BRPI0719890A2 - Painel de circuito impresso e métodos de preparar e de montar um painel de circuito impresso - Google Patents

Painel de circuito impresso e métodos de preparar e de montar um painel de circuito impresso

Info

Publication number
BRPI0719890A2
BRPI0719890A2 BRPI0719890-6A2A BRPI0719890A BRPI0719890A2 BR PI0719890 A2 BRPI0719890 A2 BR PI0719890A2 BR PI0719890 A BRPI0719890 A BR PI0719890A BR PI0719890 A2 BRPI0719890 A2 BR PI0719890A2
Authority
BR
Brazil
Prior art keywords
printed circuit
circuit panel
assembling
preparing
methods
Prior art date
Application number
BRPI0719890-6A2A
Other languages
English (en)
Inventor
Paul Palfreyman
Lawrence Schmeikal
Original Assignee
Tir Technology Lp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tir Technology Lp filed Critical Tir Technology Lp
Publication of BRPI0719890A2 publication Critical patent/BRPI0719890A2/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
BRPI0719890-6A2A 2006-10-10 2007-10-10 Painel de circuito impresso e métodos de preparar e de montar um painel de circuito impresso BRPI0719890A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US85092006P 2006-10-10 2006-10-10
PCT/CA2007/001773 WO2008046188A1 (en) 2006-10-10 2007-10-10 Circuit board with regional flexibility

Publications (1)

Publication Number Publication Date
BRPI0719890A2 true BRPI0719890A2 (pt) 2014-05-06

Family

ID=39313540

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0719890-6A2A BRPI0719890A2 (pt) 2006-10-10 2007-10-10 Painel de circuito impresso e métodos de preparar e de montar um painel de circuito impresso

Country Status (8)

Country Link
US (1) US20080105455A1 (pt)
EP (1) EP2084949A1 (pt)
JP (1) JP2010506409A (pt)
KR (1) KR20090078819A (pt)
CN (1) CN101524001A (pt)
BR (1) BRPI0719890A2 (pt)
RU (1) RU2009117638A (pt)
WO (1) WO2008046188A1 (pt)

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* Cited by examiner, † Cited by third party
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BRPI0718221A2 (pt) * 2006-10-31 2013-11-12 Tir Technology Lp Fonte luminosa, e, pacote de elemento emissor de luz
US8330236B2 (en) * 2008-06-20 2012-12-11 Garmin Switzerland Gmbh Isolation channel improving measurement accuracy of MEMS devices
DE102008002546A1 (de) * 2008-06-20 2009-12-24 Robert Bosch Gmbh Anordnung zur Stressentkopplung bei einem Substrat mit einem Chip
EP2211217B1 (en) 2009-01-21 2016-01-13 Harman Becker Automotive Systems GmbH Printed circuit board fiberoptical transceiver in surface mount technology (SMT)
US8766099B2 (en) * 2009-09-29 2014-07-01 Apple Inc. Component mounting structures for electronic devices
US8258987B2 (en) * 2009-12-15 2012-09-04 Whirlpool Corporation Icon illumination for capacitive touch switch
CN102348338A (zh) * 2010-07-30 2012-02-08 竞陆电子(昆山)有限公司 六层线路板对位压合后的防曝板透气孔结构
DE102010039277A1 (de) * 2010-08-12 2012-02-16 Endress + Hauser Gmbh + Co. Kg Leiterplatte und elektronisches Gerät mit einer solchen Leiterplatte
CN102036462B (zh) * 2010-08-31 2013-09-18 北大方正集团有限公司 印刷电路板及其保护方法
DE102010041369A1 (de) * 2010-09-24 2012-03-29 Manfred Herrler Verdrahtungselement, Leistungsverteiler und Fahrzeugbatterie
WO2012171565A1 (de) * 2011-06-16 2012-12-20 Siemens Aktiengesellschaft Elektrische kontakteinrichtung zur verbindung von leiterplatten
DE102011089693A1 (de) * 2011-12-22 2013-06-27 Continental Automotive Gmbh Bedienvorrichtung
JP5867234B2 (ja) * 2012-03-29 2016-02-24 株式会社デンソーウェーブ 工場設備の高電力監視装置用基板
JP2013239470A (ja) * 2012-05-11 2013-11-28 Fuji Electric Fa Components & Systems Co Ltd 表面実装基板
JP2014027033A (ja) * 2012-07-25 2014-02-06 Japan Display Inc 回路基板及びこれを用いた表示装置
US20140168913A1 (en) * 2012-12-18 2014-06-19 Enphase Energy, Inc. Method and apparatus for reducing stress on mounted electronic devices
DE202013100760U1 (de) * 2013-02-20 2014-05-22 Eugster/Frismag Ag Kaffeemaschine
JP6081258B2 (ja) * 2013-03-27 2017-02-15 日本電産サンキョー株式会社 実装基板
KR102065442B1 (ko) * 2013-07-16 2020-01-13 삼성전자주식회사 인쇄회로기판 조립체
US10373995B2 (en) * 2014-09-19 2019-08-06 Microsoft Technology Licensing, Llc Image sensor bending using tension
US9818682B2 (en) 2014-12-03 2017-11-14 International Business Machines Corporation Laminate substrates having radial cut metallic planes
US10304900B2 (en) 2015-04-02 2019-05-28 Microsoft Technology Licensing, Llc Bending semiconductor chip in molds having radially varying curvature
DE102016003988A1 (de) * 2015-04-10 2016-10-13 Marquardt Gmbh Baugruppe
US10746358B1 (en) 2016-03-02 2020-08-18 Cooledge Lighting Inc. Lighting systems incorporating connections for signal and power transmission
US11274823B1 (en) 2016-03-02 2022-03-15 Cooledge Lighting, Inc. Lighting systems incorporating connections for signal and power transmission
US10344954B1 (en) 2016-03-02 2019-07-09 Cooledge Lighting Inc. Lighting systems incorporating connections for signal and power transmission
DE102016117795A1 (de) * 2016-09-21 2018-03-22 Endress+Hauser Conducta Gmbh+Co. Kg Feldgerät der Prozessautomatisierungstechnik
FR3056704B1 (fr) * 2016-09-28 2020-05-29 Valeo Vision Dispositif d'eclairage et/ou de signalisation de vehicule automobile comprenant un substrat rigide courbe
US20190313527A1 (en) * 2016-10-10 2019-10-10 Hewlett- Packard Development Company, L.P. Boards with pliable regions
JP6791719B2 (ja) * 2016-10-26 2020-11-25 京セラ株式会社 電子部品搭載用基板、電子装置および電子モジュール
EP3349549A1 (en) * 2017-01-11 2018-07-18 Itron Global SARL Solderless joint arrangement
WO2018173103A1 (ja) * 2017-03-21 2018-09-27 三菱電機株式会社 プリント基板
DE102017218026A1 (de) * 2017-10-10 2019-04-11 Zf Friedrichshafen Ag Sensorträger und Sensorbaugruppe
US10880995B2 (en) * 2017-12-15 2020-12-29 2449049 Ontario Inc. Printed circuit board with stress relief zones for component and solder joint protection
CN108282958B (zh) * 2018-03-12 2024-05-14 深圳市文鼎创数据科技有限公司 一种fpcb板、智能卡及其封装方法
JP2019207964A (ja) * 2018-05-30 2019-12-05 トヨタ自動車株式会社 回路基板
DE102018123992A1 (de) * 2018-09-28 2020-04-02 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Leiterplattenvorrichtung und Verfahren zum Herstellen einer Leiterplattenvorrichtung
CN109830517B (zh) * 2019-02-26 2021-01-22 京东方科技集团股份有限公司 显示基板、显示面板、显示装置及显示基板的制备方法
US11483422B2 (en) * 2019-06-28 2022-10-25 Samsung Electro-Mechanics Co., Ltd. Printed circuit board and electronic device comprising the same
US11508669B2 (en) 2019-08-30 2022-11-22 Nxp B.V. Method and apparatus for improved circuit structure thermal reliability on printed circuit board materials
EP4123274B1 (en) * 2021-07-19 2025-06-04 TE Connectivity Sensors France Sensor with printed circuit board based contact
WO2025204920A1 (ja) * 2024-03-29 2025-10-02 ソニーグループ株式会社 センサ基板
EP4697865A1 (de) * 2024-08-14 2026-02-18 Siemens Aktiengesellschaft Leiterplatte mit mindestens einem darauf gelöteten bauelement

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JPS6390890A (ja) * 1986-10-03 1988-04-21 株式会社　潤工社 プリント基板
US4990948A (en) * 1986-12-27 1991-02-05 Canon Kabushiki Kaisha Flexible printed circuit board
US4866683A (en) * 1988-05-24 1989-09-12 Honeywell, Inc. Integrated acoustic receiver or projector
JPH06310839A (ja) * 1993-04-27 1994-11-04 Matsushita Electric Ind Co Ltd フレキシブル印刷回路板への電子部品の実装方法
US6465743B1 (en) * 1994-12-05 2002-10-15 Motorola, Inc. Multi-strand substrate for ball-grid array assemblies and method
US5652185A (en) * 1995-04-07 1997-07-29 National Semiconductor Corporation Maximized substrate design for grid array based assemblies
DE10323296A1 (de) * 2003-05-21 2005-01-05 Infineon Technologies Ag Anordnung zur Stress-Reduzierung bei substratbasierten Chip-Packages

Also Published As

Publication number Publication date
RU2009117638A (ru) 2010-11-20
WO2008046188A1 (en) 2008-04-24
EP2084949A1 (en) 2009-08-05
KR20090078819A (ko) 2009-07-20
CN101524001A (zh) 2009-09-02
JP2010506409A (ja) 2010-02-25
US20080105455A1 (en) 2008-05-08

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Legal Events

Date Code Title Description
B25A Requested transfer of rights approved

Owner name: KONINKLIJKE PHILIPS ELECTRONICS N.V (NL)

B08L Patent application lapsed because of non payment of annual fee [chapter 8.12 patent gazette]

Free format text: REFERENTE AO NAO RECOLHIMENTO DAS 3A, 4A, 5A, 6A E 7A ANUIDADES.

B08I Publication cancelled [chapter 8.9 patent gazette]

Free format text: ANULADA A PUBLICACAO CODIGO 8.12 NA RPI NO 2277 DE 26/08/2014 POR TER SIDO INDEVIDA.

B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE AS 3A, 4A, 5A, 6A, 7A, 8A, 9A, 10A, 11A, 12A E 13A ANUIDADES.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2602 DE 17-11-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.