BRPI0618408A2 - método de refrigeração por fluxo redundante de ar para eletrÈnica de alta confiabilidade - Google Patents
método de refrigeração por fluxo redundante de ar para eletrÈnica de alta confiabilidade Download PDFInfo
- Publication number
- BRPI0618408A2 BRPI0618408A2 BRPI0618408-1A BRPI0618408A BRPI0618408A2 BR PI0618408 A2 BRPI0618408 A2 BR PI0618408A2 BR PI0618408 A BRPI0618408 A BR PI0618408A BR PI0618408 A2 BRPI0618408 A2 BR PI0618408A2
- Authority
- BR
- Brazil
- Prior art keywords
- mounting chassis
- modular mounting
- partition
- high reliability
- cooling method
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title abstract 4
- 238000005192 partition Methods 0.000 abstract 6
- 239000003380 propellant Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Método de refrigeração por fluxo redundante de ar para eletrónica de alta confiabilidade. Uma montagem eletrónica de sistema de refrigeração que inclui um chassis modular de montagem que possui uma divisória de chassis modular de montagem. O sistema conduz energia térmica a partir da parte frontal do chassis modular de montagem até a parte posterior do chassis modular de montagem, e direciona o fluxo de ar propelido pelo primeiro propulsor de ar através da divisória do chassis modular de montagem em frente à divisória do chassis modular de montagem com o propósito de resfriar a montagem eletrónica por meio de transferéncia de calor por convecção. O sistema direciona o fluxo de ar propelido pelo segundo propulsor, através da divisória do chassis modular de montagem na parte posterior da divisória do chassis modular de montagem, com o propósito de transferir a energia térmica conduzida a partir da montagem eletrónica da parte frontal da divisória do chassis modular de montagem para a parte posterior da divisória do chassis modular de montagem até o fluxo de ar propelido pelo segundo propulsor de ar por meio de transferência condutiva de calor, de forma a resfriar a montagem eletrónica.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/249,263 US7307840B2 (en) | 2005-10-14 | 2005-10-14 | Cross-flow redundant air cooling method for high reliability electronics |
| PCT/US2006/039919 WO2007047388A2 (en) | 2005-10-14 | 2006-10-16 | Cross-flow redundant air cooling method for high reliability electronics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0618408A2 true BRPI0618408A2 (pt) | 2011-08-30 |
| BRPI0618408B1 BRPI0618408B1 (pt) | 2018-09-11 |
Family
ID=37890230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0618408A BRPI0618408B1 (pt) | 2005-10-14 | 2006-10-16 | montagem de sistema de refrigeração de montagem eletrônica, veículo aéreo e método para proporcionar refrigeração redundante de uma montagem eletrônica |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7307840B2 (pt) |
| EP (1) | EP1938678B1 (pt) |
| JP (1) | JP5021657B2 (pt) |
| CN (1) | CN101288356B (pt) |
| BR (1) | BRPI0618408B1 (pt) |
| CA (1) | CA2624745C (pt) |
| DE (1) | DE602006015077D1 (pt) |
| WO (1) | WO2007047388A2 (pt) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080047688A1 (en) * | 2006-08-28 | 2008-02-28 | Airbus Deutschland Gmbh | Cooling System And Cooling Method For Cooling Components Of A Power Electronics |
| FR2910227A1 (fr) * | 2006-12-18 | 2008-06-20 | Sagem Defense Securite | Dispositif a composants electroniques integres muni d'une cloison de separation de zones ventilees |
| US9084375B2 (en) * | 2007-11-26 | 2015-07-14 | Seagate Technology Llc | Airflow module and data storage device enclosure |
| US20090277993A1 (en) * | 2008-05-07 | 2009-11-12 | Honeywell International Inc. | Systems and methods for a passive, forced convection cooling system |
| US20100002385A1 (en) * | 2008-07-03 | 2010-01-07 | Geoff Lyon | Electronic device having active noise control and a port ending with curved lips |
| US8222541B2 (en) * | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
| US8059409B2 (en) * | 2009-06-19 | 2011-11-15 | General Electric Company | Avionics chassis |
| US7911796B2 (en) * | 2009-06-19 | 2011-03-22 | General Electric Company | Avionics chassis |
| US8023267B2 (en) * | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
| FR2960912B1 (fr) * | 2010-06-08 | 2012-06-08 | Snecma | Dispositif de protection d'un calculateur de turbo-machine d'aeronef en cas de feu |
| FR3000362B1 (fr) * | 2012-12-21 | 2016-03-25 | Airbus Operations Sas | Bloc d'extraction d'air pour baie avionique |
| FR3009340B1 (fr) * | 2013-08-01 | 2018-03-09 | Safran Aircraft Engines | Ventilation d'un equipement de turbomachine |
