BRPI0713949A8 - Módulo eletrônico configurado para contenção de panes e sistema incluindo o mesmo - Google Patents

Módulo eletrônico configurado para contenção de panes e sistema incluindo o mesmo

Info

Publication number
BRPI0713949A8
BRPI0713949A8 BRPI0713949A BRPI0713949A BRPI0713949A8 BR PI0713949 A8 BRPI0713949 A8 BR PI0713949A8 BR PI0713949 A BRPI0713949 A BR PI0713949A BR PI0713949 A BRPI0713949 A BR PI0713949A BR PI0713949 A8 BRPI0713949 A8 BR PI0713949A8
Authority
BR
Brazil
Prior art keywords
chassis
electronic module
system including
same
module configured
Prior art date
Application number
BRPI0713949A
Other languages
English (en)
Inventor
Kunkle Jonathan
Original Assignee
Siemens Ag
Siemens Energy & Automation Inc
Siemens Industry Inc
Siemens Building Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Siemens Energy & Automation Inc, Siemens Industry Inc, Siemens Building Tech Inc filed Critical Siemens Ag
Publication of BRPI0713949A2 publication Critical patent/BRPI0713949A2/pt
Publication of BRPI0713949A8 publication Critical patent/BRPI0713949A8/pt
Publication of BRPI0713949B1 publication Critical patent/BRPI0713949B1/pt

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209Heat transfer by conduction from internal heat source to heat radiating structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

MÓDULO ELETRÔNICO CONFIGURADO PARA CONTENÇÃO DE PANES E SISTEMA INCLUINDO O MESMO. A presente invenção refere-se a um módulo eletrônico. O módulo eletrônico inclui um chassi, uma pluralidade de capacitores e um dissipador de calor. O chassi inclui uma primeira extremidade e uma segunda extremidade. A primeira extremidade é oposta à segunda extremidade. O chassi também inclui um primeiro lado, um segundo lado, um terceiro lado, e um quarto lado. O segundo lado é oposto ao primeiro lado. O terceiro lado é conectado a pelo menos um dos primeiro e segundo lados. O quarto lado é conectado a pelo menos um dos primeiro e segundo lados, e é oposto ao terceiro lado. O chassi é fabricado de um material que detém a passagem de resíduos de componentes através dos lados do chassi. Os capacitores são posicionados dentro do chassi. O dissipador de calor é posicionado entre os capacitores e a segunda extremidade.
BRPI0713949A 2006-06-30 2007-06-29 módulo eletrônico configurado para contenção de panes e sistema incluindo o mesmo BRPI0713949B1 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US81808106P 2006-06-30 2006-06-30
US60/818,081 2006-06-30
US11/769,891 US7869211B2 (en) 2006-06-30 2007-06-28 Electronic module configured for failure containment and system including same
US11/769,891 2007-06-28
PCT/US2007/015201 WO2008005374A2 (en) 2006-06-30 2007-06-29 Electronic module configured for failure containment and system including same

Publications (3)

Publication Number Publication Date
BRPI0713949A2 BRPI0713949A2 (pt) 2012-12-04
BRPI0713949A8 true BRPI0713949A8 (pt) 2017-03-07
BRPI0713949B1 BRPI0713949B1 (pt) 2019-01-02

Family

ID=38895155

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0713949A BRPI0713949B1 (pt) 2006-06-30 2007-06-29 módulo eletrônico configurado para contenção de panes e sistema incluindo o mesmo

Country Status (8)

Country Link
US (1) US7869211B2 (pt)
EP (1) EP2036418B8 (pt)
JP (1) JP5279706B2 (pt)
CN (1) CN101491168B (pt)
BR (1) BRPI0713949B1 (pt)
CA (1) CA2656201C (pt)
MX (1) MX2009000041A (pt)
WO (1) WO2008005374A2 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD702670S1 (en) * 2009-03-26 2014-04-15 Tait Towers Manufacturing, LLC Video screen frame
ES2375332T3 (es) * 2009-09-18 2012-02-28 Sma Solar Technology Ag Inversor con una carcasa.
US20110140686A1 (en) * 2009-12-16 2011-06-16 Lineage Power Corporation Thermal extension structures for monitoring bus bar terminations
FR2973640B1 (fr) * 2011-04-04 2013-04-05 Schneider Toshiba Inverter Europe Sas Variateur de vitesse a architecture optimisee
USD676029S1 (en) 2012-06-15 2013-02-12 Peerless Industries, Inc. System for mounting audio/visual devices or the like from an overhead structure
US10483251B1 (en) 2018-11-09 2019-11-19 Chongqing Jinkang New Energy Vehicle Co., Ltd. Power module for drivetrain of an electric vehicle

