BRPI0612113A2 - embalagem para pelo menos um dispositivo semicondutor, subconjunto, e, métodos para fabricar um subconjunto e para fabricar uma embalagem - Google Patents

embalagem para pelo menos um dispositivo semicondutor, subconjunto, e, métodos para fabricar um subconjunto e para fabricar uma embalagem

Info

Publication number
BRPI0612113A2
BRPI0612113A2 BRPI0612113A BRPI0612113A BRPI0612113A2 BR PI0612113 A2 BRPI0612113 A2 BR PI0612113A2 BR PI0612113 A BRPI0612113 A BR PI0612113A BR PI0612113 A BRPI0612113 A BR PI0612113A BR PI0612113 A2 BRPI0612113 A2 BR PI0612113A2
Authority
BR
Brazil
Prior art keywords
subset
making
packaging
package
methods
Prior art date
Application number
BRPI0612113A
Other languages
English (en)
Inventor
Eduard J Meijer
Ronald Dekker
Theodorus M Michielsen
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of BRPI0612113A2 publication Critical patent/BRPI0612113A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
BRPI0612113A 2005-06-29 2006-06-22 embalagem para pelo menos um dispositivo semicondutor, subconjunto, e, métodos para fabricar um subconjunto e para fabricar uma embalagem BRPI0612113A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05105830 2005-06-29
PCT/IB2006/052034 WO2007000695A2 (en) 2005-06-29 2006-06-22 Package, subassembly and methods of manufacturing thereof

Publications (1)

Publication Number Publication Date
BRPI0612113A2 true BRPI0612113A2 (pt) 2016-09-06

Family

ID=37308790

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0612113A BRPI0612113A2 (pt) 2005-06-29 2006-06-22 embalagem para pelo menos um dispositivo semicondutor, subconjunto, e, métodos para fabricar um subconjunto e para fabricar uma embalagem

Country Status (7)

Country Link
US (1) US20090127702A1 (pt)
EP (1) EP1900023A2 (pt)
JP (1) JP2008545263A (pt)
CN (1) CN101213661A (pt)
BR (1) BRPI0612113A2 (pt)
TW (1) TW200707677A (pt)
WO (1) WO2007000695A2 (pt)

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WO2009101551A1 (en) * 2008-02-12 2009-08-20 Koninklijke Philips Electronics N.V. Light emitting device
DE102008049777A1 (de) * 2008-05-23 2009-11-26 Osram Opto Semiconductors Gmbh Optoelektronisches Modul
GB2464916B (en) 2008-10-21 2013-07-31 Iti Scotland Ltd Light Guides
GB2475511A (en) * 2009-11-20 2011-05-25 Iti Scotland Ltd Light guide with heat sink
US9164223B2 (en) * 2009-03-05 2015-10-20 Iti Scotland Limited Light guides
GB2475738A (en) * 2009-11-30 2011-06-01 Iti Scotland Ltd Light guide with heat sink
GB2468411A (en) * 2009-03-05 2010-09-08 Iti Scotland Ltd Light guide with heat sink
GB2475510A (en) * 2009-11-20 2011-05-25 Iti Scotland Ltd Light guides
CN102194962A (zh) * 2010-03-04 2011-09-21 展晶科技(深圳)有限公司 侧向发光之半导体组件封装结构
JP5398644B2 (ja) * 2010-06-07 2014-01-29 株式会社東芝 半導体発光装置を用いた光源装置
EP3118853B1 (en) * 2011-06-27 2018-06-06 Thin Film Electronics ASA Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate
CN106876398B (zh) 2011-06-27 2020-10-20 薄膜电子有限公司 含横向尺寸改变吸收缓冲层的铁电存储单元及其制造方法
TWI484674B (zh) * 2011-12-08 2015-05-11 新世紀光電股份有限公司 電子元件
DE102012213343B4 (de) * 2012-07-30 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung VERFAHREN ZUM HERSTELLEN EINES OPTOELEKTRONISCHES HALBLEITERBAUTEILs MIT SAPHIR-FLIP-CHIP
JP5592963B2 (ja) * 2013-01-30 2014-09-17 株式会社東芝 半導体発光装置を用いた光源装置
CN105027278A (zh) * 2013-03-07 2015-11-04 住友电木株式会社 装置、粘合剂用组合物、粘合片
DE112013007281B4 (de) * 2013-07-29 2021-07-01 Epistar Corporation Verfahren zum selektiven Transferieren von Halbleitervorrichtungen
US20150221570A1 (en) * 2014-02-04 2015-08-06 Amkor Technology, Inc. Thin sandwich embedded package
JP6519311B2 (ja) 2014-06-27 2019-05-29 日亜化学工業株式会社 発光装置
DE102014110008A1 (de) * 2014-07-16 2016-01-21 Infineon Technologies Ag Träger, Halbleitermodul und Verfahren zu deren Herstellung
US10847469B2 (en) * 2016-04-26 2020-11-24 Cubic Corporation CTE compensation for wafer-level and chip-scale packages and assemblies
WO2016161161A1 (en) 2015-03-31 2016-10-06 Cree, Inc. Light emitting diodes and methods with encapsulation
US12364074B2 (en) * 2015-03-31 2025-07-15 Creeled, Inc. Light emitting diodes and methods
DE102016103585B4 (de) * 2016-02-29 2022-01-13 Infineon Technologies Ag Verfahren zum Herstellen eines Package mit lötbarem elektrischen Kontakt
JP6555247B2 (ja) * 2016-12-28 2019-08-07 日亜化学工業株式会社 発光装置及びその製造方法
US10332899B2 (en) * 2017-09-29 2019-06-25 Intel Corporation 3D package having edge-aligned die stack with direct inter-die wire connections
US10453827B1 (en) 2018-05-30 2019-10-22 Cree, Inc. LED apparatuses and methods
CN111211116B (zh) * 2018-11-21 2022-03-01 欣兴电子股份有限公司 发光二极管封装及其制作方法
TWI703685B (zh) 2018-11-21 2020-09-01 欣興電子股份有限公司 發光二極體封裝及其製作方法
WO2021087726A1 (zh) * 2019-11-05 2021-05-14 京东方科技集团股份有限公司 一种阵列基板及其制作方法、显示装置
CN112786462B (zh) * 2020-12-25 2023-08-22 上海易卜半导体有限公司 半导体封装方法、半导体组件以及包含其的电子设备
CN116565105B (zh) * 2023-07-04 2024-01-30 惠科股份有限公司 发光芯片的转移方法、发光结构和显示面板

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Publication number Priority date Publication date Assignee Title
JP3156896B2 (ja) * 1994-01-28 2001-04-16 富士通株式会社 半導体装置の製造方法およびかかる製造方法により製造された半導体装置
JP3792954B2 (ja) * 1999-08-10 2006-07-05 株式会社東芝 半導体装置の製造方法
US6486499B1 (en) * 1999-12-22 2002-11-26 Lumileds Lighting U.S., Llc III-nitride light-emitting device with increased light generating capability
JP3788268B2 (ja) * 2001-05-14 2006-06-21 ソニー株式会社 半導体装置の製造方法
US6878608B2 (en) * 2001-05-31 2005-04-12 International Business Machines Corporation Method of manufacture of silicon based package
US7189595B2 (en) * 2001-05-31 2007-03-13 International Business Machines Corporation Method of manufacture of silicon based package and devices manufactured thereby
TW577178B (en) * 2002-03-04 2004-02-21 United Epitaxy Co Ltd High efficient reflective metal layer of light emitting diode
JP4329368B2 (ja) * 2002-03-28 2009-09-09 セイコーエプソン株式会社 半導体装置及びその製造方法
US7268012B2 (en) * 2004-08-31 2007-09-11 Micron Technology, Inc. Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
US7098070B2 (en) * 2004-11-16 2006-08-29 International Business Machines Corporation Device and method for fabricating double-sided SOI wafer scale package with through via connections
US7855397B2 (en) * 2007-09-14 2010-12-21 Nextreme Thermal Solutions, Inc. Electronic assemblies providing active side heat pumping

Also Published As

Publication number Publication date
CN101213661A (zh) 2008-07-02
WO2007000695A2 (en) 2007-01-04
EP1900023A2 (en) 2008-03-19
US20090127702A1 (en) 2009-05-21
WO2007000695A3 (en) 2007-04-12
TW200707677A (en) 2007-02-16
JP2008545263A (ja) 2008-12-11

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Legal Events

Date Code Title Description
B06G Technical and formal requirements: other requirements [chapter 6.7 patent gazette]

Free format text: SOLICITA-SE A REGULARIZACAO DA PROCURACAO, UMA VEZ QUE BASEADO NO ARTIGO 216 PAR 1O DA LPI, O DOCUMENTO DE PROCURACAO DEVE SER APRESENTADO NO ORIGINAL, TRASLADO OU FOTOCOPIA AUTENTICADA.

B11Z Dismissal: petition dismissal - article 216, par 2 of industrial property law

Free format text: REFERENTE A PETICAO NO 20070184593/RJ DE 27/12/2007.

B06H Technical and formal requirements: requirement cancelled [chapter 6.8 patent gazette]

Free format text: O DESPACHO 6.7 ESTA SENDO ANULADO TENDO POR BASE A DETERMINACAO DO DIRETOR DE PATENTES, A QUAL E CALCADA NO PARECER NO 0003-2014 AGU/PGF/PFE/INPI/COOPHI-LBC-1.0.

B11M Decision cancelled [chapter 11.13 patent gazette]

Free format text: O DESPACHO 11.6.1 ESTA SENDO ANULADO TENDO POR BASE A DETERMINACAO DO DIRETOR DE PATENTES, A QUAL E CALCADA NO PARECER NO 0003-2014 AGU/PGF/PFE/INPI/COOPHI-LBC-1.0.

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]