BRPI0721666A2 - Processo para preparação de um compósito moldado reforçado - Google Patents

Processo para preparação de um compósito moldado reforçado

Info

Publication number
BRPI0721666A2
BRPI0721666A2 BRPI0721666-1A2A BRPI0721666A BRPI0721666A2 BR PI0721666 A2 BRPI0721666 A2 BR PI0721666A2 BR PI0721666 A BRPI0721666 A BR PI0721666A BR PI0721666 A2 BRPI0721666 A2 BR PI0721666A2
Authority
BR
Brazil
Prior art keywords
preparing
molded composite
enhanced
enhanced molded
composite
Prior art date
Application number
BRPI0721666-1A2A
Other languages
English (en)
Inventor
Alain Fanget
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0721666A2 publication Critical patent/BRPI0721666A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5026—Amines cycloaliphatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C08G59/623—Aminophenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
BRPI0721666-1A2A 2007-06-15 2007-10-24 Processo para preparação de um compósito moldado reforçado BRPI0721666A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93475607P 2007-06-15 2007-06-15
PCT/US2007/022541 WO2008153542A1 (en) 2007-06-15 2007-10-24 Process for preparing composites using epoxy resin compositions

Publications (1)

Publication Number Publication Date
BRPI0721666A2 true BRPI0721666A2 (pt) 2014-03-18

Family

ID=39155631

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0721666-1A2A BRPI0721666A2 (pt) 2007-06-15 2007-10-24 Processo para preparação de um compósito moldado reforçado

Country Status (10)

Country Link
US (1) US20080308972A1 (pt)
EP (1) EP2162481A1 (pt)
JP (1) JP5576789B2 (pt)
KR (1) KR101442304B1 (pt)
CN (1) CN101679610B (pt)
BR (1) BRPI0721666A2 (pt)
CA (1) CA2690781A1 (pt)
MX (1) MX2009013786A (pt)
RU (1) RU2010101112A (pt)
WO (1) WO2008153542A1 (pt)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5486891B2 (ja) * 2009-10-08 2014-05-07 三菱レイヨン株式会社 連鎖硬化性樹脂組成物および繊維強化複合材料
US9017580B2 (en) * 2009-11-24 2015-04-28 The Director General, Defence Research & Development Organisation (Drdo) Fiber reinforced polymeric composites with tailorable electrical resistivities and process for preparing the same
AU2010343130B2 (en) * 2009-12-29 2013-12-05 Saint-Gobain Abrasifs Smear-free nonwoven composite abrasives
TWI557100B (zh) 2010-05-21 2016-11-11 藍色立方體有限責任公司 用於可熱固樹脂組成物之硬化劑
WO2012177392A1 (en) * 2011-06-24 2012-12-27 Dow Global Technolgies Llc Thermosetting composition and process for preparing fiber-reinforced composites
KR101969083B1 (ko) 2011-06-30 2019-04-15 다우 글로벌 테크놀로지스 엘엘씨 아민 경화제와 과량의 에폭사이드기의 혼합물을 함유하는 경화성 에폭시 수지 시스템
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
WO2014078218A1 (en) * 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
WO2014078219A1 (en) * 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetraamines for resin transfer molding processes
EP2803687A1 (de) * 2013-05-13 2014-11-19 Basf Se Epoxidharzzusammensetzung für Faser-Matrix-Halbzeuge
GB2514189B (en) * 2013-05-17 2018-11-14 Gurit Uk Ltd Carbon fibre-containing prepregs
JP6641283B2 (ja) * 2014-02-07 2020-02-05 ダウ グローバル テクノロジーズ エルエルシー 速硬化性で高ガラス転移温度のエポキシ樹脂系
MX2016011858A (es) 2014-03-28 2016-12-02 Huntsman Advanced Mat Licensing (Switzerland) Gmbh Un procedimiento para la preparacion de un articulo de material compuesto con fibra reforzada, los articulos compuestos obtenidos y el uso de los mismos.
KR20170091638A (ko) * 2014-12-03 2017-08-09 다우 글로벌 테크놀로지스 엘엘씨 경화성 에폭시 수지 조성물 및 이를 위한 경화제
US10279519B2 (en) 2015-12-30 2019-05-07 The United States Of America, As Represented By The Secretary Of The Navy Mold assembly and method of molding a component
RU2652251C1 (ru) * 2017-08-14 2018-04-25 Акционерное общество "Научно-исследовательский институт полимерных материалов" Эпоксидный состав для исправления дефектов технологической оснастки
AU2019316496A1 (en) * 2018-08-02 2021-02-18 Axis Innovation Pty Ltd Heat generating compositions
CN111331762B (zh) * 2020-02-24 2021-12-28 沈阳中航迈瑞特工业有限公司 一种环氧树脂胶泥模具的制备工艺
CN111793193A (zh) * 2020-08-14 2020-10-20 黑龙江省科学院石油化学研究院 一种无溶剂型耐温180℃超低黏度环氧树脂基体及其制备方法
EP4102308B1 (fr) * 2021-06-08 2025-02-19 The Swatch Group Research and Development Ltd Procédé de fabrication d'un composant horloger luminescent