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* Cited by examiner, † Cited by third party
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US3415583A (en) * 1966-07-18 1968-12-10 Myron J. Zucker Capacitor mounting case
US4027206A (en) * 1975-01-27 1977-05-31 L. H. Research Electronic cooling chassis
KR920005988B1 (ko) 1988-08-31 1992-07-25 가부시기가이샤 히다찌세이사꾸쇼 인버터장치
JPH0484496A (ja) * 1990-07-27 1992-03-17 Nippon Light Metal Co Ltd 電子機器用筺体
US5335143A (en) * 1993-08-05 1994-08-02 International Business Machines Corporation Disk augmented heat transfer system
US5625545A (en) * 1994-03-01 1997-04-29 Halmar Robicon Group Medium voltage PWM drive and method
US5680294A (en) * 1995-03-28 1997-10-21 The Whitaker Corporation Pluggable power supply for card cage
JPH099409A (ja) * 1995-06-21 1997-01-10 Toshiba Corp 車両用電力変換器ユニット
US5648892A (en) * 1995-09-29 1997-07-15 Allen-Bradley Company, Inc. Wireless circuit board system for a motor controller
US6046921A (en) * 1996-08-27 2000-04-04 Tracewell; Larry L. Modular power supply
US5831847A (en) * 1997-02-05 1998-11-03 Jerome Industries Corp. Power supply with separated airflows
JP3237609B2 (ja) * 1998-05-11 2001-12-10 株式会社日立製作所 インバータ装置
JP3569451B2 (ja) * 1998-09-07 2004-09-22 株式会社Pfu 放熱装置を備える電子機器
US6081423A (en) * 1998-12-22 2000-06-27 The Esab Group, Inc. Power supply with obliquely impinging airflow
JP4388174B2 (ja) * 1999-09-06 2009-12-24 株式会社ソニー・コンピュータエンタテインメント 電子機器
JP2001168240A (ja) * 1999-10-08 2001-06-22 Trw Inc 集積型マイクロエレクトロニクスモジュール
JP3814475B2 (ja) * 2000-09-26 2006-08-30 株式会社日立国際電気 増幅器
DE10143547B4 (de) 2001-09-06 2005-03-10 Rexroth Indramat Gmbh Aktiv außengekühltes Gehäuse mit zumindest einem wärmeverlustleistungserzeugenden Elektronikbaustein
US6889752B2 (en) * 2002-07-11 2005-05-10 Avaya Technology Corp. Systems and methods for weatherproof cabinets with multiple compartment cooling
JP4360123B2 (ja) * 2003-05-27 2009-11-11 三菱電機株式会社 電力変換装置
TWI260484B (en) * 2003-08-12 2006-08-21 Asustek Comp Inc Heat sink for power device on computer motherboard
US7019996B2 (en) * 2003-10-16 2006-03-28 Ballard Power Systems Corporation Power converter employing a planar transformer
JP4207755B2 (ja) * 2003-11-07 2009-01-14 株式会社豊田自動織機 電子機器装置
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JP2005348533A (ja) * 2004-06-03 2005-12-15 Fuji Electric Fa Components & Systems Co Ltd インバータ装置
JP4411147B2 (ja) * 2004-06-24 2010-02-10 株式会社日立製作所 ファン付きヒートシンク
US7595976B2 (en) * 2004-10-21 2009-09-29 Mitsubishi Denki Kabushiki Kaisha Outdoor apparatus
TWI259522B (en) * 2005-08-02 2006-08-01 Quanta Comp Inc Electronic device
US7554804B2 (en) * 2006-06-30 2009-06-30 Siemens Energy & Automation, Inc. Electronic module configured for air flow therethrough and system including same

Also Published As

Publication number Publication date
WO2008005374A2 (en) 2008-01-10
JP5279706B2 (ja) 2013-09-04
BRPI0713949B1 (pt) 2019-01-02
US20090016018A1 (en) 2009-01-15
MX2009000041A (es) 2009-03-06
CN101491168A (zh) 2009-07-22
US7869211B2 (en) 2011-01-11
CA2656201C (en) 2015-03-24
CA2656201A1 (en) 2008-01-10
JP2009543343A (ja) 2009-12-03
EP2036418A2 (en) 2009-03-18
BRPI0713949A2 (pt) 2012-12-04
WO2008005374A3 (en) 2008-09-18
CN101491168B (zh) 2011-08-24
EP2036418B8 (en) 2015-06-10
EP2036418B1 (en) 2015-04-29

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: SIEMENS BUILDING TECHNOLOGIES, INC. (US)

B25D Requested change of name of applicant approved

Owner name: SIEMENS INDUSTRY INC. (US)

B25A Requested transfer of rights approved

Owner name: SIEMENS AKTIENGESELLSCHAFT (DE)

B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 10 (DEZ) ANOS CONTADOS A PARTIR DE 02/01/2019, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 14A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2626 DE 04-05-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.