BRPI0716178A2 - eletrodos estreitamente espaÇados com uma folga uniforme. - Google Patents

eletrodos estreitamente espaÇados com uma folga uniforme.

Info

Publication number
BRPI0716178A2
BRPI0716178A2 BRPI0716178-6A2A BRPI0716178A BRPI0716178A2 BR PI0716178 A2 BRPI0716178 A2 BR PI0716178A2 BR PI0716178 A BRPI0716178 A BR PI0716178A BR PI0716178 A2 BRPI0716178 A2 BR PI0716178A2
Authority
BR
Brazil
Prior art keywords
spaced electrodes
narrowly spaced
uniform clearance
clearance
uniform
Prior art date
Application number
BRPI0716178-6A2A
Other languages
English (en)
Inventor
Tarek Makansi
Original Assignee
Tempronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tempronics Inc filed Critical Tempronics Inc
Publication of BRPI0716178A2 publication Critical patent/BRPI0716178A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N15/00—Thermoelectric devices without a junction of dissimilar materials; Thermomagnetic devices, e.g. using the Nernst-Ettingshausen effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J1/00—Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
    • H01J1/88—Mounting, supporting, spacing, or insulating of electrodes or of electrode assemblies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J19/00—Details of vacuum tubes of the types covered by group H01J21/00
    • H01J19/42—Mounting, supporting, spacing, or insulating of electrodes or of electrode assemblies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/003—Details of machines, plants or systems, using electric or magnetic effects by using thermionic electron cooling effects
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Photovoltaic Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
BRPI0716178-6A2A 2006-08-30 2007-08-28 eletrodos estreitamente espaÇados com uma folga uniforme. BRPI0716178A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US84126206P 2006-08-30 2006-08-30
US92508307P 2007-04-18 2007-04-18
PCT/US2007/077042 WO2008027928A2 (en) 2006-08-30 2007-08-28 Closely spaced electrodes with a uniform gap

Publications (1)

Publication Number Publication Date
BRPI0716178A2 true BRPI0716178A2 (pt) 2013-09-24

Family

ID=39136817

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0716178-6A2A BRPI0716178A2 (pt) 2006-08-30 2007-08-28 eletrodos estreitamente espaÇados com uma folga uniforme.

Country Status (6)

Country Link
US (2) US8102096B2 (pt)
EP (1) EP2057659A4 (pt)
JP (1) JP2010503219A (pt)
KR (1) KR20090047500A (pt)
BR (1) BRPI0716178A2 (pt)
WO (1) WO2008027928A2 (pt)

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US20090205695A1 (en) * 2008-02-15 2009-08-20 Tempronics, Inc. Energy Conversion Device
CN103398494B (zh) * 2008-03-05 2017-03-01 史泰克公司 冷却系统和操作热电冷却系统的方法
CN101978517A (zh) * 2008-03-19 2011-02-16 史泰克公司 金属芯热电冷却和动力产生装置
KR101328353B1 (ko) * 2009-02-17 2013-11-11 (주)엘지하우시스 탄소나노튜브 발열시트
US8313443B2 (en) * 2009-03-09 2012-11-20 Tom Michael D Tensiometer utilizing elastic conductors
CN104990436B (zh) 2009-07-17 2018-07-10 史泰克公司 热电冷却装置
WO2011014508A1 (en) * 2009-07-27 2011-02-03 The Penn State Research Foundation Refrigeration devices based on polar-popymers
DE102010008995A1 (de) 2010-02-24 2011-08-25 Siemens Aktiengesellschaft, 80333 Gleichspannungs-Hochspannungsquelle und Teilchenbeschleuniger
US8999123B2 (en) 2010-04-12 2015-04-07 The Charles Stark Draper Laboratory, Inc. Alkali-metal generator and absorber
US8969703B2 (en) 2010-09-13 2015-03-03 Tempronics, Inc. Distributed thermoelectric string and insulating panel
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US9289616B2 (en) * 2010-12-15 2016-03-22 Advanced Bionics Ag Particulate toughened ceramic feedthrough
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WO2013059239A1 (en) * 2011-10-20 2013-04-25 Sheetak, Inc. Improved thermoelectric energy converters and manufacturing method thereof
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US9638442B2 (en) 2012-08-07 2017-05-02 Tempronics, Inc. Medical, topper, pet wireless, and automated manufacturing of distributed thermoelectric heating and cooling
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US9096419B2 (en) * 2012-10-01 2015-08-04 Qualcomm Mems Technologies, Inc. Electromechanical systems device with protrusions to provide additional stable states
JP6150249B2 (ja) * 2013-02-25 2017-06-21 京セラ株式会社 電子デバイスのガラス封止方法
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US9893261B1 (en) * 2017-04-10 2018-02-13 Face International Corporation Structurally embedded and inhospitable environment systems and devices having autonomous electrical power sources
US10128439B1 (en) * 2017-06-30 2018-11-13 California Institute Of Technology Reprogrammable phononic metasurfaces
KR102484900B1 (ko) 2017-12-21 2023-01-04 현대자동차주식회사 금속 공기 배터리
US10497227B2 (en) 2018-04-17 2019-12-03 California Institute Of Technology Haptic devices using structured metasurfaces
JP6598339B1 (ja) * 2019-04-17 2019-10-30 株式会社Ｇｃｅインスティチュート 発電素子、発電装置、電子機器、及び発電素子の製造方法
US11251723B2 (en) 2019-05-10 2022-02-15 The Regents Of The University Of Colorado, A Body Corporate Systems for driving the generation of products using quantum vacuum fluctuations
US11133758B2 (en) 2019-05-10 2021-09-28 The Regents Of The University Of Colorado, A Body Corporate Quantum vacuum fluctuation devices
US11258379B2 (en) 2019-05-10 2022-02-22 The Regents Of The University Of Colorado, A Body Corporate Quantum noise power devices
US11463026B2 (en) 2019-05-10 2022-10-04 The Regents Of The University Of Colorado, A Body Corporate Quantum plasmon fluctuation devices
KR102131051B1 (ko) 2019-06-03 2020-07-07 성균관대학교산학협력단 자기력을 이용한 금속 재료 간의 천이액상접합 방법
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Also Published As

Publication number Publication date
WO2008027928A3 (en) 2008-11-13
US8102096B2 (en) 2012-01-24
KR20090047500A (ko) 2009-05-12
WO2008027928A2 (en) 2008-03-06
US20090322221A1 (en) 2009-12-31
JP2010503219A (ja) 2010-01-28
EP2057659A4 (en) 2010-11-24
EP2057659A2 (en) 2009-05-13
US20120146455A1 (en) 2012-06-14

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Legal Events

Date Code Title Description
B08L Patent application lapsed because of non payment of annual fee [chapter 8.12 patent gazette]

Free format text: REFERENTE AO NAO RECOLHIMENTO DAS 6A E 7A ANUIDADES.

B08I Publication cancelled [chapter 8.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 8.12 NA RPI NO 2277 DE 26/08/2014 POR TER SIDO INDEVIDA.

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 6A, 7A, 8A, 9A, 10A, 11A, 12A E 13A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2602 DE 17-11-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.