BRPI0614704A2 - métodos para fabricar um capacitor que resiste a danos termicamente induzidos, para reduzir danos termicamente induzidos em um capacitor de filme metalizado, e para produzir um capacitor com eletrodos de extremidade de metal conectados em um filme metalizado enrolado - Google Patents
métodos para fabricar um capacitor que resiste a danos termicamente induzidos, para reduzir danos termicamente induzidos em um capacitor de filme metalizado, e para produzir um capacitor com eletrodos de extremidade de metal conectados em um filme metalizado enrolado Download PDFInfo
- Publication number
- BRPI0614704A2 BRPI0614704A2 BRPI0614704-6A BRPI0614704A BRPI0614704A2 BR PI0614704 A2 BRPI0614704 A2 BR PI0614704A2 BR PI0614704 A BRPI0614704 A BR PI0614704A BR PI0614704 A2 BRPI0614704 A2 BR PI0614704A2
- Authority
- BR
- Brazil
- Prior art keywords
- capacitor
- induced damage
- thermally induced
- metallized film
- methods
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 8
- 238000000034 method Methods 0.000 title abstract 3
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000011104 metalized film Substances 0.000 title 2
- 239000002184 metal Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49128—Assembling formed circuit to base
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
MéTODOS PARA FABRICAR UM CAPACITOR QUE RESISTE A DANOS TERMICAMENTE INDUZIDOS, PARA REDUZIR DANOS TERMICAMENTE INDUZIDOS EM UM CAPACITOR DE FILME METALIZADO, E PARA PRODUZIR UM CAPACITOR COM ELETRODOS DE EXTREMIDADE DE METAL CONECTADOS EM UMFILME METALIZADO ENROLADO. é descrita uma modalidade exemplar que proporciona uma ou mais melhorias, que inclui um capacitor com um eletrodo de extremidade segmentado e métodos para segmentar um eletrodo de extremidade de um capacitor para reduzir ou eliminar casos de danos termicamente induzidos do capacitor.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US59578305P | 2005-08-05 | 2005-08-05 | |
| US11/495,447 US7453114B2 (en) | 2005-08-05 | 2006-07-28 | Segmented end electrode capacitor and method of segmenting an end electrode of a capacitor |
| PCT/US2006/030593 WO2007019383A1 (en) | 2005-08-05 | 2006-08-03 | Thermally induced damage resistive capacitor and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0614704A2 true BRPI0614704A2 (pt) | 2011-08-30 |
Family
ID=37717425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0614704-6A BRPI0614704A2 (pt) | 2005-08-05 | 2006-08-03 | métodos para fabricar um capacitor que resiste a danos termicamente induzidos, para reduzir danos termicamente induzidos em um capacitor de filme metalizado, e para produzir um capacitor com eletrodos de extremidade de metal conectados em um filme metalizado enrolado |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US7453114B2 (pt) |
| EP (1) | EP1913609B1 (pt) |
| JP (1) | JP5060481B2 (pt) |
| KR (1) | KR101271436B1 (pt) |
| CN (1) | CN101258568B (pt) |
| BR (1) | BRPI0614704A2 (pt) |
| CA (1) | CA2617785C (pt) |
| IL (1) | IL189223A (pt) |
| WO (1) | WO2007019383A1 (pt) |
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| US8744384B2 (en) * | 2000-07-20 | 2014-06-03 | Blackberry Limited | Tunable microwave devices with auto-adjusting matching circuit |
| US8064188B2 (en) | 2000-07-20 | 2011-11-22 | Paratek Microwave, Inc. | Optimized thin film capacitors |
| US9406444B2 (en) | 2005-11-14 | 2016-08-02 | Blackberry Limited | Thin film capacitors |
| US7869186B2 (en) * | 2005-11-14 | 2011-01-11 | Paratek Microwave, Inc. | High Q and low stress capacitor electrode array |
| US7711337B2 (en) | 2006-01-14 | 2010-05-04 | Paratek Microwave, Inc. | Adaptive impedance matching module (AIMM) control architectures |
| US7535312B2 (en) | 2006-11-08 | 2009-05-19 | Paratek Microwave, Inc. | Adaptive impedance matching apparatus, system and method with improved dynamic range |
| US7714676B2 (en) | 2006-11-08 | 2010-05-11 | Paratek Microwave, Inc. | Adaptive impedance matching apparatus, system and method |
| US7917104B2 (en) | 2007-04-23 | 2011-03-29 | Paratek Microwave, Inc. | Techniques for improved adaptive impedance matching |
| US8213886B2 (en) | 2007-05-07 | 2012-07-03 | Paratek Microwave, Inc. | Hybrid techniques for antenna retuning utilizing transmit and receive power information |
| US7991363B2 (en) | 2007-11-14 | 2011-08-02 | Paratek Microwave, Inc. | Tuning matching circuits for transmitter and receiver bands as a function of transmitter metrics |
| US8072285B2 (en) | 2008-09-24 | 2011-12-06 | Paratek Microwave, Inc. | Methods for tuning an adaptive impedance matching network with a look-up table |
| CN102449065B (zh) | 2009-05-26 | 2014-03-05 | 帝人化成株式会社 | 阻燃性树脂组合物及用它制成的成型品 |
| US8451133B2 (en) * | 2009-08-07 | 2013-05-28 | Electronic Concepts, Inc. | Large current carrying capacitor having a thermal disconnect with a light indicator |
| US8472888B2 (en) | 2009-08-25 | 2013-06-25 | Research In Motion Rf, Inc. | Method and apparatus for calibrating a communication device |
| US9026062B2 (en) | 2009-10-10 | 2015-05-05 | Blackberry Limited | Method and apparatus for managing operations of a communication device |
| US8803631B2 (en) | 2010-03-22 | 2014-08-12 | Blackberry Limited | Method and apparatus for adapting a variable impedance network |
| WO2011133657A2 (en) | 2010-04-20 | 2011-10-27 | Paratek Microwave, Inc. | Method and apparatus for managing interference in a communication device |
| US9379454B2 (en) | 2010-11-08 | 2016-06-28 | Blackberry Limited | Method and apparatus for tuning antennas in a communication device |
| US8712340B2 (en) | 2011-02-18 | 2014-04-29 | Blackberry Limited | Method and apparatus for radio antenna frequency tuning |
| US8655286B2 (en) | 2011-02-25 | 2014-02-18 | Blackberry Limited | Method and apparatus for tuning a communication device |
| US8594584B2 (en) | 2011-05-16 | 2013-11-26 | Blackberry Limited | Method and apparatus for tuning a communication device |
| US9769826B2 (en) | 2011-08-05 | 2017-09-19 | Blackberry Limited | Method and apparatus for band tuning in a communication device |
| US8948889B2 (en) | 2012-06-01 | 2015-02-03 | Blackberry Limited | Methods and apparatus for tuning circuit components of a communication device |
| US9350405B2 (en) | 2012-07-19 | 2016-05-24 | Blackberry Limited | Method and apparatus for antenna tuning and power consumption management in a communication device |
| PT2654051E (pt) * | 2012-07-27 | 2015-10-01 | Rtr En S L | Condensador trifásico formado por dois cilindros alinhados com desconexão por sobrepressão |
| US9374113B2 (en) | 2012-12-21 | 2016-06-21 | Blackberry Limited | Method and apparatus for adjusting the timing of radio antenna tuning |
| US10404295B2 (en) | 2012-12-21 | 2019-09-03 | Blackberry Limited | Method and apparatus for adjusting the timing of radio antenna tuning |
| US20140226259A1 (en) * | 2013-02-13 | 2014-08-14 | Sbe, Inc. | Mitigating the Effects of Cracks in Metallized Polymer Film Capacitor Arc-Sprayed End Connections |
| EP2983183A1 (en) * | 2014-08-07 | 2016-02-10 | Siemens Aktiengesellschaft | Film capacitor for high ambient pressure |
| JP6458444B2 (ja) * | 2014-10-21 | 2019-01-30 | 株式会社デンソー | 電力変換装置 |
| US9831035B2 (en) * | 2014-10-31 | 2017-11-28 | Deere & Company | Capacitor with improved heat dissipation |
| US9438319B2 (en) | 2014-12-16 | 2016-09-06 | Blackberry Limited | Method and apparatus for antenna selection |
| US9722531B2 (en) | 2015-05-22 | 2017-08-01 | Deere & Company | Electronic inverter assembly with an integral snubber capacitor |
| US9490555B1 (en) * | 2015-05-22 | 2016-11-08 | Deere & Company | System or connector for voltage bus structures |
| US9979320B2 (en) | 2016-08-26 | 2018-05-22 | Deere & Company | Electronic inverter assembly |
| CN110763357A (zh) * | 2019-11-08 | 2020-02-07 | 江苏科技大学 | 一种电容式温度传感器及使用方法 |
| CN114914089A (zh) * | 2021-02-08 | 2022-08-16 | 日月光半导体制造股份有限公司 | 电容器结构 |
| CN113555225B (zh) * | 2021-07-22 | 2023-04-07 | 广州巨湾技研有限公司 | 一种管式多层结构超级电容器及其制备方法 |
| DE102024205056A1 (de) * | 2024-05-31 | 2025-12-04 | Robert Bosch Gesellschaft mit beschränkter Haftung | Folienkondensator |
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| JPS59144117A (ja) * | 1983-02-07 | 1984-08-18 | 松下電器産業株式会社 | フイルムコンデンサの電極装置 |
| JPS59215715A (ja) * | 1983-05-23 | 1984-12-05 | マルコン電子株式会社 | 積層形フイルムコンデンサの製造方法 |
| JPS6194332U (pt) * | 1984-11-26 | 1986-06-18 | ||
| DE3873206D1 (de) * | 1987-07-31 | 1992-09-03 | Siemens Ag | Fuellschichtbauteil mit einem gesinterten, monolithischen keramikkoerper und verfahren zu dessen herstellung. |
| JPH0770425B2 (ja) * | 1987-09-18 | 1995-07-31 | 松下電器産業株式会社 | コンデンサの製造方法 |
| JPH02121320A (ja) * | 1988-10-29 | 1990-05-09 | Matsushita Electric Ind Co Ltd | 複合金属化コンデンサ |
| JPH0888144A (ja) * | 1994-09-14 | 1996-04-02 | Nitsuko Corp | チップ形フィルムコンデンサ |
| DE69936008T2 (de) * | 1998-01-07 | 2008-01-10 | Tdk Corp. | Keramischer Kondensator |
| JP2001076966A (ja) * | 1999-09-08 | 2001-03-23 | Soshin Electric Co Ltd | 油含浸型フィルムコンデンサ。 |
| JP2001126948A (ja) * | 1999-11-01 | 2001-05-11 | Soshin Electric Co Ltd | 水冷式フィルムコンデンサ。 |
| SE515930C2 (sv) * | 2000-01-26 | 2001-10-29 | Abb Ab | Kondensator och förfarande för att vid ett kondensatorelement elektriskt sammanbinda elektrodskikt med en anslutningspunkt |
| JP2002057063A (ja) * | 2000-08-11 | 2002-02-22 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
| US6605551B2 (en) * | 2000-12-08 | 2003-08-12 | Intel Corporation | Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance |
| US6477035B1 (en) * | 2001-10-10 | 2002-11-05 | Lockheed Martin Corporation | Integrally formed energy storage device and method of fabrication |
| JP2005136132A (ja) * | 2003-10-30 | 2005-05-26 | Tdk Corp | 積層コンデンサ |
-
2006
- 2006-07-28 US US11/495,447 patent/US7453114B2/en active Active
- 2006-08-03 CN CN2006800324945A patent/CN101258568B/zh not_active Expired - Fee Related
- 2006-08-03 BR BRPI0614704-6A patent/BRPI0614704A2/pt not_active IP Right Cessation
- 2006-08-03 WO PCT/US2006/030593 patent/WO2007019383A1/en not_active Ceased
- 2006-08-03 EP EP06800829.1A patent/EP1913609B1/en active Active
- 2006-08-03 CA CA2617785A patent/CA2617785C/en not_active Expired - Fee Related
- 2006-08-03 JP JP2008525255A patent/JP5060481B2/ja not_active Expired - Fee Related
- 2006-08-03 KR KR1020087003001A patent/KR101271436B1/ko not_active Expired - Fee Related
-
2008
- 2008-02-03 IL IL189223A patent/IL189223A/en not_active IP Right Cessation
- 2008-10-01 US US12/243,777 patent/US7655530B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007019383A1 (en) | 2007-02-15 |
| WO2007019383A9 (en) | 2008-07-17 |
| KR20080031943A (ko) | 2008-04-11 |
| US7655530B2 (en) | 2010-02-02 |
| CN101258568B (zh) | 2011-03-23 |
| EP1913609B1 (en) | 2016-04-13 |
| EP1913609A4 (en) | 2012-04-25 |
| JP5060481B2 (ja) | 2012-10-31 |
| IL189223A0 (en) | 2008-11-03 |
| US20090031543A1 (en) | 2009-02-05 |
| US20070030624A1 (en) | 2007-02-08 |
| KR101271436B1 (ko) | 2013-06-05 |
| JP2009503911A (ja) | 2009-01-29 |
| EP1913609A1 (en) | 2008-04-23 |
| IL189223A (en) | 2012-06-28 |
| CN101258568A (zh) | 2008-09-03 |
| CA2617785A1 (en) | 2007-02-15 |
| CA2617785C (en) | 2014-05-06 |
| US7453114B2 (en) | 2008-11-18 |
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| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
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| B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2317 DE 02-06-2015 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |