

Also Published As

Publication number Publication date
US20080163857A1 (en) 2008-07-10
JP4724185B2 (ja) 2011-07-13
AU2006214879A1 (en) 2006-08-24
KR100597717B1 (ko) 2006-07-10
CA2597284C (en) 2010-06-15
EP1937437B1 (en) 2016-04-13
CN101119822A (zh) 2008-02-06
MX2007009851A (es) 2007-10-03
WO2006088302A1 (en) 2006-08-24
EP1937437A4 (en) 2012-04-11
US8028687B2 (en) 2011-10-04
EP1937437A1 (en) 2008-07-02
CN100563890C (zh) 2009-12-02
JP2008529844A (ja) 2008-08-07
CA2597284A1 (en) 2006-08-24
AU2006214879B2 (en) 2011-09-29
BRPI0607295B1 (pt) 2020-02-11

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 11/02/2020, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 18A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2761 DE 05-12-2023 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.