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BE635220A (pt) * 1962-07-24
CH481963A (de) * 1967-06-08 1969-11-30 Ciba Geigy Neue härtbare Mischungen aus Diepoxydverbindungen, disekundären Aminen sowie mindestens 3 Aminwasserstoffatome enthaltenden Polyaminen
CA1205250A (en) * 1981-12-14 1986-05-27 Harold E. De La Mare Heat-curable epoxy compositions and their use in preparing formed articles
US4397998A (en) * 1981-12-14 1983-08-09 Shell Oil Company Curable epoxy compositions suitable for use in RIM processes
DE3326532A1 (de) * 1983-07-22 1985-01-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von epoxidharzformstoffen
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
US4798761A (en) * 1987-11-03 1989-01-17 The Dow Chemical Company Epoxy resin compositions for use in low temperature curing applications
US4946925A (en) * 1989-01-25 1990-08-07 Air Products And Chemicals, Inc. Bridge bis(cyclohexylamine) curing agents for epoxy resins
US5066764A (en) * 1990-06-26 1991-11-19 Air Products And Chemicals, Inc. Sterically hindered ditertiary butyl bridged di(cyclohexylamines)
US5280091A (en) * 1992-02-07 1994-01-18 Air Products And Chemicals, Inc. Epoxy resins cured with mixed methylene bridged poly(cyclohexyl-aromatic)amine curing agents
GB9326427D0 (en) * 1993-12-24 1994-02-23 Dow Deutschland Inc Kinetically controlled in-situ generation of catalytic species for the curing of epoxy/amine compositions
BR9507026A (pt) * 1994-03-11 1997-09-23 Raychem Corp Composição polimérica curável e uso na proteção de um substrato
US5414067A (en) * 1994-05-25 1995-05-09 Air Products And Chemicals, Inc. Process for reducing cure time in cycloaliphatic amine based epoxy resins
US6410127B1 (en) * 1999-03-11 2002-06-25 Toray Industries, Inc. Epoxy resin compositions, epoxy resin compositions for fiber-reinforced composite materials, and fiber-reinforced composite materials comprising the same
EP1266921B1 (en) * 2000-05-30 2004-07-28 Toray Industries, Inc. Epoxy resin composition for fiber-reinforced composite material
JP2002187936A (ja) * 2000-12-19 2002-07-05 Toray Ind Inc エポキシ樹脂部材の製造方法
US7001938B2 (en) * 2003-01-27 2006-02-21 Resolution Performance Products Llc Epoxy resin curing compositions and resin compositions including same
US7008555B2 (en) * 2003-05-22 2006-03-07 Applied Poleramic Inc. Epoxy resin curing agents and epoxy resin compositions
US7592067B2 (en) * 2003-09-22 2009-09-22 Hexion Specialty Chemicals, Inc. Epoxy resin compositions, processes utilizing same and articles made therefrom
FR2861721B1 (fr) * 2003-11-05 2006-01-27 Saint Gobain Isover Composition d'encollage pour produit isolant a base de laine minerale et produits resultants
US20060135710A1 (en) * 2004-12-17 2006-06-22 Resolution Performance Products Llc Epoxy resin compositions, methods of preparing and articles made therefrom
CN100532490C (zh) * 2005-08-05 2009-08-26 比亚迪股份有限公司 封装材料及其制备方法
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof

Also Published As

Publication number Publication date
WO2008153542A1 (en) 2008-12-18
EP2162481A1 (en) 2010-03-17
JP5576789B2 (ja) 2014-08-20
CN101679610A (zh) 2010-03-24
MX2009013786A (es) 2010-03-01
KR20100044174A (ko) 2010-04-29
CA2690781A1 (en) 2008-12-18
CN101679610B (zh) 2012-11-21
US20080308972A1 (en) 2008-12-18
JP2010530022A (ja) 2010-09-02
RU2010101112A (ru) 2011-07-20
KR101442304B1 (ko) 2014-09-22

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 3A ANUIDADE.

B08G Application fees: restoration [chapter 8.7 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]