BRPI0703700A - nanopartìculas contendo prata com estabilizador de substituição - Google Patents
nanopartìculas contendo prata com estabilizador de substituiçãoInfo
- Publication number
- BRPI0703700A BRPI0703700A BRPI0703700-7A BRPI0703700A BRPI0703700A BR PI0703700 A BRPI0703700 A BR PI0703700A BR PI0703700 A BRPI0703700 A BR PI0703700A BR PI0703700 A BRPI0703700 A BR PI0703700A
- Authority
- BR
- Brazil
- Prior art keywords
- silver
- stabilizer
- containing nanoparticles
- replacement
- replacement stabilizer
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82B—NANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
- B82B3/00—Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0241—Manufacture or treatment of multiple TFTs using liquid deposition, e.g. printing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/331—Nanoparticles used in non-emissive layers, e.g. in packaging layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12181—Composite powder [e.g., coated, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Dispersion Chemistry (AREA)
- Biophysics (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Composite Materials (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Optics & Photonics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Electrodes Of Semiconductors (AREA)
- Thin Film Transistor (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
NANOPARTìCULAS CONTENDO PRATA COM ESTABILIZADOR DE SUBSTITUIçãO. Refere-se a um processo incluindo: provisão de uma composição compreendendo nanopartículas contendo prata e moléculas de um estabilizador inicial sobre a superfície das nanopartículas contendo prata; e mistura de um estabilizador de substituição compreendendo o ácido carboxílico com a composição para substituir pelo menos uma porção do estabilizador inicial com o estabilizador de substituição, resultando em moléculas do estabilizador de substituição sobre a superfície das nanopartículas contendo prata.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/543,661 US7919015B2 (en) | 2006-10-05 | 2006-10-05 | Silver-containing nanoparticles with replacement stabilizer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0703700A true BRPI0703700A (pt) | 2008-05-27 |
Family
ID=38740264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0703700-7A BRPI0703700A (pt) | 2006-10-05 | 2007-10-04 | nanopartìculas contendo prata com estabilizador de substituição |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US7919015B2 (pt) |
| EP (1) | EP1916671B1 (pt) |
| JP (1) | JP5450947B2 (pt) |
| KR (1) | KR101379195B1 (pt) |
| CN (1) | CN101157127B (pt) |
| BR (1) | BRPI0703700A (pt) |
| CA (1) | CA2604754C (pt) |
| TW (1) | TWI422709B (pt) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060254387A1 (en) * | 2005-05-10 | 2006-11-16 | Samsung Electro-Mechanics Co., Ltd. | Metal nano particle and method for manufacturing them and conductive ink |
| KR100790457B1 (ko) * | 2006-07-10 | 2008-01-02 | 삼성전기주식회사 | 금속 나노입자의 제조방법 |
| US7919015B2 (en) | 2006-10-05 | 2011-04-05 | Xerox Corporation | Silver-containing nanoparticles with replacement stabilizer |
| JP4294705B2 (ja) | 2007-05-30 | 2009-07-15 | Dowaエレクトロニクス株式会社 | 有機物質で被覆された銀微粉の製法および銀微粉 |
