BRPI0608019A2 - sensor magnético e método para manufaturar um sensor magnético - Google Patents

sensor magnético e método para manufaturar um sensor magnético

Info

Publication number
BRPI0608019A2
BRPI0608019A2 BRPI0608019-7A BRPI0608019A BRPI0608019A2 BR PI0608019 A2 BRPI0608019 A2 BR PI0608019A2 BR PI0608019 A BRPI0608019 A BR PI0608019A BR PI0608019 A2 BRPI0608019 A2 BR PI0608019A2
Authority
BR
Brazil
Prior art keywords
axis
magnetic sensor
sensor
magnoresistive
magnetization
Prior art date
Application number
BRPI0608019-7A
Other languages
English (en)
Inventor
Hideki Sato
Masayoshi Omura
Hiroshi Naito
Toshiyuki Oohashi
Yukio Wakui
Chihiro Osuga
Original Assignee
Yamaha Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005077010A external-priority patent/JP4984408B2/ja
Priority claimed from JP2005090581A external-priority patent/JP4940565B2/ja
Priority claimed from JP2006032125A external-priority patent/JP4735305B2/ja
Priority claimed from JP2006032124A external-priority patent/JP4735304B2/ja
Application filed by Yamaha Corp filed Critical Yamaha Corp
Publication of BRPI0608019A2 publication Critical patent/BRPI0608019A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y25/00—Nanomagnetism, e.g. magnetoimpedance, anisotropic magnetoresistance, giant magnetoresistance or tunneling magnetoresistance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/093—Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N59/00—Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)

Abstract

SENSOR MAGNéTICO E MéTODO PARA MANUFATURAR UM SENSOR MAGNéTICO. No sensor magnético de três eixos da presente Invenção, uma pluralidade de barras de elemento de efeito magnetorresistivo é conectada em série por meio de ímãs oblíquos para constituir elementos de efeito magnetorresistivo, e elementos de efeito magnetorresistivo do sensor de eixo X e aqueles do sensor de eixo Y são formados sobre uma superfície plana paralela à superfície plana do substrato. A direção de sensibilidade da magnetização é a direção vertical à direção longitudinal de cada uma das barras de elemento de efeito magnetorresístívo, e elementos de efeito magnetorresistivo do sensor de eixo X e aqueles do sensor de eixo Y são formados de tal modo que as direções de magnetização são ortogonais entre si. Além disso, elementos de efeito magnetorresistívo do eixo Z são formados sobre uma superfície inclinada da projeção projetada da superfície plana do substrato de tal modo que a direção de magnetização está dentro da superfície inclinada. O sensor de eixo z é provido de tal forma que a direção de sensibilidade é vertical à direção longitudinal da barra de elemento de efeito magnetorresistivo.
BRPI0608019-7A 2005-03-17 2006-03-17 sensor magnético e método para manufaturar um sensor magnético BRPI0608019A2 (pt)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2005077010A JP4984408B2 (ja) 2005-03-17 2005-03-17 磁気センサおよびその製法
JP2005091256 2005-03-28
JP2005090581A JP4940565B2 (ja) 2005-03-28 2005-03-28 磁気センサの製造方法
JP2006032125A JP4735305B2 (ja) 2006-02-09 2006-02-09 三軸磁気センサおよびその製造方法
JP2006032124A JP4735304B2 (ja) 2006-02-09 2006-02-09 三軸磁気センサおよびその製造方法
PCT/JP2006/305399 WO2006098431A1 (ja) 2005-03-17 2006-03-17 三軸磁気センサおよびその製造方法

Publications (1)

Publication Number Publication Date
BRPI0608019A2 true BRPI0608019A2 (pt) 2009-11-03

Family

ID=36991775

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0608019-7A BRPI0608019A2 (pt) 2005-03-17 2006-03-17 sensor magnético e método para manufaturar um sensor magnético

Country Status (7)

Country Link
US (2) US20090027048A1 (pt)
EP (1) EP1860451B1 (pt)
KR (1) KR100950615B1 (pt)
BR (1) BRPI0608019A2 (pt)
CA (1) CA2601130A1 (pt)
TW (3) TWI361503B (pt)
WO (1) WO2006098431A1 (pt)

