BRPI0708509A2 - multiple x-ray generator and multiple x-ray imaging apparatus - Google Patents

Abstract

MULTIPLE X-RAY GENERATOR, E, MULTIPLE X-RAY IMAGE FORMATING A compact device can form multiple X-ray beams with good controllability. Electron beams (e) emitted by the electron emitting elements (15) of a multiple electron beam generating unit (12) receive the lens effect of a lens electrode (19). The resulting electron beams are accelerated to the final potential level by portions of a transmission-type target portion (13) of an anode electrode (20). The multiple X-ray beams (x) generated by the transmission-type target portion (13) pass through an X-ray shield plate (23) and X-ray extraction portions (24) in a vacuum chamber and are extracted from the X-ray extraction windows (27) of a wall portion (25) into the atmosphere.

Description

"MULTI-X-RAY GENERATOR, Ε, MULTI-X-RAY IMAGE DEFORMING APPARATUS" TECHNICAL FIELD

The present invention relates to a multiple x-ray generator used for non-destructive x-ray imaging, diagnostics, and the like in the fields of medical equipment and industrial equipment using x-ray sources.

TECHNICAL BACKGROUND

Conventionally, an X-ray tube uses an electron fontotherm as an electron source, and obtains a high-energy electron beam by accelerating thermal electrons emitted from a high temperature heated filament via a Wehnelt electrode, extraction electrode, electrode. acceleration, and lens electrode. After shaping the electron beam into a desired shape, the X-ray tube generates X-rays by beaming with the beam a target X-ray portion made of a metal.

Recently, a cold cathode electron source has been developed as an electron source to replace this electron heat source, and has been extensively studied as an application of a flat screen display (FPD). As a typical cold cathode, a Spindt electron source is known which extracts electrons by applying a high electric field to the point of a needle of several IOnm size. There is also an electron emitter using a carbon nanotube (CNT) as a material and a surface-conducting electron source that emits electrons forming a microstructure of the order of nanometers on the surface of a glass substrate.

Patent references 1 and 2 propose, as an application of these electron sources, a technique for extracting X-rays by forming a single electron beam using a Spindt electron source or a carbon nanotube electron source. Patent reference 3 and non-patent reference 1 show a technique of generating X-rays by radiating a target portion of electron beam X-rays from a multiple electron source using a plurality of these cold cathode electron sources.

Patent Reference 1: Japanese Patent 9-180894, open

Patent Reference 2: Japanese Patent 2004-329784, emaberto

Patent Reference 3: Japanese Patent 8-264139, open

Non-Patent Reference 1: Applied Physics Letters 86,184104 (2005), J. Zhang "Stationary x-ray scanning source based on carbonnanotube field emitters"

PRESENTATION OF THE INVENTION

PROBLEMS THAT THE INVENTION MUST SOLVE

Fig. 14 is a view showing the arrangement of a conventional X-ray generation scheme using multiple electron beams. In a vacuum chamber 1, in which a plurality of electron sources comprising multiple electron emission elements generate electron beams, and the electron beams are bumped on a target portion 2 to x-ray the generated X-rays. However, the X-rays generated from target portion 2 diverge in a vacuum in all directions. For this reason, it is difficult to form independent x-ray beams by using x-ray production from the x-ray extraction windows 4 of an x-ray shield plate 3 provided on the atmosphere side, because x-rays , emitted from adjacent X-ray sources, are transmitted through the same X-ray extraction windows 4.

In addition, as shown in Fig. 15, when x-rays are extracted from the x-ray extraction window 4 to the atmosphere side, providing an x-ray shield plate 6 on the atmosphere side of a wall portion 5 of the vacuum chamber 1, many exhaust x-rays x2, divergent x-rays x1 are produced which are not collided with a P object. In addition, it is difficult to form multiple x-ray beams with uniform intensity because of the use of a plurality. of electron sources comprising multiple electron emission elements as opposed to a single conventional X-ray source.

It is an object of the present invention to provide a compact, multiple X-ray Generator that can solve the above problems and form multiple X-ray beams with excellent scattered X-ray and uniformity and an X-ray imaging apparatus using the generator.

MEANS OF SOLVING PROBLEMS

In order to achieve the above objective, a Multiple X-ray Generator according to the present invention is technically characterized by comprising a plurality of electron-emitting elements by acceleration to accelerate the emitted electron beams of the plurality of electron-emitting elements. electrons, and a target portion that is irradiated with the electron beams, where the target portion is provided in correspondence with the electron beams, the target portion comprising x-ray shielding means, and the x-rays generated from the electron beam. target being extracted as multiple x-ray beams into the atmosphere.

EFFECTS OF THE INVENTION

According to a multiple x-ray generator according to the present invention, x-ray sources using a plurality of electron emission elements can form multiple x-ray beams whose angles of divergence are controlled, with few scattered exhaust x-rays. The use of multiple x-ray beams can achieve a compact x-ray imaging apparatus with excellent uniformity of beams.

Other features and advantages of the present invention will become apparent from the following description taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

The accompanying drawings, incorporated herein as part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

Fig. 1 is a view showing the arrangement of a multiple X-ray font body according to the first embodiment;

Fig. 2 is a plan view of an element substrate;

Fig. 3 is a view showing the arrangement of a Spindt-like element;

Fig. 4 is a view showing the arrangement of a carbon tipotane element;

Fig. 5 is a view showing the arrangement of a surface-leading type element;

Fig. 6 is a graph showing the current-return characteristics of multiple electron emission elements;

Fig. 7 is a view showing the arrangement of a multiple transmission blanking portion having an X-ray shield plate;

Fig. 8 is a view showing the arrangement of the target transmission portion

Fig. 9 is a view showing the arrangement of the single-transmission target portion having the X-ray shield plate;

Fig. 10 is a view showing the arrangement of a transmission alvotype portion having X-ray shield plate / electron reflected beam;

Fig. 11 is a view showing the arrangement of an X-ray shielding plate provided with a tapered X-ray extraction portion;

Fig. 12 is a perspective view of a multiple X-ray source body comprising a reflection-like target portion according to the second embodiment;

Fig. 13 is a view showing the arrangement of a multiple x-ray imaging apparatus according to the third embodiment;

Fig. 14 is a view showing the arrangement of a conventional multiple X-ray source; and

Fig. 15 is a view showing a conventional multiple x-ray source.

Best Mode for Carrying Out the Invention

The present invention will be described in detail based on the embodiments shown in Figs. 1 to 13.

[First embodiment]

Fig. 1 is a view showing the arrangement of a multiple X-ray font body 10. An electron beam generating unit 12 and anode electrode 20 are arranged in a vacuum chamber 11. Electron beam generating unit 12 comprises an element substrate 14 and an element array 16 having a plurality of electron-emitting elements 15 arranged on the element substrate. An activation signal unit 17 controls the activation of the electron emission elements 15. A lens electrode 19 attached to an isolation member18 is provided to control the electron beams and emitted from the electron emission elements 15. High voltages are applied to the electrodes 19 and 20 via high voltage introduction portions 21 and 22.

A transmission-type target portion 13 over which the electron and emitted beams collide is discretely formed on the anode electrode 20 so that it faces the electron beams e. The transmission honeycomb portion 13 is further provided with an X-ray shield plate 23 made of a heavy metal. The X-ray shield plate 23 in this vacuum chamber has X-ray extraction portions 24. A wall portion 25 of the vacuum chamber 11 is provided with X-ray extraction windows 27 having ray transmission films. -X 26 located in front of X-ray extraction portions.

The electron beams emitted from the electron-emitting elements 15 receive the lens effect of the lens electrode 19, and are accelerated to the final potential level by portions of the target-transmission portion 13 of the anode electrode 20. X χ generated by transmission-type target spray 13 pass through the X-ray extraction portions 24 and are extracted into the atmosphere via X-ray extraction windows27. The plurality of x-ray beams χ is generated according to the plurality of electron beams and from a plurality of electron emission elements 15. The plurality of x-ray beams extracted from the x-ray extraction portions 24 forms multiple x-ray beams.

