BRPI0721666A2 - Processo para preparação de um compósito moldado reforçado - Google Patents

Processo para preparação de um compósito moldado reforçado

Info

Publication number
BRPI0721666A2
BRPI0721666A2 BRPI0721666-1A2A BRPI0721666A BRPI0721666A2 BR PI0721666 A2 BRPI0721666 A2 BR PI0721666A2 BR PI0721666 A BRPI0721666 A BR PI0721666A BR PI0721666 A2 BRPI0721666 A2 BR PI0721666A2
Authority
BR
Brazil
Prior art keywords
preparing
molded composite
enhanced
enhanced molded
composite
Prior art date
Application number
BRPI0721666-1A2A
Other languages
English (en)
Inventor
Alain Fanget
Original Assignee
Dow Global Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Inc filed Critical Dow Global Technologies Inc
Publication of BRPI0721666A2 publication Critical patent/BRPI0721666A2/pt

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5026Amines cycloaliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • C08G59/623Aminophenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BRPI0721666-1A2A 2007-06-15 2007-10-24 Processo para preparação de um compósito moldado reforçado BRPI0721666A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US93475607P 2007-06-15 2007-06-15
PCT/US2007/022541 WO2008153542A1 (en) 2007-06-15 2007-10-24 Process for preparing composites using epoxy resin compositions

Publications (1)

Publication Number Publication Date
BRPI0721666A2 true BRPI0721666A2 (pt) 2014-03-18

Family

ID=39155631

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0721666-1A2A BRPI0721666A2 (pt) 2007-06-15 2007-10-24 Processo para preparação de um compósito moldado reforçado

Country Status (10)

Country Link
US (1) US20080308972A1 (pt)
EP (1) EP2162481A1 (pt)
JP (1) JP5576789B2 (pt)
KR (1) KR101442304B1 (pt)
CN (1) CN101679610B (pt)
BR (1) BRPI0721666A2 (pt)
CA (1) CA2690781A1 (pt)
MX (1) MX2009013786A (pt)
RU (1) RU2010101112A (pt)
WO (1) WO2008153542A1 (pt)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5486891B2 (ja) 2009-10-08 2014-05-07 三菱レイヨン株式会社 連鎖硬化性樹脂組成物および繊維強化複合材料
WO2011064707A2 (en) * 2009-11-24 2011-06-03 The Director General, Defence Research & Development Organisation (Drdo) Fiber reinforced polymeric composites with tailorable electrical resistivities and process for preparing the same
PT2519598T (pt) * 2009-12-29 2019-07-04 Saint Gobain Abrasives Inc Abrasivos compósitos não tecidos livres de manchas
US8865917B2 (en) 2010-05-21 2014-10-21 Dow Global Technologies Llc Hardeners for thermosettable resin compositions
KR20140045954A (ko) * 2011-06-24 2014-04-17 다우 글로벌 테크놀로지스 엘엘씨 열경화성 조성물 및 섬유-보강된 복합체를 제조하는 방법
WO2013003202A1 (en) 2011-06-30 2013-01-03 Dow Global Technologies Llc Curable epoxy resin systems containing mixtures of amine hardeners and an excess of epoxide groups
WO2014062407A2 (en) 2012-10-19 2014-04-24 Dow Global Technologies Llc Anhydride-cured epoxy resin systems containing divinylarene dioxides
WO2014078218A1 (en) * 2012-11-13 2014-05-22 Dow Global Technologies Llc Epoxy resin system containing polyethylene tetramines and triethylene diamine catalyst for resin transfer molding processes
KR102131211B1 (ko) * 2012-11-13 2020-07-08 다우 글로벌 테크놀로지스 엘엘씨 수지 이송 성형 공정을 위한 폴리에틸렌 테트라아민을 함유하는 에폭시 수지 시스템
EP2803687A1 (de) * 2013-05-13 2014-11-19 Basf Se Epoxidharzzusammensetzung für Faser-Matrix-Halbzeuge
GB2514189B (en) * 2013-05-17 2018-11-14 Gurit Uk Ltd Carbon fibre-containing prepregs
WO2015119881A1 (en) * 2014-02-07 2015-08-13 Dow Global Technologies Llc Fast curing high glass transition temperature epoxy resin system
KR20160140605A (ko) * 2014-03-28 2016-12-07 훈츠만 어드밴스트 머티리얼스 라이센싱 (스위처랜드) 게엠베하 섬유 강화된 에폭시 복합 물품의 제조 방법, 얻어진 복합 물품 및 그의 용도
US20170267809A1 (en) * 2014-12-03 2017-09-21 Dow Global Technologies Llc A curable epoxy resin composition and a curative therefor
US10279519B2 (en) 2015-12-30 2019-05-07 The United States Of America, As Represented By The Secretary Of The Navy Mold assembly and method of molding a component
RU2652251C1 (ru) * 2017-08-14 2018-04-25 Акционерное общество "Научно-исследовательский институт полимерных материалов" Эпоксидный состав для исправления дефектов технологической оснастки
EP3830198A4 (en) * 2018-08-02 2021-11-03 Axis Innovation Pty Ltd HEAT GENERATING COMPOSITIONS
CN111331762B (zh) * 2020-02-24 2021-12-28 沈阳中航迈瑞特工业有限公司 一种环氧树脂胶泥模具的制备工艺
CN111793193A (zh) * 2020-08-14 2020-10-20 黑龙江省科学院石油化学研究院 一种无溶剂型耐温180℃超低黏度环氧树脂基体及其制备方法
EP4102308B1 (fr) * 2021-06-08 2025-02-19 The Swatch Group Research and Development Ltd Procédé de fabrication d'un composant horloger luminescent

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NL295590A (pt) * 1962-07-24
CH481963A (de) * 1967-06-08 1969-11-30 Ciba Geigy Neue härtbare Mischungen aus Diepoxydverbindungen, disekundären Aminen sowie mindestens 3 Aminwasserstoffatome enthaltenden Polyaminen
CA1205250A (en) * 1981-12-14 1986-05-27 Harold E. De La Mare Heat-curable epoxy compositions and their use in preparing formed articles
US4397998A (en) * 1981-12-14 1983-08-09 Shell Oil Company Curable epoxy compositions suitable for use in RIM processes
DE3326532A1 (de) * 1983-07-22 1985-01-31 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von epoxidharzformstoffen
GB8519290D0 (en) * 1985-07-31 1985-09-04 Dow Chemical Rheinwerk Gmbh Resin composition
US4798761A (en) * 1987-11-03 1989-01-17 The Dow Chemical Company Epoxy resin compositions for use in low temperature curing applications
US4946925A (en) * 1989-01-25 1990-08-07 Air Products And Chemicals, Inc. Bridge bis(cyclohexylamine) curing agents for epoxy resins
US5066764A (en) * 1990-06-26 1991-11-19 Air Products And Chemicals, Inc. Sterically hindered ditertiary butyl bridged di(cyclohexylamines)
US5280091A (en) * 1992-02-07 1994-01-18 Air Products And Chemicals, Inc. Epoxy resins cured with mixed methylene bridged poly(cyclohexyl-aromatic)amine curing agents
GB9326427D0 (en) * 1993-12-24 1994-02-23 Dow Deutschland Inc Kinetically controlled in-situ generation of catalytic species for the curing of epoxy/amine compositions
PL179652B1 (pl) * 1994-03-11 2000-10-31 Raychem Corp Utwardzalna polimerowa kompozycja podkladowa PL PL
US5414067A (en) * 1994-05-25 1995-05-09 Air Products And Chemicals, Inc. Process for reducing cure time in cycloaliphatic amine based epoxy resins
JP4719976B2 (ja) * 1999-03-11 2011-07-06 東レ株式会社 エポキシ樹脂組成物及び繊維強化複合材料用エポキシ樹脂組成物並びにそれを有してなる繊維強化複合材料
JP4972851B2 (ja) * 2000-05-30 2012-07-11 東レ株式会社 繊維強化複合材料用エポキシ樹脂組成物
JP2002187936A (ja) * 2000-12-19 2002-07-05 Toray Ind Inc エポキシ樹脂部材の製造方法
US7001938B2 (en) * 2003-01-27 2006-02-21 Resolution Performance Products Llc Epoxy resin curing compositions and resin compositions including same
US7008555B2 (en) * 2003-05-22 2006-03-07 Applied Poleramic Inc. Epoxy resin curing agents and epoxy resin compositions
US7592067B2 (en) * 2003-09-22 2009-09-22 Hexion Specialty Chemicals, Inc. Epoxy resin compositions, processes utilizing same and articles made therefrom
FR2861721B1 (fr) * 2003-11-05 2006-01-27 Saint Gobain Isover Composition d'encollage pour produit isolant a base de laine minerale et produits resultants
US20060135710A1 (en) * 2004-12-17 2006-06-22 Resolution Performance Products Llc Epoxy resin compositions, methods of preparing and articles made therefrom
CN100532490C (zh) * 2005-08-05 2009-08-26 比亚迪股份有限公司 封装材料及其制备方法
US20070293603A1 (en) * 2006-06-19 2007-12-20 Ashland Licensing And Intellectual Property Llc Epoxy adhesive composition and use thereof

Also Published As

Publication number Publication date
JP2010530022A (ja) 2010-09-02
CA2690781A1 (en) 2008-12-18
KR101442304B1 (ko) 2014-09-22
EP2162481A1 (en) 2010-03-17
US20080308972A1 (en) 2008-12-18
KR20100044174A (ko) 2010-04-29
RU2010101112A (ru) 2011-07-20
JP5576789B2 (ja) 2014-08-20
CN101679610A (zh) 2010-03-24
MX2009013786A (es) 2010-03-01
CN101679610B (zh) 2012-11-21
WO2008153542A1 (en) 2008-12-18

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 3A ANUIDADE.

B08G Application fees: restoration [chapter 8.7 patent gazette]
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]