| US7768366B1 (en) * | 2007-10-29 | 2010-08-03 | The United States Of America As Represented By The Secretary Of The Air Force | Nanoparticles and corona enhanced MEMS switch apparatus |
| US8048488B2 (en) * | 2008-01-14 | 2011-11-01 | Xerox Corporation | Methods for removing a stabilizer from a metal nanoparticle using a destabilizer |
| KR101525099B1 (ko) * | 2008-06-30 | 2015-06-02 | 도와 일렉트로닉스 가부시키가이샤 | 미소금속입자함유 조성물 및 그 제조 방법 |
| US8460584B2 (en) * | 2008-10-14 | 2013-06-11 | Xerox Corporation | Carboxylic acid stabilized silver nanoparticles and process for producing same |
| WO2010057114A2 (en) | 2008-11-14 | 2010-05-20 | Dune Sciences Inc. | Functionalized nanoparticles and methods of forming and using same |
| US8834965B2 (en) * | 2009-02-12 | 2014-09-16 | Xerox Corporation | Organoamine stabilized silver nanoparticles and process for producing same |
| US9137902B2 (en) * | 2009-08-14 | 2015-09-15 | Xerox Corporation | Process to form highly conductive feature from silver nanoparticles with reduced processing temperature |
| US8808789B2 (en) * | 2009-11-13 | 2014-08-19 | Xerox Corporation | Process for forming conductive features |
| JP2013516771A (ja) * | 2009-12-31 | 2013-05-13 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 低温同時焼成セラミックの回路およびデバイスで使用するための混合金属システム導体 |
| ES2495390T3 (es) * | 2010-03-12 | 2014-09-17 | Clariant International Ag | Producción de revestimientos de superficie conductivos con dispersión con nanopartículas de plata estabilizadas de forma electrostática |
| KR101153516B1 (ko) * | 2010-03-23 | 2012-06-11 | 삼성전기주식회사 | 금속 나노입자의 제조방법, 이를 이용한 잉크 조성물 및 그의 제조방법 |
| JP2011202265A (ja) * | 2010-03-26 | 2011-10-13 | Dowa Electronics Materials Co Ltd | 低温焼結性金属ナノ粒子組成物および該組成物を用いて形成された電子物品 |
| DE102010025608A1 (de) * | 2010-06-30 | 2012-01-05 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil |
| KR20130097768A (ko) * | 2010-09-29 | 2013-09-03 | 히타치가세이가부시끼가이샤 | 접착제 조성물 및 그것을 사용한 반도체 장치 |
| JP5830237B2 (ja) * | 2010-11-10 | 2015-12-09 | Dowaエレクトロニクス株式会社 | 銀粒子含有組成物、分散液ならびにペーストの製造方法 |
| TW201245364A (en) * | 2011-01-28 | 2012-11-16 | Hitachi Chemical Co Ltd | Adhesive composition and semiconductor device using same |
| US20120288697A1 (en) | 2011-05-13 | 2012-11-15 | Xerox Corporation | Coating methods using silver nanoparticles |
| US20120286502A1 (en) * | 2011-05-13 | 2012-11-15 | Xerox Corporation | Storage Stable Images |
| CA2838546A1 (en) * | 2011-06-14 | 2012-12-20 | Bayer Technology Services Gmbh | Silver-containing aqueous ink formulation for producing electrically conductive structures, and ink jet printing method for producing such electrically conductive structures |
| KR101873448B1 (ko) | 2011-07-15 | 2018-07-03 | 삼성디스플레이 주식회사 | 유기발광표시장치 및 이의 제조방법 |
| JP5888976B2 (ja) * | 2011-09-28 | 2016-03-22 | 富士フイルム株式会社 | 導電性組成物、導電性部材およびその製造方法、タッチパネル並びに太陽電池 |
| CN104023666B (zh) * | 2011-10-12 | 2019-08-20 | 郑州泽正技术服务有限公司 | 一种牙钻机头 |
| EP2784784A4 (en) * | 2011-11-21 | 2015-07-15 | Hanwha Chemical Corp | PASTE COMPOSITION FOR FRONT ELECTRODE OF SOLAR CELL AND SOLAR CELL THEREWITH |
| JP5868751B2 (ja) * | 2012-03-26 | 2016-02-24 | 富士フイルム株式会社 | 銀ナノワイヤ分散液の製造方法 |
| JP5425962B2 (ja) * | 2012-04-04 | 2014-02-26 | ニホンハンダ株式会社 | 加熱焼結性銀粒子の製造方法、ペースト状銀粒子組成物、固形状銀の製造方法、金属製部材の接合方法、プリント配線板の製造方法および電気回路接続用バンプの製造方法 |
| JP5908377B2 (ja) * | 2012-09-19 | 2016-04-26 | 住友化学株式会社 | 金属系粒子集合体の製造方法 |
| EP3017664A1 (en) * | 2013-07-04 | 2016-05-11 | Agfa-Gevaert | A method of preparing a conductive metallic layer or pattern |
| JP6315669B2 (ja) * | 2014-02-28 | 2018-04-25 | ハリマ化成株式会社 | 銀微粒子の調製方法 |
| US9809606B1 (en) | 2016-08-09 | 2017-11-07 | Eastman Kodak Company | Silver ion carboxylate N-heteroaromatic complexes |
| US10186342B2 (en) | 2016-08-09 | 2019-01-22 | Eastman Kodak Company | Photosensitive reducible silver ion-containing compositions |
| US10311990B2 (en) | 2016-08-09 | 2019-06-04 | Eastman Kodak Company | Photosensitive reducible silver ion-containing compositions |
| US9718842B1 (en) | 2016-08-09 | 2017-08-01 | Eastman Kodak Company | Silver ion carboxylate primary alkylamine complexes |
| US10087331B2 (en) | 2016-08-09 | 2018-10-02 | Eastman Kodak Company | Methods for forming and using silver metal |
| US10314173B2 (en) | 2016-08-09 | 2019-06-04 | Eastman Kodak Company | Articles with reducible silver ions or silver metal |
| US10356899B2 (en) | 2016-08-09 | 2019-07-16 | Eastman Kodak Company | Articles having reducible silver ion complexes or silver metal |
| KR20230019506A (ko) * | 2019-03-25 | 2023-02-08 | 시노비아 테크놀로지스 | 비평형 열경화 공정 |
| JP2021063251A (ja) * | 2019-10-11 | 2021-04-22 | 国立大学法人横浜国立大学 | 色素含有保護層付着銀ナノワイヤ、その分散液、前記銀ナノワイヤの製造方法および透光性導電膜 |
| CN112548096A (zh) * | 2020-12-14 | 2021-03-26 | 中北大学 | 一种钴包覆陶瓷复合粉末及其制备方法和应用 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1266761A (en) * | 1917-11-10 | 1918-05-21 | Clarence A Bailey | Automobile-crank. |
| US4186244A (en) * | 1977-05-03 | 1980-01-29 | Graham Magnetics Inc. | Novel silver powder composition |
| US5147841A (en) | 1990-11-23 | 1992-09-15 | The United States Of America As Represented By The United States Department Of Energy | Method for the preparation of metal colloids in inverse micelles and product preferred by the method |
| US5492653A (en) * | 1994-11-07 | 1996-02-20 | Heraeus Incorporated | Aqueous silver composition |
| US5882722A (en) * | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
| US6103868A (en) | 1996-12-27 | 2000-08-15 | The Regents Of The University Of California | Organically-functionalized monodisperse nanocrystals of metals |
| US6730400B1 (en) * | 1999-06-15 | 2004-05-04 | Teruo Komatsu | Ultrafine composite metal particles and method for manufacturing same |
| CN1266761A (zh) * | 2000-03-23 | 2000-09-20 | 南京大学 | 纳米级银粉的制备方法 |
| US7081214B2 (en) * | 2000-10-25 | 2006-07-25 | Harima Chemicals, Inc. | Electroconductive metal paste and method for production thereof |
| US6572673B2 (en) | 2001-06-08 | 2003-06-03 | Chang Chun Petrochemical Co., Ltd. | Process for preparing noble metal nanoparticles |
| US6688494B2 (en) | 2001-12-20 | 2004-02-10 | Cima Nanotech, Inc. | Process for the manufacture of metal nanoparticle |
| US6638708B1 (en) * | 2002-07-22 | 2003-10-28 | Eastman Kodak Company | Silver (carboxylate-n-alkyl thiolate) particles for photothermographic of thermographic imaging |
| US6878184B1 (en) * | 2002-08-09 | 2005-04-12 | Kovio, Inc. | Nanoparticle synthesis and the formation of inks therefrom |
| JP2005535448A (ja) * | 2002-08-14 | 2005-11-24 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 被覆された多不飽和脂肪酸含有粒子および被覆された液体薬剤含有粒子 |
| US7160525B1 (en) * | 2003-10-14 | 2007-01-09 | The Board Of Trustees Of The University Of Arkansas | Monodisperse noble metal nanocrystals |
| US20050129843A1 (en) * | 2003-12-11 | 2005-06-16 | Xerox Corporation | Nanoparticle deposition process |
| CN1930638B (zh) * | 2004-03-10 | 2010-09-22 | 旭硝子株式会社 | 含有金属的微粒、含有金属的微粒分散液及含有导电性金属的材料 |
| US20060044382A1 (en) * | 2004-08-24 | 2006-03-02 | Yimin Guan | Metal colloid dispersions and their aqueous metal inks |
| JP2006089786A (ja) | 2004-09-22 | 2006-04-06 | Mitsuboshi Belting Ltd | 極性溶媒に分散した金属ナノ粒子の製造方法 |
| US7270694B2 (en) * | 2004-10-05 | 2007-09-18 | Xerox Corporation | Stabilized silver nanoparticles and their use |
| JP2006118010A (ja) * | 2004-10-22 | 2006-05-11 | Toda Kogyo Corp | Agナノ粒子及びその製造方法、Agナノ粒子の分散溶液 |
| US7706977B2 (en) * | 2004-10-26 | 2010-04-27 | Honeywell International Inc. | Personal navigation device for use with portable device |
| JP5007020B2 (ja) | 2004-12-20 | 2012-08-22 | 株式会社アルバック | 金属薄膜の形成方法及び金属薄膜 |
| US20060192183A1 (en) * | 2005-02-28 | 2006-08-31 | Andreas Klyszcz | Metal ink, method of preparing the metal ink, substrate for display, and method of manufacturing the substrate |
| US20060254387A1 (en) * | 2005-05-10 | 2006-11-16 | Samsung Electro-Mechanics Co., Ltd. | Metal nano particle and method for manufacturing them and conductive ink |
| US7306969B2 (en) | 2005-07-22 | 2007-12-11 | Xerox Corporation | Methods to minimize contact resistance |
| US7919015B2 (en) | 2006-10-05 | 2011-04-05 | Xerox Corporation | Silver-containing nanoparticles with replacement stabilizer |
| US7737497B2 (en) * | 2007-11-29 | 2010-06-15 | Xerox Corporation | Silver nanoparticle compositions |
-
2006
- 2006-10-05 US US11/543,661 patent/US7919015B2/en active Active
-
2007
- 2007-09-28 CA CA2604754A patent/CA2604754C/en active Active
- 2007-09-30 CN CN2007101630874A patent/CN101157127B/zh not_active Expired - Fee Related
- 2007-10-02 TW TW096136855A patent/TWI422709B/zh not_active IP Right Cessation
- 2007-10-04 EP EP07117881.8A patent/EP1916671B1/en not_active Ceased
- 2007-10-04 JP JP2007260599A patent/JP5450947B2/ja not_active Expired - Fee Related
- 2007-10-04 KR KR1020070100035A patent/KR101379195B1/ko active Active
- 2007-10-04 BR BRPI0703700-7A patent/BRPI0703700A/pt active IP Right Grant
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2008
- 2008-12-04 US US12/328,088 patent/US7972540B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TW200831705A (en) | 2008-08-01 |
| JP5450947B2 (ja) | 2014-03-26 |
| EP1916671A3 (en) | 2009-08-12 |
| TWI422709B (zh) | 2014-01-11 |
| EP1916671A2 (en) | 2008-04-30 |
| US20090110812A1 (en) | 2009-04-30 |
| US7919015B2 (en) | 2011-04-05 |
| EP1916671B1 (en) | 2013-12-11 |
| JP2008095194A (ja) | 2008-04-24 |
| CN101157127A (zh) | 2008-04-09 |
| KR101379195B1 (ko) | 2014-03-31 |
| CN101157127B (zh) | 2012-03-21 |
| KR20080031811A (ko) | 2008-04-11 |
| US7972540B2 (en) | 2011-07-05 |
| CA2604754C (en) | 2016-07-26 |
| US20080085594A1 (en) | 2008-04-10 |
| CA2604754A1 (en) | 2008-04-05 |
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