The electron emission elements 15 are arranged two-dimensionally over the element array 16, as shown in Fig. 2. With recent advances in nanotechnology, it is possible to form a thin nm-sized structure at a predetermined position by a device process. The electron emission elements 15 are manufactured by this nanotechnology. The electron emission quantities of the electron emission elements 15 are individually controlled by the activation signals Sl and S2 (which will be described later) via the desinal activation unit 17. That is, individually controlling the electron emission amounts of the electron emission elements. electrons 15 in the array of elements 16 using the activation signals Sl and S2 as matrix signals makes it possible to individually control the x-ray beams ON / OFF.

Fig. 3 is a view showing the arrangement of the Spindt-type electron emission element 15. Isolation members 32 and extraction electrodes 33 are provided on an element substrate 31 made of Si. Conical emitters 34 each made of a Metal or materials semiconductor and having a tip diameter of several 10 nm are formed in μm size grooves at the electrode centers using a device fabrication process.

Fig. 4 is a view showing the arrangement of the carbon nanotube electron-emitting element 15. As a material for a 35 emitter, a carbon nanotube comprising a fine structure of several 10 nm is used. The emitter 35 is formed in the center of an extraction electrode 36.

When voltages of several 10 to 100 V are applied to the extraction electrodes 33 and 36 of the Spindt-type element and the carbon-tube tip element, high electric fields are applied to the emitter tips 34 and 35, thereby emitting the electron beams and field emission pellophenomenon.

Fig. 5 is a view showing the arrangement of the surface-conducting electron-emitting element 15. A finite structure comprising nanoparticles is formed as an emitter 38 in a space in a thin-film electrode 37 formed on a glass element substrate 31. When A voltage exceeding 10 V is applied between the electrodes of this surface conduction type element, a high electric field is applied to the thin gap formed by fine particles between the electrodes. This generates conduction electrons. At the same time, the electron beams are emitted in a vacuum, and the electron emission can be controlled at a relatively low voltage.

Fig. 6 shows the voltage characteristics of the Spindt element, carbon nanotube element and surface conduction element. In order to obtain a constant emission current, the voltage obtained by correcting an average activation voltage Vo with an AV correction voltage is applied as an activation voltage to the electron emission elements 15. This can correct variations in emission currents of the elements. of electron emission 15.

As electron sources for the generation of multiple X-ray beams in addition to the above electron emission elements, MIM (Metal Insulating Metal) and MIS (Semiconductor Insulating Metal) elements can be used. In addition, cold cathode-type electron sources such as a PNsemiconductor junction electron source and a Schottky junction electron source can be used.

An X-ray generator using this cold cathode electron emitting element as an electron source emits electrons by applying a low voltage to the electron emitting element at ambient temperature without heating the cathode. This generator therefore requires no waiting time for X-ray generation. In addition, since no energy is required to heat the cathode, an energy-efficient X-ray source can be fabricated even using a multiple X-ray source. Since the currents of these electron emission elements can be controlled ON / OFF by high speed activation operation using activation voltages, a multiple array X-ray font can be fabricated which selects an electron emission element to be triggered and performing high-speed response operation.

Figs. 7 to 11 are seen to explain a method of forming x-ray beams. Fig. 7 shows an example of a multi-transmission target portion 13. The transmission-type target portions 13 corresponding to the electron emission elements 15 are arranged side by side in the hollow chamber 11. In order to form multiple x-ray beams , it is necessary to extract from the vacuum chamber 11 separately the generated x-rays radiating the transmission type target 13 with an electron beam, and the x-ray beam χ generated by an adjacent electron beam without mixing. them.

For this reason, the X-ray shield plate 23 in the vacuum chamber and the multiple transmission target portion 13 are integrated into a single structure. The X-ray extraction portions 24 provided on the X-ray shield plate 23 are arranged in positions corresponding to the electron beams and, in order to extract the X-ray beams, each extending an angle of divergence, necessary to from the target portion of the transmission 13.

Since the transmission type target portion 13 formed of a thin metal foil generally has low heat dissipation, it is difficult to apply large energy. The transmission-like target portion 13 in this embodiment is, however, covered by the thick X-ray shield plate 23, except for the areas from which the X-ray beams are extracted by irradiation with the electron beams and , and the transmission-type target portion13 and X-ray shield plate 23 are in mechanical and thermal contact with one another. For this reason, the X-ray shield plate 23 has a function of dissipating the heat generated by the heat-conducting target portion 13.

This makes it possible to form an array of a plurality of transmission-type target portions 13 to which much larger energy than that applied to a conventional transmission-type target portion can be applied. In addition, the use of thick X-ray shield plate 23 can improve surface accuracy and therefore manufacture a multiple X-ray source with uniform X-ray emission characteristics.

As shown in Fig. 8, the transmission-type target portion 13 comprises an X-ray generating layer 131 and an X-ray generating support layer 132, and has excellent functionality with a high efficiency of X-ray generation. X-ray shield plate 23 is provided in the support layer for X-ray generation 132. X-ray generating layer 131 is made of a heavy metal with a film thickness of approximately several IOnm to several µπι to reduce the X-ray absorption when the X-ray beams are transmitted through the target transmission type portion 13. The support layer for X-ray generation 132 uses a substrate made of a light element to support the thin film layer of the layer. X-ray generator 131 and to also reduce the intensity attenuation by absorbing the X-ray beams by improving the cooling efficiency of the heated X-ray 131 generator layer by applying the electron beams.

It has generally been found that for the conventional X-ray generation support layer 132, beryllium metal is effective as a substrate material. However, in this embodiment, an Al, AlN, or SiC film having a thickness of approximately 0.5 mm to several mm or a combination thereof was used. This is because this material has high thermal conductivity and an excellent X-ray transmission characteristic, effectively absorbs x-ray beams x-ray defects, which are in a low energy region and contributes little to the quality of a transmission image. x-rays by 50% or less, and has a filter function to change the radiation quality of x-ray beams.

Referring to Fig. 7, the divergence angles of the X-ray beams are determined by the opening conditions of the X-ray extraction portions 24 arranged in the vacuum chamber 11. In some cases, the divergence angles of the beams need to be adjusted. X-ray image depending on imaging conditions. Referring to Fig. 9, in order to meet this requirement, this apparatus includes two shielding means. This is, in addition to the X-ray shield plate 23 in the vacuum chamber, a 41 X-ray shielding plate is provided outside the housing. vacuum chamber 11. Since it is easy to replace the shield plate 41 provided in the atmosphere, a divergence angle can be arbitrarily selected for the X-ray beam χ according to the irradiation conditions for an object.

The following condition is necessary to prevent X-ray beams from adjacent X-ray sources from escaping by providing X-ray shield plate 23 in the vacuum chamber. The X-ray shielding plate 41 outside the vacuum chamber 11 That is, the x-ray shielding plates 23 and 41 and the x-ray extraction portions 24 need to be adjusted to maintain the ratio of d> 2D-tan α where d is the distance between the x-ray beams, D is the distance between the target transmission portion 13e and the X-ray shield plate 41, and α is the radiation angle of the x-ray beam exiting the X-ray shield plate 23.

When the high-energy electron beam reaches the transmission-type target portion 13, not only the reflected electrons, but also X-rays are scattered in the direction of reflection. These X-rays and electron beams are considered to cause X-ray escape from high-voltage X-ray and fine-discharge sources.

Fig. 10 shows a countermeasure for this problem. An X-ray / reflected electron beam shield plate 43 having incident electron beam holes 42 is provided on the electron-emitting element side 15 of the transmission-type target portion 13. The electron beams and emitted by the electron-emitting element 15 pass through the incident electron beam holes 42 of the reflected electron beam / X-ray shield plate 43 and reach the transmission-type target portion 13. With this structure, the X-ray shield / electron beam array 43 can block X-rays, reflected electrons, and secondary electrons generated on the electron source side of the surface of the target transmission portion 13.

When x-ray beams are formed by irradiation of the transmission-type target portion 13 with the high-energy electron beams and, the density of the x-ray beams is not limited by the packing density of the electron emission elements 15. This density It is determined by the X-ray shield plates 23 and 41 to extract the separate X-ray beams χ from multiple X-ray sources generated by the transmission-type target portion 13.

Table 1 shows the effects of heavy metal shielding (Ta, W and PB) against 50keV, 62keV and 82keV X-ray beams, assuming the X-ray beam energies χ generated when transmitting target type 13 it is irradiated with electron beams and de100keV.

Table 1 Shielding Material Thickness

<table> table see original document page 13 </column> </row> <table>

As a shielding criterion between the X-ray beams generated by the transmission-type target portion 13, an attenuation factor of 1/100 is an appropriate value as an amount that does not influence X-ray images. Of course, a heavy metal plate having a thickness of 5 to 10 mm is required as a shield plate to achieve this dampening factor.

When this scheme is applied to a multiple X-ray source body using the electron beams and about 10000V, it is appropriate to establish thicknesses D1 and D2 of the X-ray shield plate / reflected electron beam 43 and shielding plate. x-rays 23 shown in fig. 11 to 5 to 1 Omm. In addition, forming the X-ray extraction portions of the X-ray shield plate 23 in a tapered window void makes it possible to improve the shielding effect.

[Second embodiment]

Fig. 12 is a view showing the arrangement of the second embodiment, which is the structure of a multiple X-ray source body 10 'comprising a transmission type target portion 13. This structure comprises an electron beam generating unit 12' and a 20 'electrode anode comprising the transmission-type target portion 13 and a 43' reflected electron beam / X-ray shielding plate including 42 'incident electron beam holes and 24' X-ray extraction portions in an 11 'vacuum chamber .

In the 12 'electron beam generating unit, electron beams emitted by the electron emitting elements 15 pass through a lens electrode and are accelerated to high energy. The accelerated electron beams pass through the incident electron beam holes 42 'of the reflected electron beam / X-ray shield plate 43' and are applied to the transmission type target portion 13 '. The X-rays generated by the transmission type target portion 13 'are extracted as x-ray beams χ from the X-ray extraction portions 24' of the X-ray shielding plate / electron reflected beam 43 '. A plurality of x-ray beams χ form multiple x-ray beams. The 43 'reflected electron beam / X-ray shielding plate can greatly suppress the scattering of high voltage discharged reflected electrons.

As in the arrangement shown in fig. 9, in which the radiation angles of the X-ray beams are adjusted by using the X-ray shielding plate 23 in the vacuum chamber Il and the X-ray shielding plate 41 outside the vacuum chamber 11, in the arrangement shown in FIG. . 12, the radiation angles of the x-ray beams can be adjusted by using the x-ray shield plate 41 outside the vacuum chamber 11.

The second embodiment exemplified an application of the present invention to the reflection-like target portion 13 'with a planar structure. However, the present invention may also be applied to a multiple X-ray source body in which the electron beam generating unit 12 is present. ', the anode electrode 20', and the reflection-like target portion are arranged in an arcuate shape. For example, placing the reflection-like target portion 13 'in an arcuate shape, centered on an object and providing the x-ray shield plates 23 and 41, can greatly reduce the region of the x2 x-ray shield in the prior art shown in fig. . Note that the arrangement can also be applied to the transmission type target portion 13 in the same manner.

As described above, the second embodiment can extract the independent X-ray beam χ which has a high S / N ratio with very few scattered X-rays or escape X-rays from the X-rays generated by the reflection-like target portion irradiation. 13 'with the electron beam e. The use of this x-ray beam can therefore perform X-ray imaging with high contrast and high image quality.

[Third embodiment]

Fig. 13 shows an arrangement view of a multiple X-ray imaging apparatus. This imaging device has a multiple X-ray intensity measuring unit 52 including a typically transmission X-ray detector 51 which is placed in front of the multiple X-ray source body 10 shown in FIG. . This apparatus also has an X-ray detector 53 placed through an object (not shown). Multiple X-ray intensity measuring unit 52 and X-ray detector 53 are connected to a control unit 56 via detection signal processing units 54 and 55, respectively. In addition, the control unit output 56 is connected to an activation signal unit 17 via an electron emission element activation circuit 57. Outputs from the control unit 56 are respectively connected to the high voltage input portion 21 and 22 of a lens electrode 20 via high voltage control units 58 and 59.

As in the first embodiment, the multiple X-ray source body 10 generates a plurality of X-ray beams by radiating a transmission-like target portion 13 with a plurality of electron defects and extracted from an electron beam generating unit12. . The plurality of generated x-ray beam χ is extracted as multiple x-ray beams toward the multiple x-ray intensity measuring unit 52 in the atmosphere via x-ray extraction windows 27 provided on a wall portion 25. Multiple x-ray beams (the plurality of x-ray defects) are collided with an object after being transmitted via the transmission-type x-ray detector 51 of the multiple x-ray intensity measuring unit 52. Multi-transmitted X-rays through the object are detected by the X-ray detector 53, thus obtaining an image of X-ray transmission of the object.

In the electron emission elements 15 arranged on an orderly arrangement of elements 16, slight variations in the voltage-current characteristics occur between the electron emission elements 15. The variations in the emission current lead to variations in the intensity distribution of multiple X-ray beams. , resulting in contrast irregularity at the time of X-ray imaging. Therefore, it is necessary to standardize emission currents in the electron emission elements 15.

The transmission type X-ray detector 51 of the multiple X-ray intensity measuring unit 52 is a detector using a semiconductor. Transmission-type X-ray detector 51 absorbs multiple X-ray defective parts and converts them to electrical signals. The switch control circuit 54 then converts the electrical signals obtained into digital data. The control unit stores the digital data as the intensity data of the plurality of x-rays.

The control unit 56 stores correction data for the electron emission element 15 that corresponds to the current-return characteristics of the electron emission elements 15 in fig. 6, determines the adjusted correction voltage values for the electron emission elements 15 by comparing the correction data with the multiple X-ray beam detection intensity data. Activating voltages activating Sl and S2 signals obtained by the activation signal unit 17 controlled by the electron emission element activation circuit 57 are corrected by the use of these correction voltages. This makes it possible to uniformize emission currents in the electron emission elements 15 and to uniformize the intensities of the X-ray beams in the multiple X-ray beams.

The X-ray intensity correction method using the transmission type X-ray detector 51 can measure an X-ray intensity regardless of an object and thus can correct the intensities of the X-ray beams in real time during X-ray imaging.

Regardless of the above correction method, it is also possible to correct the intensities of multiple x-ray beams by using the x-ray detector 53 for imaging. The X-ray detector 53 uses a two-dimensional X-ray detector as a solid state CCD imaging or an image using silicon amorphous, and can measure the intensity distributions of the respective X-ray beams.

In order to correct the intensities of the X-ray beams by using the X-ray detector 53, simply extract the electron beam and activate the single electron-emitting element 15 and synchronously detect the intensity of the generated X-ray beam. by using the X-ray detector 53. In this case, it is possible to effectively measure the intensity distributions of multiple X-ray beams with an X-ray detector detection signal 53 for imaging. This sensing signal is converted to a digital signal by the X-ray sensing signal processing unit 55. The signal is then stored in the control unit 56.

This operation is performed for all electron emission elements 15. The resulting data is then stored as intensity distribution data of all multiple X-ray beams in control unit 56. At the same time, correction values for activation Returns to the electron emission elements 15 are determined by part or all of the intensity distributions of multiple x-ray beams.

At the time of object X-ray imaging, the multiple electron emission element activation circuit 57 activates the electron emission elements 15 according to the correction values for activation voltages. Performing this series of operations with approximately periodic calibration can even out the intensities of the x-ray beams.

The above description exemplified the case in which the electron-emitting elements 15 are individually activated to measure X-ray intensities. However, it is possible to accelerate measurement by simultaneous X-ray beam radiation of a plurality of portions over the X-ray detector 53 over which X-ray beams are not superimposed.

Additionally this method of correction has the intensity distribution of each X-ray beam as given and thus can be used to correct irregularity in the x-ray beams.

The X-ray imaging apparatus using the multiple X-ray source body 10 of this embodiment may implement a planar X-ray source with an object size by arranging the X-ray beams χ in the manner above and, thus, the size of the apparatus may be reduced by placing the multiple x-ray source body 10 near the x-ray detector 53. In addition, as described above, for x-ray beams, x-ray irradiation intensities and radiation regions may be arbitrarily selected by designating activation conditions for the electron emission element activation circuit 57 and regions of the element to be activated.

Additionally, the multiple X-ray imaging apparatus may select the radiation angles of the X-ray beams by changing the X-ray shield plate 41 provided outside the hollow chamber 11 shown in FIG. 9. Therefore, the optimal X-ray beam χ can be obtained according to imaging conditions as the distance between the multiple X-ray source body 10 and an object and a resolution.

The present invention is not limited to the above embodiments and various changes and modifications may be made within the spirit and scope of the present invention. Accordingly, to inform the public about the scope of the present invention the following claims have been made.

This application claims priority for the Japanese provisional patent application 2006-57.846 filed March 3, 2006 and Japanese patent application 2007-50.942 filed March 1, 2007, the full contents of which are incorporated herein by reference.

Claims (16)

1. Multiple X-ray generator, characterized in that it comprises a plurality of electron-emitting elements, accelerating means for accelerating electron beams emitted by the plurality of electron-emitting elements, and a target portion that is irradiated with the electron beams. wherein said target portion is matched with the electron beams, said target portion comprises X-ray shielding means, and X-rays generated from said target portion are extracted as multiple X-ray beams into the atmosphere. Multiple X-ray generator according to claim 1, characterized in that the voltage control is performed on said electron emission elements comprising cold cathode electron sources based on an X-ray beam irradiation condition for allow on / off control over each x-ray beam by forming multiple x-ray beams. Multiple X-ray generator according to Claim 1, characterized in that said X-ray shielding means includes two shielding means, one of which is configured to be replaced in the atmosphere. Multiple X-ray generator according to Claim 1, characterized in that said X-ray shielding means comprises said target portion comprising a dissipater function generated on said target portion. Multiple X-ray generator according to Claim 1, characterized in that another shielding means for suppressing scattered X-rays and reflected electron beams is coupled to said target portion, and said other shielding means comprises an incident hole for an electron beam. Multiple X-ray generator according to Claim 3, characterized in that said target portion and said two shielding means are arranged in an arcuate shape centered over a position in which an object is to be placed. Multiple X-ray generator according to any one of claims 1 to 6, characterized in that said target portion comprises a transmission type target portion. Multiple X-ray generator according to Claim 7, characterized in that said transmission-type target portion comprises an X-ray generating layer comprising a metal weight and an X-ray generating support layer comprising a light element. with a good X-ray transmission feature. Multiple X-ray generator according to Claim 8, characterized in that said X-ray generating support layer includes a filter function of changing a radiation quality of the X-rays generated by the ray generating layer. -X, and comprise a material with high thermal conductivity. Multiple X-ray generator according to Claim 8 or 9, characterized in that the X-ray generating backing layer uses a substrate comprising one of Al, AlN, and SiC or a combination thereof. Multiple X-ray generator according to any one of Claims 1 to 6, characterized in that said target portion comprises a reflection-like target portion. Multiple X-ray generator according to any one of Claims 1 to 11, characterized in that a distance d between the multiple X-ray beams has a ratio of d> 2d * tan a, where D is a distance from said portion. target up to an extraction position for multiple X-ray beam extraction into the atmosphere and α is an angle of radiation of an X-ray beam from said X-ray shielding means. Multiple X-ray generator according to any one of Claims 1 to 12, characterized in that the intensities of the multiple X-ray beams are controlled by activation voltages for multiple electron emission elements based on the correction data. 14. Multiple X-ray generator according to Claim 13, characterized in that the correction data are obtained by measurement using a transmission-type multiple X-ray intensity measuring unit corresponding to the multiple X-ray beams. 15. Multiple x-ray generator according to claim 13, characterized in that the correction data is obtained by measurement by synchronizing a generation signal for each of the multiple x-ray beams with a detection signal of a x-ray detector. X image shaping. Multiple X-ray imaging apparatus using a multiple X-ray generator as defined in one of claims 1 to 15, characterized in that it detects, images and diagnoses an X-ray transmission image of the X-ray beams. Obtained by the irradiation of an object with multiple x-ray beams.