BRPI0719765A8 - Dispositivo - Google Patents
DispositivoInfo
- Publication number
- BRPI0719765A8 BRPI0719765A8 BRPI0719765A BRPI0719765A BRPI0719765A8 BR PI0719765 A8 BRPI0719765 A8 BR PI0719765A8 BR PI0719765 A BRPI0719765 A BR PI0719765A BR PI0719765 A BRPI0719765 A BR PI0719765A BR PI0719765 A8 BRPI0719765 A8 BR PI0719765A8
- Authority
- BR
- Brazil
- Prior art keywords
- region
- light
- emitting
- current
- structure corresponding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
- H10H20/8162—Current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/821—Bodies characterised by their shape, e.g. curved or truncated substrates of the light-emitting regions, e.g. non-planar junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/832—Electrodes characterised by their material
- H10H20/835—Reflective materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures
Landscapes
- Led Devices (AREA)
Abstract
DISPOSITIVO Um dispositivo emissor de luz inclui uma estrutura com uma região emissora de luz disposta entre uma região tipo n e uma região tipo p. Uma pluralidade de furos na estrutura, que forma um cristal fotônico, são formados em uma primeira região da estrutura correspondente a uma primeira porção da região emissora de luz. Uma segunda região da estrutura correspondente a uma segunda porção da região emissora de luz é livre de furos. O dispositivo é configurado de modo que, quando pressionado à rente, corrente seja injetada na segunda região e a primeira região seja substancialmente de corrente.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/537940 | 2006-10-02 | ||
| US11/537,940 US7697584B2 (en) | 2006-10-02 | 2006-10-02 | Light emitting device including arrayed emitters defined by a photonic crystal |
| PCT/IB2007/053937 WO2008041161A2 (en) | 2006-10-02 | 2007-09-27 | Light emitting device including arrayed emitters defined by a photonic crystal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BRPI0719765A2 BRPI0719765A2 (pt) | 2014-01-28 |
| BRPI0719765A8 true BRPI0719765A8 (pt) | 2015-10-06 |
Family
ID=39156124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0719765A BRPI0719765A8 (pt) | 2006-10-02 | 2007-09-27 | Dispositivo |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7697584B2 (pt) |
| EP (1) | EP2074669B1 (pt) |
| JP (1) | JP5237286B2 (pt) |
| CN (1) | CN101523623B (pt) |
| BR (1) | BRPI0719765A8 (pt) |
| TW (1) | TWI453942B (pt) |
| WO (1) | WO2008041161A2 (pt) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008038852B4 (de) | 2008-06-03 | 2024-02-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement |
| DE102008030584A1 (de) | 2008-06-27 | 2009-12-31 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement |
| US7919780B2 (en) * | 2008-08-05 | 2011-04-05 | Dicon Fiberoptics, Inc. | System for high efficiency solid-state light emissions and method of manufacture |
| US20100123386A1 (en) | 2008-11-13 | 2010-05-20 | Maven Optronics Corp. | Phosphor-Coated Light Extraction Structures for Phosphor-Converted Light Emitting Devices |
| KR101064016B1 (ko) * | 2008-11-26 | 2011-09-08 | 엘지이노텍 주식회사 | 발광 소자 및 그 제조방법 |
| EP2317542B1 (en) | 2009-10-30 | 2018-05-23 | IMEC vzw | Semiconductor device and method of manufacturing thereof |
| KR20120034910A (ko) * | 2010-10-04 | 2012-04-13 | 삼성엘이디 주식회사 | 반도체 발광소자 및 이의 제조방법 |
| CN102468418B (zh) * | 2010-11-18 | 2015-04-29 | 展晶科技(深圳)有限公司 | 垂直结构发光二极管芯片及其制造方法 |
| JP5822543B2 (ja) * | 2011-06-06 | 2015-11-24 | キヤノン株式会社 | 発光素子 |
| EP2733752B1 (en) | 2011-07-12 | 2016-10-05 | Marubun Corporation | Light emitting element and method for manufacturing the same |
| TWI563686B (en) * | 2012-12-21 | 2016-12-21 | Hon Hai Prec Ind Co Ltd | Led chip and method manufacturing the same |
| US10866343B2 (en) * | 2013-04-17 | 2020-12-15 | Japan Science And Technology Agency | Photonic crystal and optical functional device including the same |
| CN105283968A (zh) | 2013-07-17 | 2016-01-27 | 丸文株式会社 | 半导体发光元件及其制造方法 |
| JP5757512B1 (ja) * | 2014-03-06 | 2015-07-29 | 丸文株式会社 | 深紫外led及びその製造方法 |
| JP5999800B1 (ja) * | 2015-01-16 | 2016-09-28 | 丸文株式会社 | 深紫外led及びその製造方法 |
| US10680134B2 (en) | 2015-09-03 | 2020-06-09 | Marubun Corporation | Deep ultraviolet LED and method for manufacturing the same |
| EP3249701B1 (en) | 2016-03-30 | 2020-07-08 | Marubun Corporation | Deep ultraviolet led and production method therefor |
| CN106505076B (zh) * | 2016-11-09 | 2018-07-31 | 太原理工大学 | 微米阵列led制备方法 |
| FR3059828B1 (fr) * | 2016-12-02 | 2019-05-31 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif optoelectronique a diode electroluminescente a extraction augmentee |
| WO2018187571A1 (en) * | 2017-04-05 | 2018-10-11 | Vixar | Novel patterning of vcsels for displays, sensing, and imaging |
| US11309454B2 (en) | 2018-01-26 | 2022-04-19 | Marubun Corporation | Deep ultraviolet LED and method for producing the same |
| CN109841714B (zh) * | 2019-01-09 | 2020-12-11 | 南京邮电大学 | 垂直结构近紫外发光二极管及其制备方法 |
| CN109994578B (zh) | 2019-01-09 | 2020-12-11 | 南京邮电大学 | 垂直结构蓝光发光二极管及其制备方法 |
| JP2021150373A (ja) * | 2020-03-17 | 2021-09-27 | セイコーエプソン株式会社 | 発光装置、プロジェクター、およびディスプレイ |
| DE102021214311A1 (de) | 2021-12-14 | 2023-06-15 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenemittierender photonischer-kristall-laser, optoelektronisches system und verfahren zur herstellung eines oberflächenemittierenden photonischer-kristall-lasers |
| DE102022101575A1 (de) | 2022-01-24 | 2023-07-27 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur herstellung einer vielzahl optoelektronischer halbleiterchips und optoelektronischer halbleiterchip |
| US20250047063A1 (en) * | 2022-02-08 | 2025-02-06 | Ams-Osram International Gmbh | Laser diode component |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7279718B2 (en) * | 2002-01-28 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | LED including photonic crystal structure |
| US7083993B2 (en) * | 2003-04-15 | 2006-08-01 | Luminus Devices, Inc. | Methods of making multi-layer light emitting devices |
| US7098589B2 (en) * | 2003-04-15 | 2006-08-29 | Luminus Devices, Inc. | Light emitting devices with high light collimation |
| US6831302B2 (en) | 2003-04-15 | 2004-12-14 | Luminus Devices, Inc. | Light emitting devices with improved extraction efficiency |
| US7012279B2 (en) | 2003-10-21 | 2006-03-14 | Lumileds Lighting U.S., Llc | Photonic crystal light emitting device |
| US20050152417A1 (en) | 2004-01-08 | 2005-07-14 | Chung-Hsiang Lin | Light emitting device with an omnidirectional photonic crystal |
| US20050173714A1 (en) | 2004-02-06 | 2005-08-11 | Ho-Shang Lee | Lighting system with high and improved extraction efficiency |
| WO2006005062A2 (en) * | 2004-06-30 | 2006-01-12 | Cree, Inc. | Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices |
| US7442964B2 (en) | 2004-08-04 | 2008-10-28 | Philips Lumileds Lighting Company, Llc | Photonic crystal light emitting device with multiple lattices |
| JP4594814B2 (ja) * | 2004-10-25 | 2010-12-08 | 株式会社リコー | フォトニック結晶レーザ、フォトニック結晶レーザの製造方法、面発光レーザアレイ、光伝送システム、及び書き込みシステム |
| JP2006179573A (ja) * | 2004-12-21 | 2006-07-06 | Sumitomo Electric Ind Ltd | 半導体レーザ素子およびその製造方法 |
| US7285791B2 (en) * | 2006-03-24 | 2007-10-23 | Goldeneye, Inc. | Wavelength conversion chip for use in solid-state lighting and method for making same |
-
2006
- 2006-10-02 US US11/537,940 patent/US7697584B2/en active Active
-
2007
- 2007-09-27 CN CN200780036900XA patent/CN101523623B/zh active Active
- 2007-09-27 WO PCT/IB2007/053937 patent/WO2008041161A2/en not_active Ceased
- 2007-09-27 BR BRPI0719765A patent/BRPI0719765A8/pt not_active Application Discontinuation
- 2007-09-27 EP EP07826571.7A patent/EP2074669B1/en active Active
- 2007-09-27 JP JP2009529840A patent/JP5237286B2/ja active Active
- 2007-10-01 TW TW096136803A patent/TWI453942B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2008041161A3 (en) | 2008-07-03 |
| TWI453942B (zh) | 2014-09-21 |
| JP5237286B2 (ja) | 2013-07-17 |
| CN101523623A (zh) | 2009-09-02 |
| EP2074669B1 (en) | 2017-11-15 |
| CN101523623B (zh) | 2011-09-07 |
| JP2010506382A (ja) | 2010-02-25 |
| WO2008041161A2 (en) | 2008-04-10 |
| TW200836372A (en) | 2008-09-01 |
| US7697584B2 (en) | 2010-04-13 |
| US20080080581A1 (en) | 2008-04-03 |
| EP2074669A2 (en) | 2009-07-01 |
| BRPI0719765A2 (pt) | 2014-01-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B25D | Requested change of name of applicant approved |
Owner name: PHILIPS LUMILEDS LIGHTING COMPANY, LLC (US) , KONI |
|
| B25G | Requested change of headquarter approved |
Owner name: PHILIPS LUMILEDS LIGHTING COMPANY, LLC (US) , KONI |
|
| B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] | ||
| B06A | Patent application procedure suspended [chapter 6.1 patent gazette] | ||
| B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements |