BRPI0702368A - sistema e método de dissipação de calor - Google Patents

sistema e método de dissipação de calor

Info

Publication number
BRPI0702368A
BRPI0702368A BRPI0702368-5A BRPI0702368A BRPI0702368A BR PI0702368 A BRPI0702368 A BR PI0702368A BR PI0702368 A BRPI0702368 A BR PI0702368A BR PI0702368 A BRPI0702368 A BR PI0702368A
Authority
BR
Brazil
Prior art keywords
condenser
heat
unit
dissipation system
heat dissipation
Prior art date
Application number
BRPI0702368-5A
Other languages
English (en)
Inventor
Chin-Kuang Luo
Original Assignee
Chin-Kuang Luo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chin-Kuang Luo filed Critical Chin-Kuang Luo
Publication of BRPI0702368A publication Critical patent/BRPI0702368A/pt

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

SISTEMA E MéTODO DE DISSIPAçãO DE CALOR Um sistema de dissipação de calor inclui: uma unidade de absorção de calor (5) tendo pelo menos um corpo de cavidade (51, 52, 53, 54) adaptado para contatar uma fonte de calor (35, 7), e um fluido de trabalho (30) recebido no corpo de cavidade (51, 52, 53, 54); um condensador (4) para condensar o fluido de trabalho (30); e uma unidade de tubulação (6) conectada de forma fluida ao condensador (4) e à unidade de absorção de calor (5). O fluido de trabalho (30) flui através da unidade de tubulação (6) para circular a partir do condensador (4) à unidade de absorção de calor (5) por gravidade e a partir da unidade de absorção de calor (5) ao condensador (4) por convenção natural. A unidade de tubulação (6) forma um laço de circulação fechado com a unidade de absorção de calor (5) e o condensador (4).
BRPI0702368-5A 2006-09-28 2007-05-29 sistema e método de dissipação de calor BRPI0702368A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095136005A TW200815968A (en) 2006-09-28 2006-09-28 Phase change heat dissipation device and method

Publications (1)

Publication Number Publication Date
BRPI0702368A true BRPI0702368A (pt) 2008-05-13

Family

ID=39259822

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0702368-5A BRPI0702368A (pt) 2006-09-28 2007-05-29 sistema e método de dissipação de calor

Country Status (5)

Country Link
US (1) US20080078202A1 (pt)
JP (1) JP2008082694A (pt)
KR (1) KR20080029756A (pt)
BR (1) BRPI0702368A (pt)
TW (1) TW200815968A (pt)

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US7630198B2 (en) * 2006-03-08 2009-12-08 Cray Inc. Multi-stage air movers for cooling computer systems and for other uses
US7411785B2 (en) * 2006-06-05 2008-08-12 Cray Inc. Heat-spreading devices for cooling computer systems and associated methods of use
US20090154091A1 (en) 2007-12-17 2009-06-18 Yatskov Alexander I Cooling systems and heat exchangers for cooling computer components
US8170724B2 (en) 2008-02-11 2012-05-01 Cray Inc. Systems and associated methods for controllably cooling computer components
US7898799B2 (en) * 2008-04-01 2011-03-01 Cray Inc. Airflow management apparatus for computer cabinets and associated methods
GB2462098A (en) * 2008-07-23 2010-01-27 Ryan James Mcglen Thermal management device comprising heat pipes
US8081459B2 (en) 2008-10-17 2011-12-20 Cray Inc. Air conditioning systems for computer systems and associated methods
US7903403B2 (en) * 2008-10-17 2011-03-08 Cray Inc. Airflow intake systems and associated methods for use with computer cabinets
US8472181B2 (en) 2010-04-20 2013-06-25 Cray Inc. Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use
TWI411390B (zh) * 2010-07-26 2013-10-01 I-Ming Lin 串聯型連續降溫及升溫裝置
CN102097403A (zh) * 2010-11-25 2011-06-15 昆明理工大学 芯片热沉及带芯片热沉的芯片冷却装置
US9848509B2 (en) 2011-06-27 2017-12-19 Ebullient, Inc. Heat sink module
CN102917570A (zh) * 2011-08-05 2013-02-06 仪信股份有限公司 液态冷却系统
WO2015100591A1 (en) * 2013-12-31 2015-07-09 Gentherm Automotive Systems (China) Ltd. Ventilation system
CN104329828B (zh) * 2014-03-28 2017-01-11 海尔集团公司 半导体制冷冰箱及其热端换热装置
US20160120059A1 (en) 2014-10-27 2016-04-28 Ebullient, Llc Two-phase cooling system
AU2015339717A1 (en) * 2014-10-27 2017-06-15 Ebullient, Llc Heat exchanger with helical passageways
US9852963B2 (en) 2014-10-27 2017-12-26 Ebullient, Inc. Microprocessor assembly adapted for fluid cooling
US9891002B2 (en) 2014-10-27 2018-02-13 Ebullient, Llc Heat exchanger with interconnected fluid transfer members
US10391831B2 (en) * 2015-07-23 2019-08-27 Hyundai Motor Company Combined heat exchanger module
US10451355B2 (en) * 2016-05-27 2019-10-22 Asia Vital Components Co., Ltd. Heat dissipation element
US11252847B2 (en) * 2017-06-30 2022-02-15 General Electric Company Heat dissipation system and an associated method thereof
CN108644731A (zh) * 2018-05-14 2018-10-12 安徽卡澜特车灯科技有限公司 一种双光灯具散热装置
KR102228042B1 (ko) * 2019-03-22 2021-03-15 주식회사 에이프로템 열전소자를 이용한 다지점 접촉형 냉각 및 가열 장치
CN112954965A (zh) * 2021-02-01 2021-06-11 中国科学院电工研究所 用于高性能计算机的模块化冷却系统
TWI825665B (zh) * 2022-04-12 2023-12-11 陳冠宏 熱電致冷晶片之冷面應用裝置
CN117293104B (zh) * 2023-11-27 2024-03-22 贵州芯际探索科技有限公司 一种sic器件散热封装结构及封装方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6853554B2 (en) * 2001-02-22 2005-02-08 Hewlett-Packard Development Company, L.P. Thermal connection layer
US6845622B2 (en) * 2003-03-27 2005-01-25 Intel Corporation Phase-change refrigeration apparatus with thermoelectric cooling element and methods

Also Published As

Publication number Publication date
KR20080029756A (ko) 2008-04-03
TW200815968A (en) 2008-04-01
US20080078202A1 (en) 2008-04-03
JP2008082694A (ja) 2008-04-10

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Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]