Families Citing this family (84)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008270471A (ja) 2007-04-19 2008-11-06 Yamaha Corp 磁気センサ及びその製造方法
EP2003462B1 (en) * 2007-06-13 2010-03-17 Ricoh Company, Ltd. Magnetic sensor and production method thereof
JP5170679B2 (ja) * 2008-01-29 2013-03-27 日立金属株式会社 磁気センサおよび回転角度検出装置
DE102008041859A1 (de) 2008-09-08 2010-03-11 Robert Bosch Gmbh Magnetfeldsensoranordnung zur Messung von räumlichen Komponenten eines magnetischen Feldes
US8289019B2 (en) * 2009-02-11 2012-10-16 Infineon Technologies Ag Sensor
DE102009024268B4 (de) 2009-06-05 2015-03-05 Integrated Dynamics Engineering Gmbh Magnetfeldkompensation
KR101608339B1 (ko) * 2009-06-08 2016-04-11 삼성전자주식회사 위치 측정 장치 및 방법, 및 이동체
WO2011007767A1 (ja) 2009-07-13 2011-01-20 日立金属株式会社 磁気抵抗効果素子の製造方法、磁気センサ、回転角度検出装置
US8390283B2 (en) 2009-09-25 2013-03-05 Everspin Technologies, Inc. Three axis magnetic field sensor
FR2955942B1 (fr) 2010-01-29 2013-01-04 Centre Nat Rech Scient Magnetometre integre et son procede de fabrication
US20110234218A1 (en) * 2010-03-24 2011-09-29 Matthieu Lagouge Integrated multi-axis hybrid magnetic field sensor
US8518734B2 (en) 2010-03-31 2013-08-27 Everspin Technologies, Inc. Process integration of a single chip three axis magnetic field sensor
US8395381B2 (en) * 2010-07-09 2013-03-12 Invensense, Inc. Micromachined magnetic field sensors
US20120007597A1 (en) * 2010-07-09 2012-01-12 Invensense, Inc. Micromachined offset reduction structures for magnetic field sensing
US9645204B2 (en) 2010-09-17 2017-05-09 Industrial Technology Research Institute Magnetic field sensors and sensng circuits
US20120068698A1 (en) * 2010-09-17 2012-03-22 Industrial Technology Research Institute Structure of tmr and fabrication method of integrated 3-axis magnetic field sensor and sensing circuit
IT1403421B1 (it) 2010-12-23 2013-10-17 St Microelectronics Srl Sensore magnetoresistivo integrato, in particolare sensore magnetoresistivo triassiale e suo procedimento di fabbricazione
US9000763B2 (en) 2011-02-28 2015-04-07 Infineon Technologies Ag 3-D magnetic sensor
CN202013413U (zh) * 2011-04-06 2011-10-19 江苏多维科技有限公司 单一芯片桥式磁场传感器
JP2013016609A (ja) * 2011-07-04 2013-01-24 Alps Electric Co Ltd 磁気検出素子及びそれを用いた磁気センサ、並びに、磁気検出素子の製造方法
CN102426344B (zh) * 2011-08-30 2013-08-21 江苏多维科技有限公司 三轴磁场传感器
CN102385043B (zh) * 2011-08-30 2013-08-21 江苏多维科技有限公司 Mtj三轴磁场传感器及其封装方法
JP5464198B2 (ja) * 2011-11-24 2014-04-09 Ｔｄｋ株式会社 三次元磁界センサおよびその製造方法
CN102564383B (zh) * 2011-12-13 2014-06-18 北京东方计量测试研究所 基于轴面角确定三轴磁传感器轴间角的方法
US8957487B2 (en) 2012-01-04 2015-02-17 Industrial Technology Research Institute Tunneling magneto-resistor reference unit and magnetic field sensing circuit using the same
TWI452319B (zh) * 2012-01-09 2014-09-11 Voltafield Technology Corp 磁阻感測元件
US9116198B2 (en) * 2012-02-10 2015-08-25 Memsic, Inc. Planar three-axis magnetometer
DE102012204835A1 (de) * 2012-03-27 2013-10-02 Robert Bosch Gmbh Sensor, Verfahren zum Herstellen eines Sensors und Verfahren zum Montieren eines Sensors
US20130257423A1 (en) * 2012-04-03 2013-10-03 Isentek Inc. Hybrid magnetic sensor
KR101376541B1 (ko) * 2012-05-22 2014-03-19 조선대학교산학협력단 이종 자기 센서를 이용하는 결함 탐상 장치
US20140062470A1 (en) * 2012-08-29 2014-03-06 Meng-Huang Lai Three-dimensional in-plane magnetic sensor
JP2014089087A (ja) 2012-10-30 2014-05-15 Yamaha Corp オフセットキャンセル回路
TWI449939B (zh) * 2012-12-11 2014-08-21 Inst Information Industry 利用電磁鐵陣列以決定一電子裝置對應一物件之３ｄ位置的方法及系統
ITTO20121067A1 (it) 2012-12-12 2014-06-13 St Microelectronics Srl Sensore magnetoresistivo integrato in una piastrina per il rilevamento di campi magnetici perpendicolari alla piastrina nonche' suo procedimento di fabbricazione
US9244134B2 (en) * 2013-01-15 2016-01-26 Infineon Technologies Ag XMR-sensor and method for manufacturing the XMR-sensor
US9297863B2 (en) * 2013-03-15 2016-03-29 Meng-Huang Lai Planarized three-dimensional (3D) magnetic sensor chip
TWI513993B (zh) 2013-03-26 2015-12-21 Ind Tech Res Inst 三軸磁場感測器、製作磁場感測結構的方法與磁場感測電路
US9377327B2 (en) * 2013-06-28 2016-06-28 Analog Devices Global Magnetic field direction sensor
TWI493209B (zh) * 2013-07-05 2015-07-21 Voltafield Technology Corp 一種單晶片三軸磁阻感測裝置
DE102013107821A1 (de) * 2013-07-22 2015-01-22 Sensitec Gmbh Mehrkomponenten-Magnetfeldsensor
DE102014202770B4 (de) * 2014-02-14 2019-04-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. 3d magnetfeldsensor und verfahren zu dessen herstellung
CN104197828B (zh) * 2014-08-20 2017-07-07 江苏多维科技有限公司 一种单芯片偏轴磁电阻z‑x角度传感器和测量仪
US10288697B2 (en) 2015-01-13 2019-05-14 Stmicroelectronics S.R.L. AMR-type integrated magnetoresistive sensor for detecting magnetic fields perpendicular to the chip
CN104596605B (zh) 2015-02-04 2019-04-26 江苏多维科技有限公司 一种磁自动化流量记录器
EP3264123B1 (en) * 2015-02-12 2024-07-24 Alps Alpine Co., Ltd. Magnetometric sensor and current sensor
US9778324B2 (en) 2015-04-17 2017-10-03 Apple Inc. Yoke configuration to reduce high offset in X-, Y-, and Z-magnetic sensors
US10317285B2 (en) * 2015-07-13 2019-06-11 The Boeing Company System and method for measuring optical resolution with an optical resolution target assembly
WO2017023235A1 (en) * 2015-07-31 2017-02-09 Compagnie Generale Des Etablissements Michelin Device and method for inspection of polymeric material with ferrous reinforcement
JP6503089B2 (ja) 2015-12-03 2019-04-17 アルプスアルパイン株式会社 磁気検知装置およびその製造方法
US9841469B2 (en) 2016-01-26 2017-12-12 Nxp Usa, Inc. Magnetic field sensor with multiple sense layer magnetization orientations
US9897667B2 (en) 2016-01-26 2018-02-20 Nxp Usa, Inc. Magnetic field sensor with permanent magnet biasing
US10545196B2 (en) * 2016-03-24 2020-01-28 Nxp Usa, Inc. Multiple axis magnetic sensor
US10145907B2 (en) 2016-04-07 2018-12-04 Nxp Usa, Inc. Magnetic field sensor with permanent magnet biasing
US9933496B2 (en) 2016-04-21 2018-04-03 Nxp Usa, Inc. Magnetic field sensor with multiple axis sense capability
CN109152545A (zh) * 2016-05-09 2019-01-04 生物磁场有限公司 生物磁场测量装置
US11647678B2 (en) 2016-08-23 2023-05-09 Analog Devices International Unlimited Company Compact integrated device packages
US10697800B2 (en) * 2016-11-04 2020-06-30 Analog Devices Global Multi-dimensional measurement using magnetic sensors and related systems, methods, and integrated circuits
US11628275B2 (en) 2018-01-31 2023-04-18 Analog Devices, Inc. Electronic devices
US10753989B2 (en) * 2018-08-27 2020-08-25 Allegro Microsystems, Llc Magnetoresistance element with perpendicular or parallel magnetic anistropy
JP6986002B2 (ja) 2018-11-26 2021-12-22 Tdk株式会社 磁気センサ装置
JP7455511B2 (ja) * 2019-02-25 2024-03-26 Tdk株式会社 磁気センサ及びその製造方法
JP6886222B2 (ja) * 2019-03-19 2021-06-16 Tdk株式会社 磁気センサ
JP6984792B2 (ja) 2019-06-11 2021-12-22 株式会社村田製作所 磁気センサ、磁気センサアレイ、磁場分布測定装置、および位置特定装置
JP7070532B2 (ja) 2019-11-19 2022-05-18 Tdk株式会社 磁気センサ
CN110927637A (zh) * 2019-11-30 2020-03-27 北京航空航天大学青岛研究院 一种三轴mtj磁场传感器及其制备方法
US11719772B2 (en) 2020-04-01 2023-08-08 Analog Devices International Unlimited Company AMR (XMR) sensor with increased linear range
RU2746309C1 (ru) * 2020-09-07 2021-04-12 Общество С Ограниченной Ответственностью "Крокус Наноэлектроника" (Ооо "Крокус Наноэлектроника") Магниточувствительный сенсор со сниженным показателем коэрцитивной силы (варианты)
EP3992655A1 (en) * 2020-11-03 2022-05-04 Crocus Technology S.A. Magnetoresistive sensor element having a wide linear response and robust nominal performance and manufacturing method thereof
US11630168B2 (en) * 2021-02-03 2023-04-18 Allegro Microsystems, Llc Linear sensor with dual spin valve element having reference layers with magnetization directions different from an external magnetic field direction
CN112995861B (zh) * 2021-03-01 2022-12-23 歌尔微电子股份有限公司 传感器和电子设备
US11493567B2 (en) 2021-03-31 2022-11-08 Tdk Corporation Magnetic sensor device and magnetic sensor system
JP7332738B2 (ja) 2021-07-08 2023-08-23 Tdk株式会社 磁気センサ装置および磁気センサシステム
US12498433B2 (en) 2021-09-21 2025-12-16 Tdk Corporation Sensor
US11971461B2 (en) 2021-09-21 2024-04-30 Tdk Corporation Sensor having protruding surface
DE102022124051A1 (de) * 2021-09-21 2023-03-23 Tdk Corporation Magnetsensor
CN114220913A (zh) * 2021-12-01 2022-03-22 上海矽睿科技股份有限公司 一种三轴磁传感器及其制备工艺
CN114675215B (zh) * 2022-03-21 2024-12-27 华中科技大学 一种纯电操控纳米三维磁传感器及其阵列与磁场测量方法
US11719771B1 (en) 2022-06-02 2023-08-08 Allegro Microsystems, Llc Magnetoresistive sensor having seed layer hysteresis suppression
US12320870B2 (en) 2022-07-19 2025-06-03 Allegro Microsystems, Llc Controlling out-of-plane anisotropy in an MR sensor with free layer dusting
WO2024189764A1 (ja) * 2023-03-14 2024-09-19 三菱電機株式会社 電流センサ
US12591026B2 (en) 2023-06-13 2026-03-31 Allegro Microsystems, Llc Tunnel magnetoresistance element to detect out-of-plane changes in a magnetic field intensity of a magnetic field
US12347595B2 (en) 2023-06-13 2025-07-01 Allegro Microsystems, Llc Magnetoresistance element including a skyrmion layer and a vortex layer that are magnetically coupled to each other
DE102023212076A1 (de) * 2023-12-01 2025-06-05 Robert Bosch Gesellschaft mit beschränkter Haftung Magnetoresistive Erfassungsvorrichtung
US20260063733A1 (en) * 2024-08-28 2026-03-05 Allegro Microsystems, Llc Magnetic sensor having sensing elements on sloped substrate

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4385975A (en) * 1981-12-30 1983-05-31 International Business Machines Corp. Method of forming wide, deep dielectric filled isolation trenches in the surface of a silicon semiconductor substrate
US5247278A (en) * 1991-11-26 1993-09-21 Honeywell Inc. Magnetic field sensing device
JPH11305055A (ja) * 1998-04-22 1999-11-05 Sharp Corp 光導波路の製造方法及び光導波路製造のためのマスタ原板の製造方法
US6344951B1 (en) * 1998-12-14 2002-02-05 Alps Electric Co., Ltd. Substrate having magnetoresistive elements and monitor element capable of preventing a short circuit
JP3498737B2 (ja) * 2001-01-24 2004-02-16 ヤマハ株式会社 磁気センサの製造方法
JP3971934B2 (ja) * 2001-03-07 2007-09-05 ヤマハ株式会社 磁気センサとその製法
JP3835354B2 (ja) * 2001-10-29 2006-10-18 ヤマハ株式会社 磁気センサ
JP4085859B2 (ja) * 2002-03-27 2008-05-14 ヤマハ株式会社 磁気センサおよびその製造方法
JP4177032B2 (ja) * 2002-06-04 2008-11-05 株式会社ワコー 三次元磁気センサおよびその製造方法
JP4016857B2 (ja) * 2002-10-18 2007-12-05 ヤマハ株式会社 磁気センサ及びその製造方法
JP3835447B2 (ja) * 2002-10-23 2006-10-18 ヤマハ株式会社 磁気センサ、同磁気センサの製造方法及び同製造方法に適したマグネットアレイ
ATE495458T1 (de) * 2002-11-29 2011-01-15 Yamaha Corp Magnetsensor und verfahren zur kompensation temperaturabhängiger eigenschaften desselben
JP4050631B2 (ja) * 2003-02-21 2008-02-20 株式会社ルネサステクノロジ 電子デバイスの製造方法
EP1498744B1 (en) * 2003-07-18 2011-08-10 Yamaha Corporation Magnetic sensor and manufacturing method therefor
US7271586B2 (en) * 2003-12-04 2007-09-18 Honeywell International Inc. Single package design for 3-axis magnetic sensor
US7126330B2 (en) * 2004-06-03 2006-10-24 Honeywell International, Inc. Integrated three-dimensional magnetic sensing device and method to fabricate an integrated three-dimensional magnetic sensing device
US7687284B2 (en) * 2005-01-13 2010-03-30 Yamaha Corporation Magnetic sensor and manufacturing method therefor
EP1860450B1 (en) * 2005-03-17 2011-06-08 Yamaha Corporation Magnetic sensor and manufacturing method thereof

Also Published As

Publication number Publication date
KR100950615B1 (ko) 2010-04-01
EP1860451A4 (en) 2010-11-10
TWI361503B (en) 2012-04-01
TW200901527A (en) 2009-01-01
KR20070104659A (ko) 2007-10-26
US20120268113A1 (en) 2012-10-25
EP1860451B1 (en) 2012-06-27
WO2006098431A1 (ja) 2006-09-21
TW200707816A (en) 2007-02-16
US20090027048A1 (en) 2009-01-29
TWI307977B (en) 2009-03-21
CA2601130A1 (en) 2006-09-21
EP1860451A1 (en) 2007-11-28
TW200849684A (en) 2008-12-16
TWI360243B (en) 2012-03-11

Similar Documents

Publication Publication Date Title
BRPI0608019A2 (pt) sensor magnético e método para manufaturar um sensor magnético
TW200604552A (en) Method for manufacturing magnetic sensor, magnet array used in the method, and method for manufacturing the magnet array
US11536779B2 (en) Magnetoresistive Z-axis gradient sensor chip
EP1915774A4 (en) PRINTABLE SEMICONDUCTOR STRUCTURES AND RELATED METHOD OF MANUFACTURING AND ASSEMBLING
ATE550628T1 (de) Corioliskreisel
TW200626922A (en) Magnetic sensor using giant magnetoresistive elements and method for manufacturing the same
JP2014503057A5 (pt)
JP2012251801A5 (pt)
BR112012012121A2 (pt) dispositivo de montagem de um esboço não vulcanizado do topo de um pneumático e processo de montagem de tal dispositivo.
JP2013062017A5 (pt)
JP2017132441A5 (pt)
ATE467845T1 (de) Sensor
KASHIF et al. Curvature and Weyl collineations of spacetimes
JP2013029522A5 (pt)
FI20055485L (fi) Suojaelementti ja järjestely magneettikenttien vähentämiseksi
TH101836S (th) ลวดลายบนผ้า
TH99411S (th) โต๊ะ
TH94178S (th) ลวดลายบนแบบพับกล่อง
TH94993S (th) ลวดลายบนแบบพับกล่อง
TH92567S (th) อิฐบล็อก
JP2020045670A5 (pt)
TH103703S (th) บล๊อกสำเร็จรูป
TH103702S (th) บล๊อกสำเร็จรูป
TH103701S (th) บล๊อกสำเร็จรูป
TH110340S (th) อุปกรณ์จับยึด

Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 9A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2307 DE 24/03/2015.