| US9286653B2 (en) | 2014-08-06 | 2016-03-15 | Google Inc. | System and method for increasing the bit depth of images |
| EP3471523B1 (en) * | 2017-10-10 | 2023-07-26 | Veoneer Sweden AB | Ecu cooling arrangement |
| CN115604964B (zh) * | 2022-12-14 | 2023-04-07 | 山西省机电设计研究院有限公司 | 悬挂式风冷电机控制器 |
| EP4521867A1 (en) * | 2023-09-07 | 2025-03-12 | Valeo Comfort and Driving Assistance | Telematics control unit for a vehicle |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4089040A (en) * | 1976-01-28 | 1978-05-09 | The Boeing Company | Electrical/electronic rack and plug-in modules therefor |
| US4520425A (en) * | 1982-08-12 | 1985-05-28 | Mitsubishi Denki Kabushiki Kaisha | Control apparatus with improved structure for cooling circuit elements |
| US4674704A (en) * | 1985-12-03 | 1987-06-23 | The United States Of America As Represented By The Secretary Of The Air Force | Direct air cooling system for airborne electronics |
| US4851965A (en) * | 1987-03-09 | 1989-07-25 | Unisys Corporation | Directed air management system for cooling multiple heat sinks |
| JPS63149645U (pt) * | 1987-03-23 | 1988-10-03 | ||
| US5253484A (en) * | 1991-08-22 | 1993-10-19 | The Boeing Company | High reliability avionic cooling system |
| US7068506B2 (en) * | 1997-09-10 | 2006-06-27 | Sunny Behl | Removable memory storage device carrier having a heat sink |
| US5940266A (en) * | 1997-10-14 | 1999-08-17 | International Business Machines Corporation | Bi-directional cooling arrangement for use with an electronic component enclosure |
| US5940288A (en) * | 1998-06-08 | 1999-08-17 | Tracewell Power, Inc. | Card cage mounted power supply with heat dissipating architecture |
| JP3408424B2 (ja) * | 1998-07-28 | 2003-05-19 | 日本電気株式会社 | 電子機器の冷却構造 |
| US6364761B1 (en) * | 2000-06-19 | 2002-04-02 | Intel Corporation | Redundant cooling system for computer assembly |
| US6459579B1 (en) * | 2001-01-03 | 2002-10-01 | Juniper Networks, Inc. | Apparatus and method for directing airflow in three dimensions to cool system components |
| JP2003280101A (ja) * | 2002-03-26 | 2003-10-02 | Plus Vision Corp | 発熱体の冷却機構およびこれを用いたプロジェクタ |
| JP2004071615A (ja) * | 2002-08-01 | 2004-03-04 | Elpida Memory Inc | 保護カバー、及び保護カバー付き半導体装置 |
| TW551545U (en) * | 2002-08-07 | 2003-09-01 | Tzung-Yan Tsai | Structure of power supply |
| TW587773U (en) * | 2003-03-27 | 2004-05-11 | Cheng-Chun Chang | Heat dissipation structure of removable device |
| US6940718B2 (en) * | 2003-08-27 | 2005-09-06 | Hewlett-Packard Development Company, L.P. | Heat dissipation apparatus and method |
| FI116491B (fi) * | 2004-02-16 | 2005-11-30 | Inssimainos Oy | Menetelmä ja laitteisto näyttöpinnan lämpötilan hallitsemiseksi |
| US7324336B2 (en) * | 2005-09-27 | 2008-01-29 | Lockheed Martin Corporation | Flow through cooling assemblies for conduction-cooled circuit modules |
-
2005
- 2005-10-14 US US11/249,263 patent/US7307840B2/en active Active
-
2006
- 2006-10-16 CN CN2006800382762A patent/CN101288356B/zh not_active Expired - Fee Related
- 2006-10-16 WO PCT/US2006/039919 patent/WO2007047388A2/en not_active Ceased
- 2006-10-16 EP EP06825843A patent/EP1938678B1/en not_active Ceased
- 2006-10-16 DE DE602006015077T patent/DE602006015077D1/de active Active
- 2006-10-16 BR BRPI0618408A patent/BRPI0618408B1/pt not_active IP Right Cessation
- 2006-10-16 JP JP2008535678A patent/JP5021657B2/ja not_active Expired - Fee Related
- 2006-10-16 CA CA2624745A patent/CA2624745C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2007047388A2 (en) | 2007-04-26 |
| CA2624745A1 (en) | 2007-04-26 |
| CN101288356A (zh) | 2008-10-15 |
| CA2624745C (en) | 2015-05-19 |
| JP2009512218A (ja) | 2009-03-19 |
| WO2007047388A3 (en) | 2008-02-14 |
| JP5021657B2 (ja) | 2012-09-12 |
| US20070086161A1 (en) | 2007-04-19 |
| CN101288356B (zh) | 2012-04-18 |
| DE602006015077D1 (de) | 2010-08-05 |
| EP1938678B1 (en) | 2010-06-23 |
| EP1938678A2 (en) | 2008-07-02 |
| BRPI0618408B1 (pt) | 2018-09-11 |
| US7307840B2 (en) | 2007-12-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B09A | Decision: intention to grant [chapter 9.1 patent gazette] | ||
| B16A | Patent or certificate of addition of invention granted [chapter 16.1 patent gazette] |
Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 11/09/2018, OBSERVADAS AS CONDICOES LEGAIS. |
|
| B21F | Lapse acc. art. 78, item iv - on non-payment of the annual fees in time |
Free format text: REFERENTE A 15A ANUIDADE. |
|
| B24J | Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12) |
Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2640 DE 10-08-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |